The global 3D sensor market is envisioned to garner $56,992.30 million by 2031, growing from $17,607.90 million in 2021 at a CAGR of 13.0% from 2022 to 2031.
The development of three-dimensional (3D) technology is a significant scientific breakthrough. It is a depth-sensing innovation that improves camera functionality for object and facial recognition. the process of accurately measuring an object's length, width, and height with more sophisticated equipment than is possible with a variety of existing technologies. The use of 3D technology offers distinctive improvements in how daily activities are seen and approached.
The market for 3D sensors is expected to rise over the course of the forecast period due to factors including the rising need for 3D-capable consumer gadgets and the swiftly rising demand for medical imaging solutions. Additionally, the requirement for high precision security & surveillance, the increasing need for 3D-enabled consumer electronics such as smartphones and tablets coupled with the expanding use of 3D sensing technology in virtual reality & gaming, are among the reasons boosting the market expansion.
Many of the fundamental technologies advancing 3D sensing have advantages and disadvantages. To create these new systems, it is necessary to create high-quality sensors and effective algorithms that can make use of both current and emerging technology. For instance, it is difficult to measure any surface that is outside of the scanner's field of view since 3D sensor scanning is optical in nature. Consequently, the scanner cannot detect internal or concealed geometry, making it impossible to measure it. In order to create a full model, scans are collected from a variety of angles. Nevertheless, complicated geometry, such that is seen frequently in holes or threads, may still present a challenge.
A range of 3D-capable consumer electronics products, including cameras, 3D gaming consoles, 3D media players, 3D portable devices, 3D TV displays, 3D desktop PCs, and notebooks, have been introduced in response to the rising demand for better visual effects. As the demand for 3D-capable devices rises, so does the supply of 3D content, fueling market expansion. In order to deliver 3D sensors, Apple Inc. intends to strengthen its collaboration with Sony Corporation. As 3D sensors are frequently used in cameras, this is further propelling the market in terms of security and surveillance needs.
The COVID-19 pandemic brought several uncertainties leading to severe economic losses as various businesses across the world were at a standstill. There were import-export restrictions laid down on major 3D sensor-producing countries such as the U. S. and China, which imposed significant challenges on the market. In October 2021, the Indian government took a new initiative to produce 3D sensors from structured lite using sensor technology. Similar other initiatives are projected to relieve the obstacles of the market for any unforeseen situation.
The key players profiled in this report include pmdtechnologies ag, Infineon Technologies AG, SAMSUNG, LMI TECHNOLOGIES INC., COGNEX CORPORATION, Microchip Technology Inc., Occipital, Inc., Qualcomm Technologies, Inc., KEYENCE CORPORATION, and OmniVision Technologies, Inc.
The development of three-dimensional (3D) technology is a significant scientific breakthrough. It is a depth-sensing innovation that improves camera functionality for object and facial recognition. the process of accurately measuring an object's length, width, and height with more sophisticated equipment than is possible with a variety of existing technologies. The use of 3D technology offers distinctive improvements in how daily activities are seen and approached.
The market for 3D sensors is expected to rise over the course of the forecast period due to factors including the rising need for 3D-capable consumer gadgets and the swiftly rising demand for medical imaging solutions. Additionally, the requirement for high precision security & surveillance, the increasing need for 3D-enabled consumer electronics such as smartphones and tablets coupled with the expanding use of 3D sensing technology in virtual reality & gaming, are among the reasons boosting the market expansion.
Many of the fundamental technologies advancing 3D sensing have advantages and disadvantages. To create these new systems, it is necessary to create high-quality sensors and effective algorithms that can make use of both current and emerging technology. For instance, it is difficult to measure any surface that is outside of the scanner's field of view since 3D sensor scanning is optical in nature. Consequently, the scanner cannot detect internal or concealed geometry, making it impossible to measure it. In order to create a full model, scans are collected from a variety of angles. Nevertheless, complicated geometry, such that is seen frequently in holes or threads, may still present a challenge.
A range of 3D-capable consumer electronics products, including cameras, 3D gaming consoles, 3D media players, 3D portable devices, 3D TV displays, 3D desktop PCs, and notebooks, have been introduced in response to the rising demand for better visual effects. As the demand for 3D-capable devices rises, so does the supply of 3D content, fueling market expansion. In order to deliver 3D sensors, Apple Inc. intends to strengthen its collaboration with Sony Corporation. As 3D sensors are frequently used in cameras, this is further propelling the market in terms of security and surveillance needs.
The COVID-19 pandemic brought several uncertainties leading to severe economic losses as various businesses across the world were at a standstill. There were import-export restrictions laid down on major 3D sensor-producing countries such as the U. S. and China, which imposed significant challenges on the market. In October 2021, the Indian government took a new initiative to produce 3D sensors from structured lite using sensor technology. Similar other initiatives are projected to relieve the obstacles of the market for any unforeseen situation.
The key players profiled in this report include pmdtechnologies ag, Infineon Technologies AG, SAMSUNG, LMI TECHNOLOGIES INC., COGNEX CORPORATION, Microchip Technology Inc., Occipital, Inc., Qualcomm Technologies, Inc., KEYENCE CORPORATION, and OmniVision Technologies, Inc.
KEY BENEFITS FOR STAKEHOLDERS
- This report provides a quantitative analysis of the market segments, current trends, estimations, and dynamics of the 3d sensor market analysis from 2021 to 2031 to identify the prevailing 3d sensor market opportunities.
- The market research is offered along with information related to key drivers, restraints, and opportunities.
- Porter's five forces analysis highlights the potency of buyers and suppliers to enable stakeholders make profit-oriented business decisions and strengthen their supplier-buyer network.
- In-depth analysis of the 3d sensor market segmentation assists to determine the prevailing market opportunities.
- Major countries in each region are mapped according to their revenue contribution to the global market.
- Market player positioning facilitates benchmarking and provides a clear understanding of the present position of the market players.
- The report includes the analysis of the regional as well as global 3d sensor market trends, key players, market segments, application areas, and market growth strategies.
Key Market Segments
By Type
- Image Sensor
- Accelerometer Sensor
- Position Sensor
- Others
By Technology
- Structured Light
- Time of Flight
- Stereoscopic Vision
- Ultrasound
- Others
By Connectivity
- Wireless
- Wired
By End use
- Consumer Electronics
- Healthcare
- Aerospace Defense
- Automotive
- Others
By Region
- North America
- U. S.
- Canada
- Mexico
- Europe
- Germany
- UK
- France
- Spain
- Italy
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Australia
- Rest Of Asia Pacific
- LAMEA
- Brazil
- Saudi Arabia
- UAE
- South Africa
- Rest of LAMEA
Key Market Players
- Omnivision Technologies
- Infineon Technologies
- LMI Technologies
- PrimeSense
- Cognex Corporation
- SoftKinetic
- Pmdtechnologies GmbH
- IFM Electronic
- Occipital Inc.
Table of Contents
CHAPTER 1: INTRODUCTION1.1. Report description
1.2. Key market segments
1.3. Key benefits to the stakeholders
1.4. Research Methodology
1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. Key findings of the study
2.2. CXO Perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top investment pockets
3.3. Porter’s five forces analysis
3.4. Top player positioning
3.5. Market dynamics
3.5.1. Drivers
3.5.2. Restraints
3.5.3. Opportunities
3.6. COVID-19 Impact Analysis on the market
3.7. Value Chain Analysis
3.8. Key Regulation Analysis
3.9. Patent Landscape
3.10. Regulatory Guidelines
3.11. Market Share Analysis
CHAPTER 4: 3D SENSOR MARKET, BY TYPE
4.1 Overview
4.1.1 Market size and forecast
4.2 Image Sensor
4.2.1 Key market trends, growth factors and opportunities
4.2.2 Market size and forecast, by region
4.2.3 Market analysis by country
4.3 Accelerometer Sensor
4.3.1 Key market trends, growth factors and opportunities
4.3.2 Market size and forecast, by region
4.3.3 Market analysis by country
4.4 Position Sensor
4.4.1 Key market trends, growth factors and opportunities
4.4.2 Market size and forecast, by region
4.4.3 Market analysis by country
4.5 Others
4.5.1 Key market trends, growth factors and opportunities
4.5.2 Market size and forecast, by region
4.5.3 Market analysis by country
CHAPTER 5: 3D SENSOR MARKET, BY TECHNOLOGY
5.1 Overview
5.1.1 Market size and forecast
5.2 Structured Light
5.2.1 Key market trends, growth factors and opportunities
5.2.2 Market size and forecast, by region
5.2.3 Market analysis by country
5.3 Time of Flight
5.3.1 Key market trends, growth factors and opportunities
5.3.2 Market size and forecast, by region
5.3.3 Market analysis by country
5.4 Stereoscopic Vision
5.4.1 Key market trends, growth factors and opportunities
5.4.2 Market size and forecast, by region
5.4.3 Market analysis by country
5.5 Ultrasound
5.5.1 Key market trends, growth factors and opportunities
5.5.2 Market size and forecast, by region
5.5.3 Market analysis by country
5.6 Others
5.6.1 Key market trends, growth factors and opportunities
5.6.2 Market size and forecast, by region
5.6.3 Market analysis by country
CHAPTER 6: 3D SENSOR MARKET, BY CONNECTIVITY
6.1 Overview
6.1.1 Market size and forecast
6.2 Wireless
6.2.1 Key market trends, growth factors and opportunities
6.2.2 Market size and forecast, by region
6.2.3 Market analysis by country
6.3 Wired
6.3.1 Key market trends, growth factors and opportunities
6.3.2 Market size and forecast, by region
6.3.3 Market analysis by country
CHAPTER 7: 3D SENSOR MARKET, BY END USE
7.1 Overview
7.1.1 Market size and forecast
7.2 Consumer Electronics
7.2.1 Key market trends, growth factors and opportunities
7.2.2 Market size and forecast, by region
7.2.3 Market analysis by country
7.3 Healthcare
7.3.1 Key market trends, growth factors and opportunities
7.3.2 Market size and forecast, by region
7.3.3 Market analysis by country
7.4 Aerospace & Defense
7.4.1 Key market trends, growth factors and opportunities
7.4.2 Market size and forecast, by region
7.4.3 Market analysis by country
7.5 Automotive
7.5.1 Key market trends, growth factors and opportunities
7.5.2 Market size and forecast, by region
7.5.3 Market analysis by country
7.6 Others
7.6.1 Key market trends, growth factors and opportunities
7.6.2 Market size and forecast, by region
7.6.3 Market analysis by country
CHAPTER 8: 3D SENSOR MARKET, BY REGION
8.1 Overview
8.1.1 Market size and forecast
8.2 North America
8.2.1 Key trends and opportunities
8.2.2 North America Market size and forecast, by Type
8.2.3 North America Market size and forecast, by Technology
8.2.4 North America Market size and forecast, by Connectivity
8.2.5 North America Market size and forecast, by End use
8.2.6 North America Market size and forecast, by country
8.2.6.1 U. S.
8.2.6.1.1 Market size and forecast, by Type
8.2.6.1.2 Market size and forecast, by Technology
8.2.6.1.3 Market size and forecast, by Connectivity
8.2.6.1.4 Market size and forecast, by End use
8.2.6.2 Canada
8.2.6.2.1 Market size and forecast, by Type
8.2.6.2.2 Market size and forecast, by Technology
8.2.6.2.3 Market size and forecast, by Connectivity
8.2.6.2.4 Market size and forecast, by End use
8.2.6.3 Mexico
8.2.6.3.1 Market size and forecast, by Type
8.2.6.3.2 Market size and forecast, by Technology
8.2.6.3.3 Market size and forecast, by Connectivity
8.2.6.3.4 Market size and forecast, by End use
8.3 Europe
8.3.1 Key trends and opportunities
8.3.2 Europe Market size and forecast, by Type
8.3.3 Europe Market size and forecast, by Technology
8.3.4 Europe Market size and forecast, by Connectivity
8.3.5 Europe Market size and forecast, by End use
8.3.6 Europe Market size and forecast, by country
8.3.6.1 Germany
8.3.6.1.1 Market size and forecast, by Type
8.3.6.1.2 Market size and forecast, by Technology
8.3.6.1.3 Market size and forecast, by Connectivity
8.3.6.1.4 Market size and forecast, by End use
8.3.6.2 UK
8.3.6.2.1 Market size and forecast, by Type
8.3.6.2.2 Market size and forecast, by Technology
8.3.6.2.3 Market size and forecast, by Connectivity
8.3.6.2.4 Market size and forecast, by End use
8.3.6.3 France
8.3.6.3.1 Market size and forecast, by Type
8.3.6.3.2 Market size and forecast, by Technology
8.3.6.3.3 Market size and forecast, by Connectivity
8.3.6.3.4 Market size and forecast, by End use
8.3.6.4 Spain
8.3.6.4.1 Market size and forecast, by Type
8.3.6.4.2 Market size and forecast, by Technology
8.3.6.4.3 Market size and forecast, by Connectivity
8.3.6.4.4 Market size and forecast, by End use
8.3.6.5 Italy
8.3.6.5.1 Market size and forecast, by Type
8.3.6.5.2 Market size and forecast, by Technology
8.3.6.5.3 Market size and forecast, by Connectivity
8.3.6.5.4 Market size and forecast, by End use
8.3.6.6 Rest of Europe
8.3.6.6.1 Market size and forecast, by Type
8.3.6.6.2 Market size and forecast, by Technology
8.3.6.6.3 Market size and forecast, by Connectivity
8.3.6.6.4 Market size and forecast, by End use
8.4 Asia-Pacific
8.4.1 Key trends and opportunities
8.4.2 Asia-Pacific Market size and forecast, by Type
8.4.3 Asia-Pacific Market size and forecast, by Technology
8.4.4 Asia-Pacific Market size and forecast, by Connectivity
8.4.5 Asia-Pacific Market size and forecast, by End use
8.4.6 Asia-Pacific Market size and forecast, by country
8.4.6.1 China
8.4.6.1.1 Market size and forecast, by Type
8.4.6.1.2 Market size and forecast, by Technology
8.4.6.1.3 Market size and forecast, by Connectivity
8.4.6.1.4 Market size and forecast, by End use
8.4.6.2 Japan
8.4.6.2.1 Market size and forecast, by Type
8.4.6.2.2 Market size and forecast, by Technology
8.4.6.2.3 Market size and forecast, by Connectivity
8.4.6.2.4 Market size and forecast, by End use
8.4.6.3 India
8.4.6.3.1 Market size and forecast, by Type
8.4.6.3.2 Market size and forecast, by Technology
8.4.6.3.3 Market size and forecast, by Connectivity
8.4.6.3.4 Market size and forecast, by End use
8.4.6.4 South Korea
8.4.6.4.1 Market size and forecast, by Type
8.4.6.4.2 Market size and forecast, by Technology
8.4.6.4.3 Market size and forecast, by Connectivity
8.4.6.4.4 Market size and forecast, by End use
8.4.6.5 Australia
8.4.6.5.1 Market size and forecast, by Type
8.4.6.5.2 Market size and forecast, by Technology
8.4.6.5.3 Market size and forecast, by Connectivity
8.4.6.5.4 Market size and forecast, by End use
8.4.6.6 Rest Of Asia Pacific
8.4.6.6.1 Market size and forecast, by Type
8.4.6.6.2 Market size and forecast, by Technology
8.4.6.6.3 Market size and forecast, by Connectivity
8.4.6.6.4 Market size and forecast, by End use
8.5 LAMEA
8.5.1 Key trends and opportunities
8.5.2 LAMEA Market size and forecast, by Type
8.5.3 LAMEA Market size and forecast, by Technology
8.5.4 LAMEA Market size and forecast, by Connectivity
8.5.5 LAMEA Market size and forecast, by End use
8.5.6 LAMEA Market size and forecast, by country
8.5.6.1 Brazil
8.5.6.1.1 Market size and forecast, by Type
8.5.6.1.2 Market size and forecast, by Technology
8.5.6.1.3 Market size and forecast, by Connectivity
8.5.6.1.4 Market size and forecast, by End use
8.5.6.2 Saudi Arabia
8.5.6.2.1 Market size and forecast, by Type
8.5.6.2.2 Market size and forecast, by Technology
8.5.6.2.3 Market size and forecast, by Connectivity
8.5.6.2.4 Market size and forecast, by End use
8.5.6.3 UAE
8.5.6.3.1 Market size and forecast, by Type
8.5.6.3.2 Market size and forecast, by Technology
8.5.6.3.3 Market size and forecast, by Connectivity
8.5.6.3.4 Market size and forecast, by End use
8.5.6.4 South Africa
8.5.6.4.1 Market size and forecast, by Type
8.5.6.4.2 Market size and forecast, by Technology
8.5.6.4.3 Market size and forecast, by Connectivity
8.5.6.4.4 Market size and forecast, by End use
8.5.6.5 Rest of LAMEA
8.5.6.5.1 Market size and forecast, by Type
8.5.6.5.2 Market size and forecast, by Technology
8.5.6.5.3 Market size and forecast, by Connectivity
8.5.6.5.4 Market size and forecast, by End use
CHAPTER 9: COMPANY LANDSCAPE
9.1. Introduction
9.2. Top winning strategies
9.3. Product Mapping of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
9.6. Key developments
CHAPTER 10: COMPANY PROFILES
10.1 Omnivision Technologies
10.1.1 Company overview
10.1.2 Company snapshot
10.1.3 Operating business segments
10.1.4 Product portfolio
10.1.5 Business performance
10.1.6 Key strategic moves and developments
10.2 Infineon Technologies
10.2.1 Company overview
10.2.2 Company snapshot
10.2.3 Operating business segments
10.2.4 Product portfolio
10.2.5 Business performance
10.2.6 Key strategic moves and developments
10.3 LMI Technologies
10.3.1 Company overview
10.3.2 Company snapshot
10.3.3 Operating business segments
10.3.4 Product portfolio
10.3.5 Business performance
10.3.6 Key strategic moves and developments
10.4 PrimeSense
10.4.1 Company overview
10.4.2 Company snapshot
10.4.3 Operating business segments
10.4.4 Product portfolio
10.4.5 Business performance
10.4.6 Key strategic moves and developments
10.5 Cognex Corporation
10.5.1 Company overview
10.5.2 Company snapshot
10.5.3 Operating business segments
10.5.4 Product portfolio
10.5.5 Business performance
10.5.6 Key strategic moves and developments
10.6 SoftKinetic
10.6.1 Company overview
10.6.2 Company snapshot
10.6.3 Operating business segments
10.6.4 Product portfolio
10.6.5 Business performance
10.6.6 Key strategic moves and developments
10.7 Pmdtechnologies GmbH
10.7.1 Company overview
10.7.2 Company snapshot
10.7.3 Operating business segments
10.7.4 Product portfolio
10.7.5 Business performance
10.7.6 Key strategic moves and developments
10.8 IFM Electronic
10.8.1 Company overview
10.8.2 Company snapshot
10.8.3 Operating business segments
10.8.4 Product portfolio
10.8.5 Business performance
10.8.6 Key strategic moves and developments
10.9 Occipital Inc.
10.9.1 Company overview
10.9.2 Company snapshot
10.9.3 Operating business segments
10.9.4 Product portfolio
10.9.5 Business performance
10.9.6 Key strategic moves and developments
Executive Summary
According to this report, titled, '3D Sensor Market,' the 3d sensor market size was valued at $17.6 billion in 2021, and is estimated to reach $57 billion by 2031, growing at a CAGR of 13% from 2022 to 2031.As the use of 3D sensing technology has grown, manufacturers have been working to provide high-quality sensors that can make use of both new and old technologies. A key driver of the market expansion is the usage of 3D sensors in augmented reality, mapping, and biometric sensors. Also, the market is aided by rising demand for 3D sensors in imaging applications, virtual reality, gaming, security, and surveillance. In order to create a 3D model, it is also utilized by artists, engineers, and architects, which may also contribute to 3d sensor market expansion. Electronics utilize three-dimensional depth sensing to detect the dimensions of objects. This technology is becoming more prevalent across a range of sectors and uses. These factors are accounted for global 3D sensor market growth.
The complexity of 3D sensors, high maintenance costs, and poor manufacturing could restrain market expansion. Superior chip size is needed to capture images from 3D sensors, which naturally drives up the cost of the production process. The performance of the image may be impacted by decreasing the pixel pitch to cut costs.
The Mechanical 3D-Sensor has been around for a while and is further developed into the Digital 3D-Sensor. It is used to establish the workpiece edges on milling and Electronic Distance Measurement (EDM). On the reference edge, the spindle can be rapidly and securely placed. The zero location is discovered on the first try and the setting operation may be carefully tracked on the digital display. The spindle axis is positioned precisely on the approaching edge, making it possible to select the machine coordinate system without performing any calculations. Additionally, the digital display features big, easy-to-read numbers with measurements in 0.0002 increments. The digital display can be stored in the machine's tool magazine and is dust- and splash-proof (IP64). These factors are accounted for 3D sensor market trends during forecasted period.
The global 3D sensor market share is segmented based on type, technology, connectivity, end-use, and region. By type, it is classified into the image sensor, accelerometer sensor, position sensor, and others. By technology, it is classified into structured light, time of flight, stereoscopic vision, ultrasound, and others. By connectivity, it is classified into wireless and wired. By end use, it is classified into consumer electronics, healthcare, aerospace & defense, automotive, and others. By region, the 3d sensor market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The key players profiled in the 3D sensor market analysis report include pmdtechnologies ag, Infineon Technologies AG, SAMSUNG, LMI TECHNOLOGIES INC., COGNEX CORPORATION, Microchip Technology Inc., Occipital, Inc., Qualcomm Technologies, Inc., KEYENCE CORPORATION, and OmniVision Technologies, Inc. These market players have adopted various strategies to increase their market share and strengthen their foothold in the industry.
Impact of COVID-19 on the Global 3D Sensor Industry
Sales of 3D sensors are directly proportional to the demand from consumers in electronics, healthcare, automotive, and aerospace & defense. Considering the demand, COVID 19 has impacted the operations of many OEM from R&D to Production, resulting in revenue losses across the supply chain.COVID-19 impacted almost all industries and the 3D sensor-producing companies ceased their operations owing to import-export restrictions, lockdown imposed across several countries, and shortage of labor; the fear of contracting the novel coronavirus led to sluggish demand in the 3d sensor market.
Social distancing norms, closed borders, and production constraints, due to the pandemic, across various countries such as China, India, and the U.S. have affected the global 3d sensor market.
Key Findings of the Study
Based on type, the image sensor sub-segment emerged as the global leader in 2021 and is anticipated to be the fastest growing sub-segment during the forecast periodBased on technology, the structured light sub-segment emerged as the global leader in 2021 and the stereoscopic vision sub-segment is predicted to show the fastest growth in the upcoming years
Based on connectivity, the wireless sub-segment emerged as the global leader in 2021 and is predicted to show the fastest growth in the upcoming years
Based on end-use, the consumer electronic sub-segment emerged as the global leader in 2021 and is predicted to show the fastest growth in the upcoming years
Based on region, the Asia-Pacific market registered the highest market share in 2021 and is projected to maintain the position during the forecast period
Companies Mentioned
- Omnivision Technologies
- Infineon Technologies
- Lmi Technologies
- Primesense
- Cognex Corporation
- Softkinetic
- Pmdtechnologies GmbH
- Ifm Electronic
- Occipital Inc.
Methodology
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.
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