Advanced Electronic Packaging: Global Strategic Business Report

Report
78 Pages
April 2024
Region: Global
Global Industry Analysts, Inc
ID: 338485

Global Advanced Electronic Packaging Market to Reach $13.2 Billion by 2030

The global market for Advanced Electronic Packaging estimated at US$6.8 Billion in the year 2022, is projected to reach a revised size of US$13.2 Billion by 2030, growing at a CAGR of 8.8% over the analysis period 2022-2030. Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is projected to record 8.1% CAGR and reach US$7.5 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Through Silicon Via (TSV) Packaging segment is readjusted to a revised 9.7% CAGR for the next 8-year period.

The U.S. Market is Estimated at $1.8 Billion, While China is Forecast to Grow at 12.3% CAGR

The Advanced Electronic Packaging market in the U.S. is estimated at US$1.8 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$3 Billion by the year 2030 trailing a CAGR of 12.3% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5% and 7% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 6.2% CAGR.

Select Competitors (Total 38 Featured) -

Amkor Technology, Inc.
Analog Devices, Inc.
ASE Technology Holding, Co., Ltd.
Fujitsu Ltd.
Hitachi Ltd.
Ibiden Co., Ltd.
Infineon Technologies AG
Intel Corporation
Micron Technology, Inc.
Microsemi Corporation
Molex LLC
NXP Semiconductors NV
Orient Semiconductor Electronics Ltd.
Samsung Electronics Co., Ltd.
Semiconductor Manufacturing International Corporation (SMIC)
Semtech Corporation
STATS ChipPAC Pte., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
Texas Instruments, Inc.
Thomas & Betts Corporation
Toshiba America Electronic Components, Inc.
TSI Group Ltd.

What's New?

Special coverage on Russia-Ukraine war; global inflation; easing of zero-Covid policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
Global competitiveness and key competitor percentage market shares
Market presence across multiple geographies - Strong/Active/Niche/Trivial
Online interactive peer-to-peer collaborative bespoke updates
Access to digital archives and Research Platform
Complimentary updates for one year

I. METHODOLOGYII. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Influencer Market Insights
World Market Trajectories
Advanced Electronic Packaging - Global Key Competitors Percentage Market Share in 2022 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

Table 1: World Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 2: World 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2023 & 2030
Table 3: World Recent Past, Current & Future Analysis for Wafer-Level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 4: World 8-Year Perspective for Wafer-Level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
Table 5: World Recent Past, Current & Future Analysis for Through Silicon via (Tsv) Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 6: World 8-Year Perspective for Through Silicon via (Tsv) Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2023 & 2030
Table 7: World Advanced Electronic Packaging Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030

III. MARKET ANALYSIS

UNITED STATES

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
Table 8: USA Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 9: USA 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

CANADA

Table 10: Canada Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 11: Canada 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

JAPAN

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
Table 12: Japan Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 13: Japan 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

CHINA

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
Table 14: China Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 15: China 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

EUROPE

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
Table 16: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 17: Europe 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2023 & 2030
Table 18: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 19: Europe 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

FRANCE

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
Table 20: France Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 21: France 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

GERMANY

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
Table 22: Germany Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 23: Germany 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

ITALY

Table 24: Italy Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 25: Italy 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

UNITED KINGDOM

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
Table 26: UK Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 27: UK 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

SPAIN

Table 28: Spain Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 29: Spain 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

RUSSIA

Table 30: Russia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 31: Russia 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

REST OF EUROPE

Table 32: Rest of Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 33: Rest of Europe 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

ASIA-PACIFIC

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
Table 34: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 35: Asia-Pacific 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2023 & 2030
Table 36: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 37: Asia-Pacific 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

AUSTRALIA

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2023 (E)
Table 38: Australia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 39: Australia 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

INDIA

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2023 (E)
Table 40: India Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 41: India 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

SOUTH KOREA

Table 42: South Korea Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 43: South Korea 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

REST OF ASIA-PACIFIC

Table 44: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 45: Rest of Asia-Pacific 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

LATIN AMERICA

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2023 (E)
Table 46: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 47: Latin America 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2023 & 2030
Table 48: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 49: Latin America 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

ARGENTINA

Table 50: Argentina Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 51: Argentina 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

BRAZIL

Table 52: Brazil Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 53: Brazil 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

MEXICO

Table 54: Mexico Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 55: Mexico 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

REST OF LATIN AMERICA

Table 56: Rest of Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 57: Rest of Latin America 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

MIDDLE EAST

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2023 (E)
Table 58: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
Table 59: Middle East 8-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2023 & 2030
Table 60: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 61: Middle East 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

IRAN

Table 62: Iran Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 63: Iran 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

ISRAEL

Table 64: Israel Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 65: Israel 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

SAUDI ARABIA

Table 66: Saudi Arabia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 67: Saudi Arabia 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

UNITED ARAB EMIRATES

Table 68: UAE Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 69: UAE 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

REST OF MIDDLE EAST

Table 70: Rest of Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 71: Rest of Middle East 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

AFRICA

Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2023 (E)
Table 72: Africa Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
Table 73: Africa 8-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2023 & 2030

IV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

Amkor Technology, Inc.
Analog Devices, Inc.
ASE Technology Holding, Co., Ltd.
Fujitsu Ltd.
Hitachi Ltd.
Ibiden Co., Ltd.
Infineon Technologies AG
Intel Corporation
Micron Technology, Inc.
Microsemi Corporation
Molex LLC
NXP Semiconductors NV
Orient Semiconductor Electronics Ltd.
Samsung Electronics Co., Ltd.
Semiconductor Manufacturing International Corporation (SMIC)
Semtech Corporation
STATS ChipPAC Pte., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
Texas Instruments, Inc.
Thomas & Betts Corporation
Toshiba America Electronic Components, Inc.
TSI Group Ltd.

Table Information

Report Attribute	Details
No. of Pages	78
Published	April 2024
Forecast Period	2022 - 2030
Estimated Market Value ( USD ) in 2022	$ 6.8 Billion
Forecasted Market Value ( USD ) by 2030	$ 13.2 Billion
Compound Annual Growth Rate	8.6%
Regions Covered	Global

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Global Advanced Electronic Packaging Market to Reach $13.2 Billion by 2030

The U.S. Market is Estimated at $1.8 Billion, While China is Forecast to Grow at 12.3% CAGR

Select Competitors (Total 38 Featured) -

What's New?

Table of Contents

Companies Mentioned (Partial List)

Table Information

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