PRESENTATIONS INCLUDE: Multi-Fuel Mini Engines - MEMS Devices to MEMS Based Modules: Analysis of the Evolution of the MEMS Industry and Markets - MEMS Applications:High Unit and Revenue Growth Potential in the Billions - Intellectual Property Issues for MEMS in Developing Technologies and Markets - IC/MEMS Package Convergence - Film Based Molding: Applying IC Packaging Technology for Emerging Large Volume - MEMS Packaging Applications - Wafer Level Vacuum Packaging for MEMS Sensors - Leveraging Standard IC Packaging for MEMS Resonators - Investigation of the Mechanical Robustness of Glass Frit Wafer-Bonded Micro Packages for Automotive Applications - Low Stress Packaging Enables MEMS Performance and Reliability - Dynamic Analysis of MEMS Structures - Copper Plating of Thru-wafer Vias for MEMS Applications - High Bandwidth, High Frequency Package Using Micro-Fabrication Techniques - Tuneable Dielectric Integration on RF Substrates - Mil-Aero MEMS: Hi-Rel Challenges
