PRESENTATIONS INLCUDE: The Future of Thermal Engineering -- Far from a Stand-Alone Discipline - Thermal Management Issues and Trends for Advanced ICs - Thermal Management of Mobile Electronics: A Case Study in Densification - Thermal challenges in ICs and Memory: Hot spots - Passive Cooling and Beyond - New Techniques for Chip and Package Thermal Modeling - High Power Packaging: Materials, Design and Analysis Considerations - Thermal Behavior and Data Processing for Multi-Chip Packages: Lateral, Stacked, PoP and PiP - Semiconductor Thermal Resistance--Standards versus Real Life - Limitations of Traditional Burn-In and Test Methods Due to Thermal Implications - Challenges of Process Variation and Temperature at Burn-In - Mitigating Semiconductor Hot Spots - XBOX360 Thermal System Design and Verification - System Design Challenges
