Research and Markets


Printer Friendly

Printed from http://www.researchandmarkets.com/reports/681813


World Solder Paste, Solder Preform and Surface Mount Adhesives Market


Description: This research service covers the World surface mount technology (SMT) solder paste, solder preform and surface mount adhesives. Market dynamics delving into market challenges, drivers and restraints have also been investigated. Revenue forecasts by geographic region, pricing and distribution trends are looked into. This research also covers the competitive framework and market share analysis of the industry participants.

This Frost & Sullivan research service titled World Solder Paste, Solder Preform and Surface Mount Adhesives Market provides an overview of these markets along with analysis of key drivers, restraints, and challenges. In this research, Frost & Sullivan's expert analysts thoroughly examine the trends impacting the vendors and the expected revenues for different geographical regions.

World Solder Paste, Solder Preform and Surface Mount Adhesives Markets Geared for Growth with High Demand from Electronics Sector

The solder perform market has evolved steadily over the years, adapting to the varying needs and changing requirements of end users. The escalation in demand for consumer electronics, automotive electronics, aerospace engineering, and medical devices has contributed to the proliferation of in surface mount technology (SMT) assembly lines around the world. Also, the increase in printed circuit board (PCB) complexity has augmented the growth of flexible and accurate flue glass dispensers. The market for solder preforms is expected to follow an upward trajectory in the years to come as they greatly reduce complexity and produce robust end products. Both the solder paste and the solder perform segments are expected to develop at a steady pace with a compound annual growth rate (CAGR) of 11.7 percent and 6.8 percent from 2008 to 2014 respectively.

The electronic industry has been gravitating toward lead-free products. “The future of solder is lead-free” notes the analyst of this research service. “With government regulations in effect and demand for environment friendly products from end users, the revenues for lead-free solder product types – Rosin, Water-washable, and No-clean – are expected to increase substantially.” In order to meet regional compliance regulations, assembly manufacturers are opting for lead-free solders. Solder performs are gaining acceptance as they come in tape and reel packaging, and can be placed using pick and place equipment. The market is poised for further expansion as it has the capability to support high-end technologies, keeping abreast of the latest innovations in the electronics industry.

Rising Raw Material Costs prove Challenging for Solder Manufacturers

The markets are facing an unprecedented period of volatility, and solder manufacturers are battling high raw material prices. The cost of tin and silver has touched a 19-year high, and the industry must understand the impact of skyrocketing costs on the supply of solder alloys. The ripple effects have been felt on the soldering materials supply chain, which is already stretched to its limits due to pricing pressures. Absorbing increased costs of such magnitudes will be a daunting task for market participants but competitive pricing is crucial for generating sales. “Many companies have undertaken a spend analysis initiative, which is a process of collecting and categorizing expenditure data to gain far greater visibility into how and where procurement dollars are spent,” notes the analyst. “This is accompanied by a strategic sourcing effort.” The companies re-look at their procurement strategies to manage the supply chains down to the raw material level. Procurement strategies ideally suited for the product need to be revamped to help manage the supply chain.

Quality, reliability, and ease-of-use are important purchase criteria for end users. There is a distinct preference for high-level automation and flexible equipment that can match up to the design requirements of the PCB. Great stakes are placed on the quality of after sales service provided by the manufacturer. Apart from trying to expand their share in a market where demand is on an upward swing, participants must focus on maintaining their customer base. Most manufacturers rely on high brand equity that they enjoy to be sure of repeat business.


Contents: 1 WORLD SOLDER PASTE MARKET

Introduction
- Market Overview
- Market Definition

Market Dynamics
- Market Engineering Measurements
- Industry Challenges
- Market Drivers
- Market Restraints

Total Revenue and Forecasts
- Revenue Forecasts for the World Solder Paste Market
- Revenue Forecasts for North America
- Revenue Forecasts for Europe
- Revenue Forecasts for Asia Pacific
- Revenue Forecasts for Rest-of-World

Revenue Forecasts by Product Type
- Revenue Forecasts for World Lead-free Solder Paste
- Revenue Forecasts for World No-clean Solder Paste
- Revenue Forecasts for World Rosin Activated Solder Paste
- Revenue Forecasts for World Water Soluble Solder Paste

Trends
- Pricing Trends
- Distribution Trends
- Technology Trends

Competitive Analysis
- Competitive Structure
- Market Share Analysis

2 WORLD SOLDER PREFORM MARKET

Introduction
- Market Overview
- Market Definitions

Market Dynamics
- Market Engineering Measurements
- Industry Challenges
- Market Drivers
- Market Restraints

Revenue Forecasts
- Revenue forecasts for the World
- Revenue Forecasts for North America
- Revenue forecasts for Europe
- Revenue forecasts for Asia Pacific
- Revenue forecasts for Rest-of-World

Competitive Analysis
- Competitive Structure
- Market Share Analysis

3 WORLD SURFACE MOUNT ADHESIVES MARKET

Introduction
- Market Overview
- Market Definitions

Market Dynamics
- Market Engineering Measurements
- Industry Challenges
- Market Drivers
- Market Restraints

Total Revenue and Forecasts
- Revenue Forecasts for the World
- Revenue Forecasts for North America
- Revenue forecasts for Europe
- Revenue forecasts for Asia Pacific
- Revenue forecasts for Rest-of-World

Competitive Analysis
- Competitive Structure
- Market Share Analysis

4 APPENDIX

DSD Tables
- World PCB Sales
- World Mobile Subscriber Base
- World Television Installed Base
- World Total PC Installed Base




Ordering: Order Online - visit http://www.researchandmarkets.com/reports/681813

Order by Fax - using the order form below

Order By Post - print the order form below and send to

Research and Markets,
Guinness Centre,
Taylors Lane,
Dublin 8,
Ireland.


Research and Markets Page 1 of 2
Printed 27/11/2009 09:40:35
Fax Order Form
To place an order via fax simply print this form, fill in the information below and fax the completed form to
646-607-1907 (from USA) or +353 1 6849977 (from Rest of World). If you have any questions please email help@researchandmarkets.net

Order information
Please verify that the product information is correct and select the format you require.
Product Name:
World Solder Paste, Solder Preform and Surface Mount Adhesives Market

Web Address:
http://www.researchandmarkets.com/reports/681813

Office Code:
OC8HJNPOUMUXU

Report formats
Please enter the quantity of the report format you require.

Format Quantity Price
Electronic (PDF) - Site License €4,030.00
Electronic and Hard Copy (PDF) - Site License €4,365.00 + EUR€ 50.00 Shipping/Handling *
Electronic (PDF) - Enterprisewide €5,037.00
Electronic and Hard Copy (PDF) - Enterprisewide €5,373.00 + EUR€ 50.00 Shipping/Handling *
* Shipping/Handling is only charged once per order.


Contact information
Please enter all the information below in BLOCK CAPITALS.

First Name:   Last Name:  
Email Address:
Job Title:
Organisation:
Address:
City:
Postal/Zip Code:
Country:
Phone Number:
Fax Number:


Please fax this form to:
(646) 607-1907 or (646) 964-6609 (from USA)
+353-1-481-1716 or +353-1-653-1571 (from Rest of World)
Research and Markets Page 2 of 2
Printed 27/11/2009 09:40:35


Payment information

Please indicate the payment method you would like to use by selecting the appropriate box.

 Pay by Credit Card:
American Express
Diners Club
Master Card
Visa
Cardholder's Name:
Cardholder's Signature:
Expiry Date: /
Card Number:
CVV Security Code:
Issue Date: /   (Diners Club only)


 Pay by Check:
Please post the check, accompanied by this form, to:

Research and Markets,
Guinness Centre,
Taylors Lane,
Dublin 8,
Ireland.


 Pay by Wire Transfer:
Please transfer funds to:

Account number: 83313083
Sort code: 98-53-30
Swift code: ULSBIE2D
IBAN number: IE78ULSB98533083313083
Bank Address: Ulster Bank,
27-35 Main St,
Blackrock,
Co. Dublin,
Ireland.
If you have a Marketing Code please enter it below:
Marketing Code:


Please note that by ordering from Research and Markets you are agreeing to our Terms and Conditions at http://www.researchandmarkets.com/info/terms.asp

Please fax this form to:
(646) 607-1907 or (646) 964-6609 (from USA)
+353-1-481-1716 or +353-1-653-1571 (from Rest of World)