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World Electronic Packaging Technologies -- Analysis of Technological Trends
Frost & Sullivan, Sep 2004
Rapid Innovations in Microelectronics Necessitate Advanced Electronic Packages
Constant innovations in the field of microelectronics and the radical shift toward system-on-chip (SoC) solutions have sparked research into electronic packaging as a tool to improve device performance, functionality, and reliability. In order to support the increasing device complexity and system integration, there is mounting pressure on electronics packaging to maintain higher speeds and pin count, lower power consumption, better substrate connectivity, and provide finer pitch. In meeting these requirements, package engineers face several design challenges in terms of cost, reduced board area, and complex circuitry. Furthermore, they must resolve electrical, mechanical, and thermal issues while designing the electronic package.
This Frost & Sullivan research service focuses on the global trends and developments in next-generation electronic packaging technologies that hold immense potential for the electronics and semiconductors industry. It also analyzes the key drivers and challenges faced by each novel packaging technology. Participants can identify potential collaborators, remain ahead of the competition, and stay shoulder-to-shoulder with critical developments.
Demand for Portable Devices Drives Research into Advanced Electronic Packaging
Next-generation chips have culminated into tinier, lighter, faster, and more powerful portable devices that require smaller system packaging technologies with increased functionality and memory capacity. Portable applications require packages in compact form factors, says the analyst. However, there are still significant challenges to be overcome in terms of performance, cost, and time-to-market.
System-in-package (SiP) continues to remain the preferred packaging solution for applications in wireless communications and has emerged as one of the most powerful and advanced technologies for the chip packaging industry. Further, SiP also meets the cost and short time-to-market needs of current portable electronics and wireless devices, and therefore, scores over SoC and multi-chip-modules (MCM) solutions with regard to flexibility and cost-effectiveness.
Immense Potential for Novel Packaging Technologies
Novel packaging technologies have grown in importance due to their reputation as vital support for next-generation devices. In a drastic turnaround in research attitudes, the electronic package is given the same importance as the silicon wafer that it encloses, explains the analyst. Researchers have realized that in order to achieve optimal system integrity and performance, decisions involving packaging must be made within the framework of the overall system.
Researchers are diving headlong into the search for the perfect packaging technology. For example, after achieving reduction in both the length and width of packages, they are now turning to three-dimensional packaging technologies that stack multiple dies/chips within a single package. In addition, implementation of lead-free and flip-chip packaging that facilitates a higher pin count (1000 and above) is also attracting attention.
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