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High Performance Substrates For Automotive Applications 2006-2012
BPA Consulting, May 2007
With the increasing electronic content of the average vehicle and the exacting future requirements substrates, are a key component to facilitate increase automotive vehicle functionality. This report reviews the in-vehicle applications driving developments in this market sector and investigates the requirements for a range of advanced and novel substrates from flexible and flex-rigid to multilayer, microvia, thick copper, low loss high performance and ceramic.
The report will provide substrate technology roadmaps for key applications and forecast of demand for specific PCBs by type and by region. Some of the key issues to be addressed in this report are thermal dissipation, high density interconnect and the bus protocols which enable higher data rates to accommodate the increased functionality. Contributing to this functionality are telematics applications such as satellite navigation, location-based services, remote diagnostics, emergency assist, airbag deployment notification, internet access, mobile TV and Bluetooth. Other applications such as passenger comfort and infotainment place demands on interconnect in the cabin as well as under the hood and behind the dashboard.
The plan by North America and Europe to tag all vehicles for distance tolling and emergency assist will further add to the electronic content of each vehicle. This study presents an up to date current assessment and future forecast of how the key substrate technologies will evolve. The research program involved BPA in interviewing substrate suppliers, end users, EMS and ODM companies, materials and process equipment developers. In addition to this, BPA has used its proven and reliable forecasting techniques to predict the future structure and size of this exciting sector.
This report will be of interest to all those who participate or are interested in participating in the automotive supply chain from assemblers, fabricators and laminate material suppliers.
Importance of this Report
-High performance substrates are key components in future generations of
electronic system design, development and IC packaging for the automotive
-The market for printed circuit boards for the automotive sector has increased from
$1.85 billion in 2001 to more than $2.6 billion in 2006.
-Between 2006 and 2012 it is expected to double to over $5 billion by 2012.
-Environmental considerations will impact on electronics design and the materials
used in vehicle manufacture.
Benefits to You
-This study provides a totally integrated assessment of the global automotive advanced substrate supply chain.
-Identifies opportunities for small, medium and large players
-Identifies the technologies, materials and processes that you will need to participate in these markets
-Identifies winning strategies for successful players
1. EXECUTIVE SUMMARY
Background to Study
Classification of Regions
3. AUTOMOTIVE ELECTRONICS
REQUIRING ADVANCED SUBSTRATES
Power and Under Hood
Safety and Security
4. SUBSTRATE TECHNOLOGIES AND
Rigid and Microvia
5. STANDARDS AND RELIABILITY
6. MARKET FORECASTS 2006-2012
Automotive Market For Flexible And Flexrigid
Automotive Market For Rigid And Microvia
Automotive Market For Low Loss Pcbs
Automotive Market For Ceramic
Demand For Automotive Substrates By
7. KEY PLAYERS
The Impact of EMS and ODMs on the
Future Market Structure