• 1-800-526-8630U.S. (TOLL FREE)
  • 1-917-300-0470EAST COAST U.S.
  • +353-1-416-8900REST OF WORLD
Worldwide Leading IC Suppliers' 3G IC Solution Strategies Product Image

Worldwide Leading IC Suppliers' 3G IC Solution Strategies

  • ID: 349272
  • August 2006
  • Region: Global
  • 32 Pages
  • Market Intelligence & Consulting Institute (MIC)

With UMTS mobile phones taking off in recent years, 3G chip suppliers have adopted various strategies to develop this increasingly important market. Besides TI and Qualcomm, other chip suppliers such as EMP, Freescale, Infineon, Philips, and Agere are also starting to emerge as important players in the 3G chip market. As construction of 3G systems is gradually completed, chip makers' development in products and technology has become an increasingly important issue. This report will examine the 3G chip solutions offered by the leading suppliers.

List of Figures & Tables
Figure 1 2G and 3G Technology Development Timeline
Figure 2 3G Mobile Phone Key IC Component Cost Structure
Figure 3 3G Mobile Phone Baseband IC Integration Process
Figure 4 Qualcomm MSM IC Development Timeline
Figure 5 Qualcomm MSM6245 Chipset Architecture
Figure 6 EMP U250 Chipset Architecture
Figure 7 EMP WCDMA IC Development Timeline
Figure 8 Infineon MP-EU Chipset Architecture
Figure 9 Freescale i300-30 Chipset Architecture
Figure 10 Philips Nexperia 7210 Chipset Architecture
Figure 11 Broadcom Dual-core BCM2132+BCM2140 Chipset Architecture
Figure 12 Agere Dual-Mode Sceptre HPU Chipset Architecture
Figure 13 ADI SoftFone-W Chipset Architecture

Table 1 Leading IC Suppliers' 3G Mobile Phone Solutions
Table 2 Leading 3G IC Suppliers' Taiwanese Mobile Phone Clients

Note: Product cover images may vary from those shown

RELATED PRODUCTS

Our Clients

Our clients' logos