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Advanced Integrated Communication Microsystems. Wiley Series in Microwave and Optical Engineering

  • ID: 992683
  • March 2009
  • Region: Global
  • 474 Pages
  • John Wiley and Sons Ltd

Learn the fundamentals of integrated communicationmicrosystems

Advanced communication microsystems the latest technologyto emerge in the semiconductor sector aftermicroprocessors require integration of diverse signalprocessing blocks in a power–efficient and cost–effective manner.Typically, these systems include data acquisition, data processing,telemetry, and power management. The overall development is asynergy among system, circuit, and component–level designs with astrong emphasis on integration.

This book is targeted at students, researchers, and industrypractitioners in the semiconductor area who require a thoroughunderstanding of integrated communication microsystems from adeveloper's perspective. The book thoroughly and carefullyexplores:

Fundamental requirements of communication microsystems

System design and considerations for wired and wirelesscommunication microsystems

Advanced block–level design techniques for communicationmicrosystems

Integration of communication systems in a hybrid environment

Packaging considerations

Power and form factor trade–offs in building integratedmicrosystems

Advanced Integrated Communication Microsystems is an idealtextbook for advanced undergraduate and graduate courses. It alsoserves as a valuable reference for researchers and practitioners incircuit design for telecommunications and related fields.

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Chapter 1: Fundamentals of Communication Systems.


1.1 Communication systems.

1.2 History and Overview of Wireless Communication Systems.

1.3 History and Overview of Wired Communication Systems.

1.4 Communication System Fundamentals.

1.5 Electromagnetics.

1.6 Analysis of circuits and systems.

1.7 Broadband,wideband and narrowband systems.

1.8 Semiconductor technology and devices.

1.9 Key circuit topologies.

1.10 Gain/Linearity/Noise.


Chapter 2: Wireless Communication SystemsArchitectures.


2.1 Fundamental considerations.

2.2 Link Budget Analysis.

2.3 Propagation Effects.

2.4 Interface Planning.

2.5 Superheterodyne architecture.

2.6 Low IF architecture.

2.7 Direct conversion architecture.

2.8 Two stage direct conversion.

2.9 Current mode architecture.

2.10 Subsampling architecture.

2.11 Multi–band direct conversion radio.

2.12 Polar modulator.

2.13 Harmonic reject architectures.

2.14 Practical considerations for transceiver integration.


Chapter 3: Systems Architectures for High Speed WiredCommunications.

3.1 Introduction.

3.2 Band–limited channel.

3.3 Equalizer system study.


Chapter 4: Mixed Signal Communication Systems BuildingBlocks.


4.1 Inverters.

4.2 Static D flipflop.

4.3 Bias circuits.

4.4 Transconductor cores.

4.5 Load networks.

4.6 A versatile analog signal processing core.

4.7 Low noise amplifier.

4.8 Power amplifiers.

4.9 Balun.

4.10 Signal Generation Path.

4.11 Mixers.

4.12 Baseband filters.

4.13 Signal strength indicator (SSI).

4.14 ADC/DAC.


Chapter 5 Examples of Integrated CommunicationMicrosystems.


5.1 Direct conversion receiver front–end.

5.2 Debugging: A practical scenario.

5.3 High speed wired communication example.



Chapter 6: Low voltage, low power and low areadesigns.


6.1. Power consumption considerations.

6.2 Device technology and scaling.

6.3 Low voltage design techniques.

6.4 Injection locked techniques.

6.5. Subharmonic architectures.

6.6. Superregenerative architectures.

6.7. Hearing aid applications.

6.8. Radio frequency identification tags.

6.9. Ultra low power radios.



Chapter 7: Packaging for Integrated CommunicationMicrosystems.


7.1. Background.

7.2 Elements of a package.

7.4 Driving Forces for RF Packaging Technology.

7.5 MCM Definitions and Classifications.

7.6 RF – SOP modules.

7.7 Package modeling and optimization.

7.8 Future packaging trends.

7.9 Chip Package Co–design.

7.10 Package models and transmission lines.

7.11 Calculations for package elements.

7.12 Cross–talk.

7.13 Grounding.

7.14 Practical issues in working with packages.

7.15 Chip–package codesign examples.

7.16 Wafer scale package.

7.17 Filters using bondwire.

7.18 Packaging Limitation.



Chapter 8: Advanced SOP Components and SignalProcessing.


8.1 History of compact design.

8.2 Previous Techniques in Performance Enhancement.

8.3 Design Complexities.

8.4 Modeling Complexities.

8.5 Compact Stacked Patch Antennas Using LTCC MultilayerTechnology.

8.6 Suppression of Surface Waves and Radiation PatternImprovement Using SHS Technology.

8.7 Radiation–Pattern Improvement Using a Compact Soft SurfaceStructure .

8.8 A Package–Level Integrated Antenna Based on LTCCTechnology.

Chapter 9: Characterization and Computer aided analysis ofintegrated microsystems.


9.1 Computer aided analysis of wireless systems.

9.2 Measurement equipments and their operation.

9.3 Network analyzer calibration.

9.4 Wafer probing measurement.

9.5 Characterization of integrated radios.

9.6 In the laboratory.

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Joy Laskar, PhD, holds the Schlumberger Chair inMicroelectronics in the School of Electrical and ComputerEngineering at Georgia Tech. He is also founder and Director of theGeorgia Electronic Design Center, where he heads a research groupthat focuses on the integration of high–frequency mixed–signalelectronics for next–generation wireless and wire line systems.

Sudipto Chakraborty, PhD, is a research staff member at TexasInstruments, where he is involved in architecting and designingadvanced system–on–chip mixed signal systems using silicon–basedtechnologies. He has authored or coauthored several technicalarticles, journals, and books, and has served on the technicalprogram committee for various IEEE conferences and journals.

Manos M. Tentzeris, PhD, is an Associate Professor in the Schoolof Electrical and Computer Engineering at Georgia Tech. He is alsothe Associate Director of the Georgia Electronic Design Center inthe area of RFID/Sensors and heads the ATHENA group, which focuseson 3D integration and packaging, multiband/ultrawideband antennasand antenna arrays, wearable/flexible inkjet–printed electronics,CNT/graphene, and integrable power scavenging.

Franklin Bien, PhD, is an Assistant Professor at Ulsan NationalInstitute of Science and Technology (UNIST), Korea, home forHyundai/Kia Motor Company. He cofounded and leads the UNISTElectronic Design Center (UEDC) focusing on analog/mixed–signal andRF ICs for wireless communications and ubiquitous connectivity forautomotive information technology applications.

Anh–Vu Pham, PhD, is a Professor at the University ofCalifornia, Davis, where he leads the Microwave Microsystems Lab.He has published extensively and received the National ScienceFoundation CAREER Award in 2001 and the 2008 Outstanding YoungEngineer Award from the IEEE Microwave Theory and TechniquesSociety. He cofounded RF Solutions and PlanarMag, Inc., and hasbeen an active consultant for industry.

Note: Product cover images may vary from those shown
Note: Product cover images may vary from those shown


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