• +353-1-416-8900(GMT OFFICE HOURS)
  • 1-800-526-8630(US/CAN TOLL FREE)
  • 1-917-300-0470(EST OFFICE HOURS)
Global 3D IC Market 2012-2016 - Product Image

Global 3D IC Market 2012-2016

  • ID: 2408110
  • January 2013
  • Region: Global
  • 38 Pages
  • TechNavio

TechNavio's analysts forecast the Global 3D IC market to grow at a CAGR of 19.7 percent over the period 2012-2016. One of the key factors contributing to this market growth is the huge demand for memory-enhanced applications. The Global 3D IC market has also been witnessing the increase of multi-chip packaging. However, the thermal conductivity issues could pose a challenge to the growth of this market.

TechNavio's report, the Global 3D IC Market 2012-2016, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, and the EMEA and APAC regions; it also covers the Global 3D IC market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.

The key vendors dominating this market space are Advanced Semiconductor Engineering Co. (ASE), Samsung Electronics Co. Ltd., STMicroelectronics N.V., and Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC).

The other vendors mentioned in the report are Elpida Memory Inc., IBM Corp., Intel Corp., and Micron Technology Inc.

Key questions answered in this report:

What will the market size be in 2016 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

01. Executive Summary
02. Introduction
03. Market Coverage
Market Overview
Key Offerings
04. Market Landscape
04.1 Market Size by Revenue
04.2 Application Segmentation
04.3 End-user Segmentation
04.4 Five Forces Analysis
05. Geographical Segmentation
06. Key Leading Countries
The US
South Korea
07. Vendor Landscape
08. Buying Criteria
09. Market Growth Drivers
10. Drivers and Their Impact
11. Market Challenges
12. Impact of Drivers and Challenges
13. Market Trends
14. Key Vendor Analysis
14.1 Taiwan Semiconductor Manufacturing Co. Ltd.
Business Overview
Key Information
SWOT Analysis
14.2 Samsung Electronics Co. Ltd.
Business Overview
Key Information
SWOT Analysis
14.3 Advanced Semiconductor Engineering Co.
Business Overview
SWOT Analysis
14.4 STMicroelectronics N.V.
Business Overview
Key Information
SWOT Analysis
15. Other Reports in this Series

List of Exhibits:
Exhibit 1: Global 3D IC Market 2012-2016 (US$ billion)
Exhibit 2: Global 3D IC Market by Application Segmentation 2012
Exhibit 3: Global 3D IC Market by End-user Segmentation 2012
Exhibit 4: Global 3D IC Market by Geographical Segmentation 2012

TechNavio Announces the Publication of its Research Report - Global 3D IC Market 2012-2016

TechNavio today launched its report, Global 3D IC Market 2012-2016, based on an in-depth analysis exclusively covering the Americas, and the EMEA and APAC regions. The report aims to aid decision makers' understanding of the significant trends impacting the market.

Commenting on the report, an analyst from TechNavio's Hardware team said: 'One of the emerging trends in the Global 3D integrated circuit (IC) market is multi-chip packaging. In this type of packaging more transistors can be packed into a single 3D IC. This type of packaging is very important for memory-enhanced applications because this approach enables improved interaction between the memory and the processor. It is expected that multi-chip packaging will be a promising approach for most applications in the future. Thus, vendors consider that multi-chip packaging is one of the crucial trends that will lead to the growth of the Global 3D IC market.'

According to the report, one of the major growth drivers is the increasing demand for 3D ICs in memory products (flash memory and DRAM). 3D ICs are able to improve the performance and reliability of memory products and can also help reduce their cost and size.

Further, the report reveals that one of the major challenges is the thermal conductivity issues associated with 3D ICs.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Note: Product cover images may vary from those shown


Our Clients

Our clients' logos