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ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis - Product Image

ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis

  • ID: 2102019
  • April 2012
  • Region: Global
  • 100 Pages +
  • System Plus Consulting

- Physical Analysis of the Devices
- Step by Step Reconstruction of the Process Flow
- Cost of Manufacturing and Estimation of Selling Price

System Plus Consulting is proud to publish the reverse costing report of the latest 3-axis analog MEMS Gyroscope supplied by STMicroelectronics.

With an LGA package measuring 3.5x3x1mm, the L3G3250A features the smallest footprint of all the 3axis gyroscopes and succeed to the VTI CMR3000.
Compared to the main gyros for consumer applications in production today (4x4mm), the L3G3250A achieves a footprint reduction of nearly 35% and a volume reduction ranging from 27% to 40%.

The L3G3250A is suitable for various applications including Gaming and virtual reality input devices, motion control with MMI (man-machine interface),
GPS navigation systems, appliances and robotics.

This report provides complete teardown of the MEMS gyroscope with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Note: Product cover images may vary from those shown

Glossary

Overview/Introduction
- Executive Summary
-Reverse Costing Methodology

Company Profile
- STMicroelectronics Profil
- L3G3250A Characteristics
- Business Model

Physical analysis
- Package Characteristics & Markings
- Package X-Ray
- Package Cross-Section
- Package Opening
- ASIC – Dimensions
- ASIC – Markings
- ASIC – Cross-Section
- ASIC Process Characteristics
- MEMS – Dimensions
- MEMS – Markings
- MEMS – Bond Pads
- MEMS – Cap Opening
- MEMS – Sensing Area
- MEMS – Cross-section
- MEMS Process Characteristics
- Physical Data Summary

Manufacturing Process Flow
- Overview
- ASIC Process Flow
- MEMS Process Flow
- Description of the Wafer Fabrication Units

Cost Analysis
- Synthesis of the Cost Analysis
- Main Steps of Economic Analysis
- Yields Explanation
- Yields Hypotheses
- Die per wafer & Probe Test
- ASIC Front-End : Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
- ASIC Die Cost
- MEMS Front-End : Hypotheses
- MEMS Front-End Cost
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Die Cost (Front End + Back End 0)
- Back-End 1 : Packaging Cost
- Back-End 1 : Final test & Calibration Cost
- L3G3250A Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

Conclusion

Note: Product cover images may vary from those shown
Note: Product cover images may vary from those shown

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