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North America Semiconductor Memory Market By Type, By End User, By Country, Industry Analysis and Forecast, 2020 - 2026

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    Report

  • 106 Pages
  • June 2020
  • Region: North America
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5129430
The North America Semiconductor Memory Market is expected to witness market growth of 6.8% CAGR during the forecast period (2020-2026).

Semiconductor is extensively used within the aerospace and defense industries and is expected to see a new increase in demand due to the increased space exploration and research expenditures. The semiconductor systems are used among other major applications, for example for power management, RF systems, aerospace, integrated vehicle systems and defense systems. Moreover, the continuously increasing spending on better space exploration and military technology by various government and space agencies is also boosting the demand to improve robust and effective technologies.

Semiconductor components can make an impact on the long-term durability of the device in which they are used, resulting in premature failure. Factors influencing long-term durability include high temperatures, metal migration and ionizing radiation. Highly reliable semiconductor components include DC-DC converters, voltage regulators, power transistors, diodes and integrated circuits (ICs). Aerospace & defense is the main end-user market with these components, since devices and equipment used in this field need to be free of all sorts of vulnerabilities.

Evolution in the form of automation and digitization in the entire electronics sector, together with the use of memory-based elements in technologically advanced products in a number of vertical industries, such as automobiles, IT and telecommunications, consumer electronics, etc., are boosting the market growth. The evolving use of semiconductor components, for example NAND Flash, DRAM, and other in electronic and automotive systems is the main source of demand for integrated gadgets and chips. Automotive frameworks such as automated safety, luxury and control frameworks, which consolidate different storage systems, will enhance the speed and network in the self-regulation and electric vehicle industry. Furthermore, the extensive utilization of cell phones, workstations, smart devices and consumer electronic gadgets around the globe is a sign of the need for exceptionally productive chips.

Based on Type, the market is segmented into DRAM, Flash ROM, SRAM, MRAM and Others. Based on End User, the market is segmented into Consumer Electronics, Automotive, Telecom & IT, Aerospace & Defense, Medical, Industrial and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include IBM Corporation, Infineon Technologies AG (Cypress Semiconductor Corporation), NXP Semiconductors N.V., Samsung Electronics Co., Ltd. (Samsung Group), Intel Corporation, Fujitsu Limited, Texas Instruments, Inc., Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation), Macronix International Co., Ltd., and Crocus Technology, Inc.

Scope of the Study

Market Segmentation:

By Type
  • DRAM
  • Flash ROM
  • SRAM
  • MRAM
  • Others

By End User
  • Consumer Electronics
  • Automotive
  • Telecom & IT
  • Aerospace & Defense
  • Medical
  • Industrial
  • Others

By Country
  • US
  • Canada
  • Mexico
  • Rest of North America

Companies Profiled
  • IBM Corporation
  • Infineon Technologies AG (Cypress Semiconductor Corporation)
  • NXP Semiconductors N.V.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Intel Corporation
  • Fujitsu Limited
  • Texas Instruments, Inc.
  • Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation)
  • Macronix International Co., Ltd.
  • Crocus Technology, Inc.

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  • Highest number of market tables and figures
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Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Semiconductor Memory Market, by Type
1.4.2 North America Semiconductor Memory Market, by End User
1.4.3 North America Semiconductor Memory Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2016-2020)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions : 2016, Nov - 2020, Jun) Leading Players
Chapter 4. North America Semiconductor Memory Market by Type
4.1 North America DRAM Semiconductor Memory Market by Country
4.2 North America Flash ROM Semiconductor Memory Market by Country
4.3 North America SRAM Semiconductor Memory Market by Country
4.4 North America MRAM Semiconductor Memory Market by Country
4.5 North America Other Type Semiconductor Memory Market by Country
Chapter 5. North America Semiconductor Memory Market by End User
5.1 North America Consumer Electronics Semiconductor Memory Market by Country
5.2 North America Automotive Semiconductor Memory Market by Country
5.3 North America Telecom & IT Semiconductor Memory Market by Country
5.4 North America Aerospace & Defense Semiconductor Memory Market by Country
5.5 North America Medical Semiconductor Memory Market by Country
5.6 North America Industrial Semiconductor Memory Market by Country
5.7 North America Others Semiconductor Memory Market by Country
Chapter 6. North America Semiconductor Memory Market by Country
6.1 US Semiconductor Memory Market
6.1.1 US Semiconductor Memory Market by Type
6.1.2 US Semiconductor Memory Market by End User
6.2 Canada Semiconductor Memory Market
6.2.1 Canada Semiconductor Memory Market by Type
6.2.2 Canada Semiconductor Memory Market by End User
6.3 Mexico Semiconductor Memory Market
6.3.1 Mexico Semiconductor Memory Market by Type
6.3.2 Mexico Semiconductor Memory Market by End User
6.4 Rest of North America Semiconductor Memory Market
6.4.1 Rest of North America Semiconductor Memory Market by Type
6.4.2 Rest of North America Semiconductor Memory Market by End User
Chapter 7. Company Profiles
7.1 IBM Corporation
7.1.1 Company Overview
7.1.1 Financial Analysis
7.1.2 Regional & Segmental Analysis
7.1.3 Research & Development Expenses
7.1.4 Recent strategies and developments:
7.1.4.1 Partnerships, Collaborations, and Agreements:
7.1.5 SWOT Analysis
7.2 Infineon Technologies AG (Cypress Semiconductor Corporation)
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Product Launches and Product Expansions:
7.2.6 SWOT Analysis
7.3 NXP Semiconductors N.V.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Product Launches and Product Expansions:
7.3.6 SWOT Analysis
7.4 Samsung Electronics Co., Ltd. (Samsung Group)
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments:
7.4.5.1 Product Launches and Product Expansions:
7.4.6 SWOT Analysis
7.5 Intel Corporation
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 Recent strategies and developments:
7.5.5.1 Partnerships, Collaborations, and Agreements:
7.5.5.2 Product Launches and Product Expansions:
7.5.6 SWOT Analysis
7.6 Fujitsu Limited
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Recent strategies and developments:
7.6.3.1 Partnerships, Collaborations, and Agreements:
7.6.3.2 Product Launches and Product Expansions:
7.6.4 SWOT Analysis
7.7 Texas Instruments, Inc.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Product Launches and Product Expansions:
7.7.6 SWOT Analysis
7.8 Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research and Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Macronix International Co., Ltd.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional Analysis
7.9.4 Research & Development Expense
7.9.5 Recent strategies and developments:
7.9.5.1 Partnerships, Collaborations, and Agreements:
7.9.5.2 Product Launches and Product Expansions:
7.10 Crocus Technology, Inc.
7.10.1 Company overview
7.10.2 Recent strategies and developments:
7.10.2.1 Partnerships, Collaborations, and Agreements:

Companies Mentioned

  • IBM Corporation
  • Infineon Technologies AG (Cypress Semiconductor Corporation)
  • NXP Semiconductors N.V.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Intel Corporation
  • Fujitsu Limited
  • Texas Instruments, Inc.
  • Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation)
  • Macronix International Co., Ltd.
  • Crocus Technology, Inc.

Methodology

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