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Global 3D IC Market 2014-2018 - Product Image

Global 3D IC Market 2014-2018

  • ID: 2408110
  • October 2014
  • Region: Global
  • 76 Pages
  • TechNavio

FEATURED COMPANIES

  • 3M Company
  • IBM
  • Micron Technology
  • Samsung Electronics
  • STATS ChipPAC
  • STMicroelectronics
  • MORE

About 3D IC

A 3D IC is an IC with multiple layers (more than two) of active electronic components which are integrated into a single circuit. These layers are integrated both vertically and horizontally. 3D ICs are the perfect solution for meeting the growing demand to minimize the size and reduce the cost of products in the Consumer Electronics segment. The transistor density is greater in 3D ICs than that in other ICs, which means that 3D ICs offer better performance. 3D technology emerged as a result of the continuous advancements being made in IC design. Some of the major applications of 3D ICs are in memory products (flash and DRAM), sensors, LEDs, and MEMS systems.

The analysts forecast the Global 3D IC market to grow at a CAGR of 18.4 percent over the period 2013-2018.

Covered in this Report
This report covers the present scenario and the growth prospects of the Global 3D IC market for the period 2014-2018. The report includes the overall revenue generated from the sales of 3D ICs. The 3D ICs that are discussed in this report are developed by using through-silicon via (TSV) interconnect technology. The report also presents the vendor landscape and a corresponding READ MORE >

FEATURED COMPANIES

  • 3M Company
  • IBM
  • Micron Technology
  • Samsung Electronics
  • STATS ChipPAC
  • STMicroelectronics
  • MORE

01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
05. Introduction
06. Market Landscape
06.1 Industry Overview
06.2 Technology Landscape
06.2.1 Monolithic
06.2.2 Wafer-on-wafer
06.2.3 Die-on-Wafer
06.2.4 Die-on-die
06.3 Market Size and Forecast
06.4 Five Forces Analysis
07. Market Segmentation by Product
07.1 Global 3D IC Market by Product 2013-2018
08. Market Segmentation by End-users
08.1 Global 3D IC Market by End-users 2013
09. Geographical Segmentation
09.1 Global 3D IC Market by Geographical Segmentation 2013-2018
09.2 Global 3D IC Market by Geographical Segmentation 2013-2018
09.3 3D IC Market in the APAC Region
09.3.1 Market Size and Forecast
09.4 3D IC in the Americas
09.4.1 Market Size and Forecast
09.5 3D IC Market in the EMEA Region
09.5.1 Market Size and Forecast
10. Key Leading Countries
10.1 US
10.2 China
10.3 South Korea
11. Buying Criteria
11.1.1 Consumer Electronics Sector
11.1.2 ICT Sector
11.1.3 Military, Aerospace, and Defense Sector
11.1.4 Automotive Sector
11.1.5 Others
12. Market Growth Drivers
13. Drivers and their Impact
14. Market Challengess
15. Impact of Drivers and Challenges
16. Market Trendss
17. Trends and their Impact
18. Vendor Landscape
18.1 Discussion about Key Vendors
18.1.1 Taiwan Semiconductor Manufacturing Co. Ltd.
18.1.2 Advanced Semiconductor Engineering
18.1.3 Samsung Electronics
18.1.4 STMicroelectronics
18.2 Other Prominent Vendors
18.2.1 Micron Technology
18.2.2 Xilinx
18.2.3 3M Company
18.2.4 STATS ChipPAC
18.2.5 United Microelectronics
18.2.6 IBM
19. Key Vendor Analysis
19.1 Advanced Semiconductor Engineering
19.1.1 Key Facts
19.1.2 Business Overview
19.1.3 Business Segmentation by Revenue 2013
19.1.4 Business Segmentation by Revenue 2012 and 2013
19.1.5 Geographical Segmentation by Revenue 2013
19.1.6 Business Strategy
19.1.7 Recent Developments
19.1.8 SWOT Analysis
19.2 Samsung
19.2.1 Key Facts
19.2.2 Business Overview
19.2.3 Business Segmentation by Revenue 2013
19.2.4 Business Segmentation by Revenue 2012 and 2013
19.2.5 Geographical Segmentation by Revenue 2013
19.2.6 Business Strategy
19.2.7 Recent Developments
19.2.8 SWOT Analysis
19.3 STMicroelectronics
19.3.1 Key Facts
19.3.2 Business Overview
19.3.3 Product Segmentation by Revenue 2013
19.3.4 Product Segmentation by Revenue 2012 and 2013
19.3.5 Geographical Segmentation by Revenue 2013
19.3.6 Business Strategy
19.3.7 Recent Developments
19.3.8 SWOT Analysis
19.4 Taiwan Semiconductor Manufacturing Company
19.4.1 Key Facts
19.4.2 Business Overview
19.4.3 Business Segmentation by Revenue 2013
19.4.4 Geographical Segmentation by Revenue 2013
19.4.5 SWOT Analysis
20. Market Summary
21. Other Reports in this Series

List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Global Semiconductor Market Overview 2013
Exhibit 3: Global NAND Flash Market Segmentation by Technology 2013-2018
Exhibit 4: Global 3D IC Market 2012-2016 (US$ billion)
Exhibit 5: Global 3D IC Market by Product Type 2013
Exhibit 6: Global 3D IC Market Segmentation by End-user 2013-2018
Exhibit 7: Global Spectrum Analyzer Market by End-user Segmentation 2013
Exhibit 8: Global 3D IC Market Segmentation by End-user 2013-2018
Exhibit 9: Global Smartphone Power Management IC Market by Geographical Segmentation 2013
Exhibit 10: Global 3D IC Market by Geographical Segmentation 2013-2018 (Percentage Split)
Exhibit 11: Global 3D IC Market by Geographical Segmentation 2013-2018 (by Revenue US$ billion)
Exhibit 12: CAGR Comparison between Geographies 2013-2018
Exhibit 13: 3D IC Market in the US 2013-2018 (US$ billion)
Exhibit 14: 3D IC Market in China 2013-2018 (US$ billion)
Exhibit 15: 3D IC Market in South Korea 2013-2018 (US$ billion)
Exhibit 16: CAGR Comparison of Key Leading Countries 2013-2018
Exhibit 17: Buying Criteria for Consumer Electronics Sector
Exhibit 18: Buying Criteria for ICT Sector
Exhibit 19: Buying Criteria for Military, Aerospace, and Defense Sector
Exhibit 20: Buying Criteria for Automotive Sector
Exhibit 21: Buying Criteria for Others
Exhibit 22: Advanced Semiconductor Engineering: Business Segmentation by Revenue 2013
Exhibit 23: Advanced Semiconductor Engineering: Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 24: Advanced Semiconductor Engineering: Geographical Segmentation by Revenue 2013
Exhibit 25: Samsung: Business Segmentation by Revenue 2013
Exhibit 26: Samsung: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
Exhibit 27: Samsung: Geographical Segmentation by Revenue 2013
Exhibit 28: STMicroelectronics: Product Segmentation by Revenue 2013
Exhibit 29: STMicroelectronics: Product Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 30: STMicroelectronics: Geographical Segmentation by Revenue 2013
Exhibit 31: Taiwan Semiconductor Manufacturing Company: Business Segmentation by Revenue 2013
Exhibit 32: Taiwan Semiconductor Manufacturing Company: Geographical Segmentation by Revenue 2013
Exhibit 33: Global 3D IC Market by Product Types 2013-2018
Exhibit 34: Global 3D IC Market by End-users 2013-2018

FEATURED COMPANIES

  • 3M Company
  • IBM
  • Micron Technology
  • Samsung Electronics
  • STATS ChipPAC
  • STMicroelectronics
  • MORE

Commenting on the report, an analyst from the team said: “One of the major trends upcoming in this market is the multi-chip packaging of 3D ICs, which allows the incorporation of numerous transistors. Multi-chip packaging has revolutionized the packaging method used for ICs.”

According to the report, one of the major growth drivers in this market is an increase in demand for 3D ICs in memory products such as flash memory and DRAM. 3D ICs improve the performance and reliability of memory products and also reduce their cost and size.

Further, the report states that one of the major challenges that the market faces is thermal conductivity issues associated with 3D ICs. The thermal conductivity of 3D ICs is low, which adversely affects the performance and durability of end-products.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

- Advanced Semiconductor Engineering
- Samsung Electronics
- STMicroelectronics
- Taiwan Semiconductor Manufacturing
- 3M Company
- IBM
- Micron Technology
- STATS ChipPAC
- United Microelectronics
- Xilinx

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