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World Lean Manufacturing Markets for Electronic Components and Packages
Frost & Sullivan, April 2004
Electronic devices are simultaneously getting smaller and more complex. In keeping with this trend, passive component manufacturers that produce discrete devices need to deliver highly integrated components. The demand is for devices that are efficient, economic, and space-saving. High-end packages, such as ball grid arrays (BGA), multi-chip modules (MCM), staked dies, and chip scale packages (CSP) are widely used for their smaller footprints and high functionality.
This research analyzes the market for electronic components including resistors, capacitors, inductors, and transformers and packages, such as BGAs, CSPs, and MCMs. It also studies evolving technological trends and major challenges faced by the world electronic components and packaging industry and offers strategic recommendations to overcome them and improve market share.
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