PRESENTATIONS INCLUDE: Power Trends in Networking Electronics and Computing Systems - High Heat Flux Thermal Management of Electronics: Strategies and Limitations - Thermal Issues from ITRS Perspective - Semiconductor Industry Trends and Thermal Materials Review - Development of Thermal Interface Materials and Impact of Application Surface - Reliability and Performance of Thermally Conductive Adhesives - Cooling High Power Devices - Temperature-Aware Design Methodology for Die-Level Thermal Analysis - Advanced Thermal Management During Burn-in - Thermal Challenges and Methods in Semiconductor Test - Power Considerations in High Performance FPGAs - Thermal Considerations in Package Stacking and Advanced Module Technology - Thermal Challenges for SPARC Based Microprocessors - Processor Packaging: Thermal Overview
