This issue of Sensor TOE depicts key developments in LiDAR sensors that can fuse data from a video camera, CMOS image sensors, silicon on insulator (SOI) substrates for improved imaging in near infrared applications, and dual camera systems with improved depth information.
Sensor TechVision Opportunity Engine (TOE) captures global sensor-related innovations and developments on a weekly basis. Innovations are directed toward developing smart and intelligent sensors with functionalities beyond sensing. Research focus areas include: low power sensors (energy harvesting), industrial automation sensors (M2M, vision sensor), ubiquitous sensor (WSN, sensor fusion), smart sensors (wearables, quantified self), high sensitivity and smaller size (MEMS, nanosensors), and improved security (CBRNE, terahertz). The need for low power, smaller, lighter sensors with enhanced performance attributes and minimal false alarms is driving innovations in the sensors space.
The Sensors and Instrumentation cluster covers innovations pertaining to technologies such as wireless sensors and networks, energy harvesting, haptics and touch, MEMS and nanosensors, Terahertz, ubiquitous/smart sensors, CBRNE, quantified-self, sensor fusion, M2M communications, and drones.
Table of Contents
1. Recent Developments in Sensor Technologies
- LiDAR Sensor for Level 4 and Level 5 Autonomous Vehicles
- Smart Automotive Image Sensor for ADAS Applications
- SOI Substrate for NIR CMOS Imagers
- Dual Camera for ADAS and Autonomous Driving Applications
- CMOS Image Sensor Technology for Medical Imaging
- Industry Contacts
