Symposium CD: 1st Annual MEMS and Advanced Packaging Technologies -- Synergies and Convergence
Microelectronics Packaging and Test Engineering Council, May 2003
PRESENTATIONS INCLUDE: Challenges of MEMS High Volume Manufacturing - MEMS Market Outlook: Buzz vs. Opportunity - Success Factors for MEMS Startups From the Perspective of the Nuclear VC Winter - Enabling Technologies - Unique Photo Resist Chemistry for Three4 Dimensional MEMS and Advanced Packaging Applications - Creating Conformal Electrophoretic Photoresist Coating on High Topography Structures by Optimum Methods - And More.
