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Symposium CD: 2nd Annual MEMS and Wafer Level Packaging -- Converging Technologies

Microelectronics Packaging and Test Engineering Council, May 2004

PRESENTATIONS INCLUDE: Packaging Issues in BioMEMS - Packaging Issues of MEMS Devices - Wafer Level Packaging and Assembly of Analytical Instrumentation - Evolution of MEMS Technology and Markets for MEMS Based Products - Wafer Scale Hermetic Bonding Techniques - A Novel Au/Sn Seal Ring Fabrication Technology - Plastic Packaging of MEMs Devices using Liquid Crystal Polymers - Wafer Level Integration of a High-Density MEMS Mirror Array - Wafer Level MEMS Packaging Ensuring Reliability - StressedMetal - A Wafer Level Packaging Technology - Wafer-Level Packaging with Self-Sealed Vacuum Cavities - 3D Glass Ceramic Micromanufacturing Process - Wafer Scale Vacuum Packaging of a MEMS Optical Scanner - Wafer-Level Hermetically Packaged Accelerometers and Gyroscopes.

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