In-Depth Analysis of the Global Semiconductor Landscape 2022-2026, Focusing on IC Design, Manufacturing, and OSAT Sectors Amidst Economic Challenges
This pack offers comprehensive insights into the IC design, IC manufacturing (foundry, memory), and IC OSAT (Outsourced Semiconductor Assembly and Testing) sectors, covering global, Taiwan, and China, along with their respective supply chains for the period 2022-2023 and beyond.
Despite adverse factors such as high inflation rates and the Russia-Ukraine war, the global semiconductor industry sustained double-digit growth throughout 2022, supported by higher revenue in the first half and robust sales of networking and data center chips. In 2023, the global semiconductor market is expected to have declined by 10.1% to US$516.1 billion under the influence of the overall macroeconomic environment. Among them, the memory IC sector has been the most affected this year. Fortunately, since the first quarter of 2023, major global memory IC manufacturers have implemented production reduction controls, stabilizing shipment prices. With an expected year-on-year growth of 46.3%, the memory IC sector is anticipated to reach US$134.3 billion in 2024 and continue high growth in 2025 and 2026, with year-on-year growth rates of 38.7% and 13.1%, respectively. This sector is expected to be a major driving force for the global semiconductor market growth in the next three years.
List of Topics
- Development of the global, China, and Taiwan IC design industry in 2022-2023, covering respective company rankings, their performance overview in 2022, and development strategies of major players such as Qualcomm, MediaTek, Nvidia, AMD, Broadcom, Marvell, Huawei Hisilicon, Unisoc, GigaDevice, Will Semiconductor, etc.
- Development of the global and Taiwan semiconductor foundry industry in 2022-2023, addressing respective foundry rankings, their performance overview in 2022, and development strategies of key players such as TSMC, Samsung, UMC, PSMC, VSI (Vanguard), SMIC, GlobalFoundries, etc.
- Development of the global, China, and Taiwan IC OSAT (Outsourced Semiconductor Assembly and Testing) industry in 2022-2023, including respective foundry rankings, their performance overview, and development strategies of key players such as ASE, PTI, KYEC, Amkor, JCET, Tongfu Microelectronics, Huatian Technology, etc.
Table of Contents
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Alchip
- Amazon
- AMD
- Amkor
- Apple
- Ardentec
- ASE Group
- ASE Holdings
- ASEN Semiconductors
- Baidu
- Biren
- Bitmain
- Bosch
- Broadcom
- Cadence
- China Wafer Level
- Chipmore Technology
- ChipMOS
- Chrysler
- DB HiTek
- Dell
- Denso
- Episil
- Faraday
- FlipChip International
- FocalTech
- Ford
- Forehope Electronic
- Formosa Advanced
- Geely
- General Motors
- GigaDevice
- Global Unichip
- GlobalFoundries
- Hana Microelectronics
- Himax
- HiSilicon
- Hongxin Semiconductor
- HP
- HSMC
- Hua Hong Semiconductor
- Huahong Group
- Huatian Technology
- Huawei
- Huawei HiSilicon
- Infineon
- Intel
- Inventec
- JCET (Jiangsu Changjiang Electronics Technology Co., Ltd.)
- Jinan Quanxin
- Kore Semiconductor
- KYEC (King Yuan Electronics Co., Ltd.)
- Lingsen Precision
- Macronix
- Marvell
- MediaTek
- Micron
- Mosel
- Nanya Technology
- Nepes
- Nexchip
- Novatek
- Nuvoton
- Nvidia
- NXP
- OmniVision
- Onsemi
- Open AI
- Orient Semiconductor
- Payton Technology
- Powertech Technology
- PSMC (Powerchip Semiconductor Manufacturing Corporation)
- PTI (Powertech Technology Inc.)
- Qorvo
- Qualcomm
- Quanta
- RDA Microelectronics
- Realtek
- Samsung
- SFA
- Siemens
- Sigurd Microelectronics
- Silead
- Siliconware
- SJ Semiconductor
- SK Hynix
- Skyworks
- SMIC (Semiconductor Manufacturing International Corporation)
- Sony
- Spreadtrum
- STATS ChipPAC
- STMicroelectronics
- Sunplus
- Supermicro
- Synopsys
- Texas Instruments
- Tongfu Electronics
- Tongfu Microelectronics
- Tower
- Tsinghua Unigroup
- TSMC (Taiwan Semiconductor Manufacturing Company)
- UMC (United Microelectronics Corporation)
- Unimos Microelectronics
- Unisem
- Unisoc
- Unitech Holdings
- UTAC
- VIS
- VSI (Vanguard)
- Walton Advanced Engineering
- Will Semiconductor
- Winbond
- Wise Road Capital
- Wistron
- Xilinx
- YTEC
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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