Symposium CD: 1st Annual "The Heat is On" -- Thermal Management Issues in Semiconductor Packaging - Market Research Reports

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Symposium CD: 1st Annual "The Heat is On" -- Thermal Management Issues in Semiconductor Packaging

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PRESENTATIONS INCLUDE: Thermal Management Challenges for Microprocessors - Advanced Thermal Management Technologies for Electronic Systems - Thermal Packaging: Markets and Opportunities - Presentation of the NEMI Thermal Working Group Roadmap (2004 issue) - Efficient Thermal Management Using Advanced Packaging Techniques - nVidia Corporation / Engineering Graphics Processors Thermal Solutions - 64-bit Server Cooling Requirements - Material and Interfacial Impact on Package Thermal Performance - Emerging Standards in Thermal Simulation - Thermal Characterization and Modeling: A Key Part of the Total Packaging Solution - Thermal Design Considerations for System in Package - System Cooling of Outdoor Wi-Fi Antenna - Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs - Thermal Management from Chip Core to the Cooling Tower

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