Bosch Sensortec BMC150 6-Axis MEMS eCompass Reverse Costing Analysis

  • ID: 2771597
  • March 2014
  • Region: Global
  • 149 Pages
  • System Plus Consulting
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The BMC150 combines a 12-bit 3-Axis accelerometer and a wide-range 3-Axis geomagnetic sensor in a 2.2x2.2mm LGA package (the smallest footprint at its introduction). All the functionalities are developed and manufactured by Bosch.

Compared to its predecessor BMC050, the BMC150 achieve almost 50% footprint reduction. This reduction has been made possible by the integration of the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.

The magnetic sensor still uses Bosch FlipCore technology for X/Y-Axis sensing and Hall element for Z-Axis sensing. The MEMS accelerometer is also an evolution of the one found in BMC050.

The BMC150 is a very low power (190µA) and high resolution (0.3µT) 6-axis digital compass targeted for consumer mobile applications.


- Detailed Photos
- Precise Measurements
- Material Analysis
- Manufacturing Process Flow
- Supply Chain Evaluation
- Manufacturing Cost Analysis
- Selling Price Estimation

Note: Product cover images may vary from those shown
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Overview/Introduction , Bosch Company Profile

Physical Analysis

- Package
-- Package Views, Dimensions & X-Ray
-- Package Opening
-- Wire bonding Process
-- Package Cross-Section

- Accelerometer ASIC Die
-- View, Dimensions & Marking
-- Process Identification
-- Cross-Section

- Accelerometer MEMS Die
-- View, Dimensions & Marking
-- Bond Pad Opening & Bond Pad
-- Cap Removed & Cap Details
-- Sensing Area Details
-- Cross-Section (Sensor, Cap & Bonding)
-- Process Characteristics

- Magnetometer Die
-- View, Dimensions & Marking
-- Hall sensor and fluxgate sensors
-- Delayering
-- Main Blocks Identification
-- Cross-Section (CMOS & Sensor)

Manufacturing Process Flow
-- ASIC Accelero Front-End Process
-- MEMS Accelero Process Flow
-- Magnetometer Process Flow
-- Wafer Fabrication Unit
-- Packaging Process Flow
-- Package Assembly Unit

Cost Analysis
-- Main steps of economic analysis
-- Yields Hypotheses
-- ASIC Front-End Cost
-- ASIC Back-End 0 : Probe Test & Dicing
-- ASIC Wafer & Die Cost
-- MEMS Front-End Cost
-- MEMS Back-End 0 : Probe Test & Dicing
-- MEMS Wafer & Die Cost
-- Magnetometer CMOS Front-End Cost
-- Magnetometer Sensor Cost
-- Magnetometer Sensor Cost per process steps
-- Magnetometer Back-End 0 : Probe Test & Dicing
-- Magnetometer Wafer & Die Cost
-- Back-End : Packaging Cost
-- Back-End : Final Test Cost
-- BMC150 Component Cost

Estimated Price Analysis

Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown


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