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Asia Pacific Audio DSP Market By Type (Integrated and Discrete), By End User (Phones, IoT, Home Entertainment, Computer, True Wireless Earphones, Smart Homes, Wearables and Others), By Country, Industry Analysis and Forecast, 2020 - 2026

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    Report

  • 108 Pages
  • March 2021
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5314812
The Asia Pacific Audio DSP Market is expected to witness market growth of 9.7% CAGR during the forecast period (2020-2026).

Advanced desktop computers consist of audio hardware. This audio hardware enables audio to be recorded for storing as digital data & afterwards used for playbacks. This digital information could be edited to transform the audio sounds when played back. There are various digital audio effects which became common due to the flexibility & fidelity of digital editing. The audio DSP solutions for home theater products allow OEMs to provide more features & the most realistic sound in the products that includes high-end systems high-fidelity, and feature rich low-end systems.

The rising demand for technologically improved digital signal processing has helped in using DSPs at various places or devices, which further supports market growth in the audio DSP market. The market for audio DSP is estimated to acquire great opportunities due to the high-performance communication systems that are cost-efficient. The implementation of DSP chips in the consumer electronics market segment has bolstered the adoption of audio DSP on a huge scale.

The switch of people from old devices to advance or smart devices, like tablets and laptops, has surged the requirement of optimal consumption of power that has shifted the focus to audio DSPs. Due to the stimulating real-time obstacles, there has been a drift noticed in the last few years, on performance, which has been the most important parameter for comparing audio DSP quality. With the faster implementation of audio DSP in military to cost effective applications of audio DSP in smart gadgets such as cell phones, laptops, and CD players with less consumption of power has become a vital aspect while choosing a DSP. The emerging audio DSP market is recently revolving around the flexibility of systems to support functionality changes of these systems, at certain point of the design life cycle. Hence, the DSP market is estimated to witness new growth avenues due to the advent of modern or advanced technologies & developments.

The Phones market dominated the Malaysia Audio DSP Market by End Use 2019, thereby, achieving a market value of $134.5 million by 2026. The IoT market is exhibiting a CAGR of 15.7% during (2020 - 2026). Additionally, The Home Entertainment market is poised to grow at a CAGR of 14% during (2020 - 2026).

Based on Type, the market is segmented into Integrated and Discrete. Based on End User, the market is segmented into Phones, IoT, Home Entertainment, Computer, True Wireless Earphones, Smart Homes, Wearables and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Broadcom, Inc., Intel Corporation, NXP Semiconductors N.V., Qualcomm, Inc., Renesas Electronics Corporation, Texas Instruments, Inc., Toshiba Corporation, Advanced Micro Devices, Inc. (Xilinx, Inc.), and CEVA, Inc.

Scope of the Study

Market Segmentation:

By Type
  • Integrated
  • Discrete

By End User
  • Phones
  • IoT
  • Home Entertainment
  • Computer
  • True Wireless Earphones
  • Smart Homes
  • Wearables
  • Others

By Country
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific

Companies Profiled
  • Analog Devices, Inc.
  • Broadcom, Inc.
  • Intel Corporation
  • NXP Semiconductors N.V.
  • Qualcomm, Inc.
  • Renesas Electronics Corporation
  • Texas Instruments, Inc.
  • Toshiba Corporation
  • Advanced Micro Devices, Inc. (Xilinx, Inc.)
  • CEVA, Inc.

Unique Offerings from the Publisher
  • Exhaustive coverage
  • Highest number of market tables and figures
  • Subscription based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Audio DSP Market, by Type
1.4.2 Asia Pacific Audio DSP Market, by End User
1.4.3 Asia Pacific Audio DSP Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Geographical Expansions
3.2.4 Acquisition and Mergers
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2016-2020)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions : 2016, Jun - 2021, Feb) Leading Players
Chapter 4. Asia Pacific Audio DSP Market by Type
4.1 Asia Pacific Audio DSP Market Integrated Market by Country
4.2 Asia Pacific Audio DSP Market Discrete Market by Country
Chapter 5. Asia Pacific Audio DSP Market by End Use
5.1 Asia Pacific Phones Audio DSP Market by Country
5.2 Asia Pacific IoT Audio DSP Market by Country
5.3 Asia Pacific Home Entertainment Audio DSP Market by Country
5.4 Asia Pacific Computer Audio DSP Market by Country
5.5 Asia Pacific True Wireless Earphones Audio DSP Market by Country
5.6 Asia Pacific Smart Homes Audio DSP Market by Country
5.7 Asia Pacific Wearables Audio DSP Market by Country
5.8 Asia Pacific Other End Use Audio DSP Market by Country
Chapter 6. Asia Pacific Audio DSP Market by Country
6.1 China Audio DSP Market
6.1.1 China Audio DSP Market by Type
6.1.2 China Audio DSP Market by End Use
6.2 Japan Audio DSP Market
6.2.1 Japan Audio DSP Market by Type
6.2.2 Japan Audio DSP Market by End Use
6.3 India Audio DSP Market
6.3.1 India Audio DSP Market by Type
6.3.2 India Audio DSP Market by End Use
6.4 South Korea Audio DSP Market
6.4.1 South Korea Audio DSP Market by Type
6.4.2 South Korea Audio DSP Market by End Use
6.5 Singapore Audio DSP Market
6.5.1 Singapore Audio DSP Market by Type
6.5.2 Singapore Audio DSP Market by End Use
6.6 Malaysia Audio DSP Market
6.6.1 Malaysia Audio DSP Market by Type
6.6.2 Malaysia Audio DSP Market by End Use
6.7 Rest of Asia Pacific Audio DSP Market
6.7.1 Rest of Asia Pacific Audio DSP Market by Type
6.7.2 Rest of Asia Pacific Audio DSP Market by End Use
Chapter 7. Company Profiles
7.1 Analog Devices, Inc.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Regional Analysis
7.1.4 Research & Development Expenses
7.1.5 Recent strategies and developments
7.1.5.1 Acquisition and Mergers
7.1.5.2 Product Launches and Product Expansions
7.1.5.3 Geographical Expansions
7.1.6 SWOT Analysis
7.2 Broadcom, Inc.
7.2.1 Company Overview
7.2.1 Financial Analysis
7.2.2 Segmental and Regional Analysis
7.2.3 Research & Development Expense
7.2.4 Recent strategies and developments
7.2.4.1 Partnerships, Collaborations, and Agreements
7.2.5 SWOT Analysis
7.3 Intel Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research & Development Expenses
7.3.5 Recent strategies and developments
7.3.5.1 Product Launches and Product Expansions
7.3.6 SWOT Analysis
7.4 NXP Semiconductors N.V.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments
7.4.5.1 Product Launches and Product Expansions
7.4.5.2 Partnerships, Collaborations, and Agreements
7.4.6 SWOT Analysis
7.5 Qualcomm, Inc.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments
7.5.5.1 Acquisition and Mergers
7.5.5.2 Product Launches and Product Expansions
7.5.5.3 Partnerships, Collaborations, and Agreements
7.5.6 SWOT Analysis
7.6 Renesas Electronics Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expense
7.6.5 Recent strategies and developments
7.6.5.1 Acquisition and Mergers
7.6.5.2 Partnerships, Collaborations, and Agreements
7.7 Texas Instruments, Inc.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expense
7.7.5 Recent strategies and developments
7.7.5.1 Product Launches and Product Expansions
7.7.6 SWOT Analysis
7.8 Toshiba Corporation
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research and Development Expense
7.8.5 Recent strategies and developments
7.8.5.1 Partnerships, Collaborations, and Agreements
7.8.6 SWOT Analysis
7.9 Advanced Micro Devices, Inc. (Xilinx, Inc.)
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expenses
7.9.5 Recent strategies and developments
7.9.5.1 Product Launches and Product Expansions
7.10. CEVA, Inc.
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Regional Analysis
7.10.4 Research & Development Expense
7.10.5 Recent strategies and developments
7.10.5.1 Product Launches and Product Expansions
7.10.5.2 Partnerships, Collaborations, and Agreements

Companies Mentioned

  • Analog Devices, Inc.
  • Broadcom, Inc.
  • Intel Corporation
  • NXP Semiconductors N.V.
  • Qualcomm, Inc.
  • Renesas Electronics Corporation
  • Texas Instruments, Inc.
  • Toshiba Corporation
  • Advanced Micro Devices, Inc. (Xilinx, Inc.)
  • CEVA, Inc.

Methodology

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