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Flexible And Flex-Rigid Printed Circuits 2006 - A Global Market and Technology Review 2005-2011
BPA Consulting, Aug 2006
Why is this Report so Important?
- Flexible and flex-rigid substrates are key technology in future generation electronic system design, development and IC packaging, having been until a few years ago, a specialist and niche substrate technology.
- The market for flex and flex-rigid circuits has increased from $4 billion in 2001 to $6.4 billion in 2005 and is expected to double by 2011.
- Flex and flex-rigid production in Asia has increased from less than $1.5 billion to nearly $4 billion in 2005 and will more than double by 2011.
- This study provides a totally integrated assessment of the global flexible and flex-rigid substrate supply chain.
Key Questions Answered in This Report:
- How large are the markets for flexible and flex-rigid substrates? How fast are they growing? How will they develop over the next five years
- What are the next emerging applications for flex and flex-rigid substrates?
- Which new flexible and flex-rigid substrate technologies will emerge as mainstream approaches - when and why?
- What new opportunities are emerging for companies in the supply industry for new materials, process equipment and assembly services?
- Who are the players in flexible and flex-rigid substrates worldwide? How are they differentiated?
- How is flexible and flex-rigid substrate manufacturing and end-market demand distributed worldwide?
- How will the trade balance of Western and Eastern production change over the next five years?
- What will be the winning strategies for successful flexible and flex-rigid substrate suppliers?
- How will EMS and ODMs impact the supply base?
Included in this Latest Update:
- Extensive updated review of mobile phones, market trends, form factors and impact on requirements for multilayer flex
- Extensive review of automotive market trends
- Revised and expanded review of the military and aerospace market
- Updated technology roadmaps for key emerging applications for flex and flex-rigid printed circuits
- Updated technology roadmaps for key volume applications for flex and flex-rigid printed circuits
- Updated market forecasts to 2011 for Europe, North America, China, Asia and Japan
- Updated market forecasts for flexible laminates, coverlays and coverfilms
- Review of China’s share of worldwide FPC production
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