ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis
System Plus Consulting, April 2012, Pages +: 100
- Physical Analysis of the Devices
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price
System Plus Consulting is proud to publish the reverse costing report of the latest 3-axis analog MEMS Gyroscope supplied by STMicroelectronics.
With an LGA package measuring 3.5x3x1mm, the L3G3250A features the smallest footprint of all the 3axis gyroscopes and succeed to the VTI CMR3000.
Compared to the main gyros for consumer applications in production today (4x4mm), the L3G3250A achieves a footprint reduction of nearly 35% and a volume reduction ranging from 27% to 40%.
The L3G3250A is suitable for various applications including Gaming and virtual reality input devices, motion control with MMI (man-machine interface),
GPS navigation systems, appliances and robotics.
This report provides complete teardown of the MEMS gyroscope with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Glossary
Overview/Introduction
- Executive Summary
-Reverse Costing Methodology
Company Profile
- STMicroelectronics Profil
- L3G3250A Characteristics
- Business Model
Physical analysis
- Package Characteristics & Markings
- Package X-Ray
- Package Cross-Section
- Package Opening
- ASIC – Dimensions
- ASIC – Markings
- ASIC – Cross-Section
- ASIC Process Characteristics
- MEMS – Dimensions
- MEMS – Markings
- MEMS – Bond Pads
- MEMS – Cap Opening
- MEMS – Sensing Area
- MEMS – Cross-section
- MEMS Process Characteristics
- Physical Data Summary
Manufacturing Process Flow
- Overview
- ASIC Process Flow
- MEMS Process Flow
- Description of the Wafer Fabrication Units
Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Yields Hypotheses
- Die per wafer & Probe Test
- ASIC Front-End : Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
- ASIC Die Cost
- MEMS Front-End : Hypotheses
- MEMS Front-End Cost
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Die Cost (Front End + Back End 0)
- Back-End 1 : Packaging Cost
- Back-End 1 : Final test & Calibration Cost
- L3G3250A Component Cost (FE + BE 0 + BE 1)
Estimated Price Analysis
Conclusion
Product Samples
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