Global Molded Interconnect Devices Market - Forecasts from 2019 to 2024

The global molded interconnect device market is projected to grow at a CAGR of 9.91% to reach US$865.764 million by 2024, from US$491.107 million in 2018. The trend towards miniaturization in the consumer electronics industry coupled with increasing adoption of the smartphone in the developing economies are the major factors driving the demand for molded interconnect devices. Simultaneously, growing focus by the automotive manufacturers to improve the experience and convenience to the individual is leading to rising in-vehicle electronic content, thus driving the revenue generation opportunity for the molded interconnect device manufacturers. Moreover, the ability of the moulded interconnect device technology to support the development of medical devices is further augmenting its demand. As such, the adoption of these devices in the automotive and healthcare sector poses a significant market potential. Rising research and development expenditure by major vendors towards the development of these devices will augment the demand for these devices over the forecast devices.

Drivers

Flexibility of design
Growing focus on miniaturization of devices.

Restraints

Limited skilled labor.

Major industry players profiled as part of the report are TE Connectivity, LPFK Laser and Electronics, Lanxess, and Multiple Dimensions AG among others.

Segmentation

The global molded interconnect device market has been analyzed through the following segments:

BY PROCESS

Laser Direct Structuring
2-shot molding
Film Techniques

By PRODUCT TYPE

Antennae and Connectivity Modules
Sensors
Connectors and Switches
Lighting
Others

BY INDUSTRY VERTICAL

Telecommunication
Consumer Electronics
Automotive
Healthcare
Others

By Geography

North America
USA
Canada
Mexico

South America
Brazil
Others

Europe
Germany
France
United Kingdom
Spain
Others

Middle East and Africa
Israel
Others

Asia Pacific
China
Japan
South Korea
Others