High Value Flex and Flex-Rigid Substrates Market Opportunities 2006-2012

BPA Consulting, April 2007

The purpose of this report is to review in more details those applications which belong to the high-end substrate segment. These will be applications where technology requirements are more demanding such as finer features, high layer counts, thinner materials, applications where military standards for reliability must apply or where a new market is emerging.

This study will present an up to date current assessment and forecast of how the key substrate technologies will evolve. The report will review specific applications driving substrate developments in four key market sectors and illustrate this with substrate technology roadmaps and market forecasts for the key applications. Key applications reviewed include optical sub-assemblies, fine featured flex for medical ultrasound, multilayer flex in missiles, FB-DIMM packaging technology and high-speed flex data interconnects.

The research program involved interviewing substrate suppliers, end users, EMS and ODM companies, materials and process equipment developers. In addition to this, the report authors have used their proven and reliable forecasting techniques to predict the future structure and size of this exciting sector.

This report will be of interest to all those who participate or are interesting in participating in the lower volume, higher value supply chain including assemblers, fabricators and laminate material supplier

Importance of this Report

-High value flex and flex-rigid substrates are key components in future generations of electronics for certain medical, military, aerospace, computer and communications applications

-The market for flex and flex-rigid printed circuit boards for all sectors has increased from $2 billion in 2001 to more than $7
billion in 2006. The higher-value segment accounts for one-fifth of this.

Benefits to You

-Identifies higher-added-value opportunities for small, medium and large players

-Identifies and examines the technologies, materials and processes that you will need to participate in these markets

-Identifies winning strategies for successful players

1. EXECUTIVE SUMMARY

2. INTRODUCTION
Background to Study
Substrate Types
Classification of Regions

3. APPLICATIONS REQUIRING HIGH VALUE
FLEX AND FLEX-RIGID SUBSTRATES
Introduction
Medical
Imaging Detector Arrays
Infusion pumps
Portable Ultrasound
Hearing Aids
Pacemakers & Defibrillators
Military and Aerospace
Aircraft
Missiles
Satellite
Computer
FB-DIMM
Chip-Chip Interconnect
High Speed Data Links
Communications
High Speed Data Links
Optoelectronic Sub-Assemblies
RF Modules
TBGA

4. SUBSTRATE TECHNOLOGIES
Introduction
Flexible
Flex-Rigid

5. MATERIALS
Polyimide
LCP
PTFE
Other

6. STANDARDS AND RELIABILITY

7. MARKET FORECASTS 2006-2012
Introduction
Medical
Military and Aerospace
Computer
Communications

8. KEY PLAYERS
Introduction
OEM
ODM
Assembly
Fabricators
The Impact of EMS and ODMs on the Supply
Base
Regional Market
Future Market Structure

9. OPPORTUNITIES
Summary
Emerging Opportunities

GLOSSARY

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