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Opportunities In High Speed Electronics: A Technology and Market Review 2016-2021

  • ID: 3765013
  • May 2016
  • Region: Global
  • 140 Pages
  • BPA Consulting
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Enterprises Outsourcing their Networks Is Core to the Future Trends for High Speed Systems, Components and Materials

This report looks at this new pyridine of “big data” and analyse how this will affect the Datacoms infrastructure and its impact on the technologies demanded.

This report will describe the needs technology challenges by analysing how systems will need to adapt (Routers, servers, base-stations etc.) and how supporting technologies such as ICs, PCBs, Laminates and optical interconnect technology; where applicable will be required to facilitate this next stage of the internet.

In previous high speed reports the focus has been on the core and metro access parts of the Datacoms and Telecoms infrastructure. Traditionally this was looked after by the regional Telco’s and was deployed with voice communications in mind. For them and for particularly companies such as AT&T the challenge was to manage voice traffic in real time.

Systems were developed where capacity reflected peak loading but the size of the “data” was small, double digit Kb. In fact a text message is around 20kb. Adding a photo increase this by an order of magnitude namely 350Kb. A one minute video increases this again by an order of magnitude to 4Mb. A one minute READ MORE >

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1. Introduction
- Introduction
- Research Methodology

2. Executive Summary

3. Key Drivers
- Introduction
- Iot
- Consumer
- Wireless And Mobile
- Enterprise And Data Centres
- Summary

4. Legacy High-Speed Systems
- Introduction
- Routers And Switches

5. Data Centres And Enterprise Servers
- Introduction
- Data Centres And Hyperscale Data Centres
- Enterprise Servers

6. Wireless Communications Infrastructure
- Introduction
- Lte
- 5G

7. Portable Terminals
- Introduction
- Handsets
- Technology Trends

8. Subassemblies Components And Materials
- Introduction
- Emerging Semiconductor Technologies For Photonics
- Packaging Of Optical Transceiver Modules
- Semiconductors For Electronics And Their Package Types
- Substrates And Low-Loss Laminates

9. Market Forecasts
- Introduction
- Datacom
- Telecom
- Portable Terminals
- Opto-Pcbs
- Transceiver Modules

10. Conclusion And Opportunities
- Conclusion
- Opportunities

Glossary

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The report will deliver the following:

- Identification of the markets, applications, equipment types and vendors for high-speed systems.
- Identification of the driving forces for each of the markets identified, and where appropriate, for each system within that market segment.
- For each high-speed system identified, a system technology roadmap from 2015 through to 2020 will be produced, showing the technology trends for these systems.
- A review of the implications that the technology/systems requirements have on the use of substrates, laminates and IC packaging within these systems.
- The advantages and disadvantages of electrical and optical interconnection technologies for high-speed systems, and how they may complement each other. A review of recent developments in intra-system high-speed electrical and optical technologies, together with the identification of the organisations involved.
- Forecasts of the market value and volume for key systems in each market segment from 2015 through 2020. This will include:

- High-end routers
- Wireless base stations
- Blade Servers
- High End Servers for Enterprises and Datacentres

- Identification of the specific requirements of each type of high-speed system affecting substrates.
- Identification of substrate material types suitable for meeting high-speed and high band width requirements. The key attributes of these materials will be defined and the opportunities quantified.
- The technology trends for both electrical and optical high-speed substrates will be examined in terms of material and technical characteristics and their applicability to the systems under investigation.
- Technology roadmaps will be developed for substrate materials identifying the key technical characteristic affected including:

a) Dielectric constant
b) Loss tangent
c) Dimensional stability
d) Moisture absorption
e) Peel strength
f) Electrical or optical characteristics
g) Cost/value

- Market forecasts will be provided by material type identified from 2016 through to 2021.
- The impact that high-speed interconnection solutions has on IC Package interconnection and attachment will be reviewed, together with the identification of the optimum solutions.
- The role of materials within high-speed IC packaging will be examined, together with the requirements. Leading suppliers of these materials will be identified along with what impact their developments will have.
- Technology roadmaps will be provided for Optoelectronic Packages identifying the key technical characteristic affected.

Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown

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