Rapid Thermal Processing and beyond: Applications in Semiconductor Processing
Trans Tech Publications Inc, September 2008, Pages: 448
Special topic volume with invited papers only.
Heat-treatment and thermal annealing are very common processing steps which have been employed during semiconductor manufacturing right from the beginning of integrated circuit technology. In order to minimize undesired diffusion, and other thermal budget-dependent effects, the trend has been to reduce the annealing time sharply by switching from standard furnace batch-processing (involving several hours or even days), to rapid thermal processing involving soaking times of just a few seconds. This transition from thermal equilibrium, to highly non-equilibrium, processing was very challenging and is still a field ripe for further development.
This special-topic book, “Rapid Thermal Processing and Beyond: - Applications in Semiconductor Processing” focuses on various aspects of Rapid Thermal and Millisecond Annealing and is arranged so as to follow the major processing steps involved in high-performance transistor fabrication, without claiming to be a complete catalogue of all of the Rapid Thermal Processing (RTP) steps currently in use.
Starting with the silicon wafer-material itself and emphasizing various aspects of devices, from advanced gate dielectrics to source/drain engineering, the issue ends with a summary of fully silicided gates. Moreover, thermal processing development over the past 30 years is highlighted for full-wafer millisecond annealing, laser annealing and high-volume production RTP systems. The latest insights into surface cleaning for nanotechnology as well as Secondary Ion Mass Spectrometry are also discussed. Experts from most of the leading semiconductor and equipment companies and research institutes contributed to this review of the latest rapid thermal processing innovations. This makes it truly a state-of-the-art compendium.
Preface of Wilfried Lerch, Juergen Niess v
Personal Memories of István Bársony vii
Zsolt Nényei: An Early Pioneer in Rapid Thermal Processing of Fred Roozeboom xi
Dedication about Dedication of Bob MacKnight xiii
Chapter 1: Historical RTP Review
The Expanding Role of Rapid Thermal Processing in CMOS Manufacturing
J. Nakos and J. Shepard
Evolution of Commercial RTP Modules
B. Peuse
Chapter 2: Wafer Parameter Tuning and Defects
Fast Diffusion in Germanium and Silicon Investigated by Lamp-Based
Rapid Thermal Annealing
N. Stolwijk, L. Lerner, A. Giese and W. Lerch
Rapid Thermal Processing and the Control of Oxygen Precipitation Behaviour
in Silicon Wafers
R. Falster and V. Voronkov
High Temperature RTP Application in SOI Manufacturing
C. Maleville, E. Neyret, D. Delprat and L. Ecarnot
Chapter 3: Surface Preparation and Gate Dielectrics
Cleaning of Silicon Surfaces for Nanotechnology
O. Senftleben, H. Baumgärtner and I. Eisele
Heavy Water in Gate Stack Processing
A.E. Pap, C. Dücso, K. Kamarás, G. Battistig and I. Bársony
Advanced Gate Dielectric Development for VLSI Technology
Y. Ma
A Growth Kinetics Model for the Radical Oxidation of Silicon
O. Storbeck, W. Pethe and R. Hayn
Investigation of Ultra Thin Thermal Nitrided Gate Dielectrics in Comparison to Plasma Nitrided Gate Dielectrics for High-Performance Logic Application for 65nm
M. Trentzsch, C. Golz, K. Wieczorek, R. Stephan, T. Mantei, B. Bayha, S. Ohsiek,
M. Raab, Z. Nenyei, W. Lerch, J. Niess, W. Dietl, C. Kirchner and G. Roters
High-K: Latest Developments and Perspectives
A.J. Bauer, M. Lemberger, T. Erlbacher and W. Weinreich
Production Worthy ALD in Batch Reactors
A. Gschwandtner
Chapter 4: USJ Formation and Metrology
Ultra Shallow Depth Profiling with SIMS
H.-U. Ehrke
Implant Annealing – An Evolution from Soak over Spike to Millisecond Annealing
S. Paul and W. Lerch
A Light-Induced Annealing of Silicon Implanted Layers
B. Lojek
Laser Annealing of Implanted Semiconductor Layers - One Bridge to Nano-Processing
H.D. Geiler
An Overview of ms Annealing for Deep Sub-Micron Activation
J.C. Gelpey, S. McCoy, D. Camm and W. Lerch
Extended Defects Evolution in Pre-Amorphised Silicon after
Millisecond Flash Anneals
F. Cristiano, E.M. Bazizi, P.F. Fazzini, S. Boninelli, R. Duffy, A. Pakfar,
S. Paul and W. Lerch
Modeling and Simulation of Advanced Annealing Processes
A. Martinez-Limia, P. Pichler, C. Steen, S. Paul and W. Lerch
Vacancy Engineering - An Ultra-Low Thermal Budget Method for High-Concentration 'Diffusionless' Implantation Doping
N.E.B. Cowern, A.J. Smith, N. Bennett, B.J. Sealy, R. Gwilliam, R.P. Webb,
B. Colombeau, S. Paul, W. Lerch and A. Pakfar
Ultra-Shallow Junction Formation Using Rapid Thermal Processing
A. Jain
Ultra-Rapid Thermal Process for ULSIs
K. Suguro
Advanced Millisecond Annealing Technologies and its Applications and Concerns on Advanced Logic LSI Fabrication Processes
M. Kase, T. Yamamoto and T. Kubo
Doping Strategies for FinFETs
B.J. Pawlak, R. Duffy and A. De Keersgieter
Chapter 5: Advanced Silicides Formation
RTP Requirements for CMOS Integration of Dual Work Function Phase Controlled Ni- FUSI (Fully Silicided) Gates with Simultaneous Silicidation of nMOS (NiSi) and pMOS (Ni- Rich Silicide) Gates on HfSiON
A. Lauwers, J. Kittl and K. Maex
Chapter 6: Pattern Effects
A Short History of Pattern Effects in Thermal Processing
P.J. Timans
Conduction Heating in RTP Fast, and Pattern-Independent
E. Granneman
Advanced Annealing Schemes for High-Performance SOI Logic Technologies
T. Feudel
Chapter 7: Temperature Measurement Model Based Measurement in Advanced Rapid Thermal Processing
C. Merkl and R. Bremensdorfer
Chapter 8: Flash Annealing for ULSI and Beyond Si Short Time Thermal Processing: From Electronics via Photonics to Pipe Organs of the 17th Century
W. Skorupa .
Author Index
Keyword Index
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