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Flip-Chip Market and Technology Trends - 2013 Business Update - Product Image

Flip-Chip Market and Technology Trends - 2013 Business Update

  • ID: 2515294
  • March 2013
  • Region: Global
  • 326 Pages
  • Yole Développement

FEATURED COMPANIES

  • 3M
  • Chomerics
  • GLOBALFOUNDRIES
  • Lord Corporation
  • Optopac
  • STATS ChipPAC
  • MORE

Cu pillar and µbumping for memory, consumer electronics and mobile phones have reinvigorated the Flip-Chip market, enabling it to grow at a 19% rate and cater to the most advanced technologies, like 3DIC and 2.5D

Over the next five years, an incredible 3x wafer growth is expected for the Flip-Chip platform, which will reach 40M+ of 12’’eq wspy by 2018!

Despite its high 19% CAGR, Flip-chip is not new - in fact, it was first introduced by IBM over 30 years ago! As such, it would be easy to consider it an old, uninteresting, mature technology…but this is far from true! Instead, Flip-Chip is keeping up with the times and developing new bumping solutions to serve the most advanced technologies, like 3DIC and 2.5D. Indeed, no matter what packaging technology you're using, a bumping step is always required at the end!
In 2012, bumping technologies accounted for 81% of the total installed capacity in the middle-end area. That's big. Really big. So big that it represents 14M+ 12’’eq wafers (2012 installed capacity: see figure below) - and fab loading rates are high as well, especially for the Cu pillar platform (88%). Flip-Chip is also big READ MORE >

FEATURED COMPANIES

  • 3M
  • Chomerics
  • GLOBALFOUNDRIES
  • Lord Corporation
  • Optopac
  • STATS ChipPAC
  • MORE

Glossary

Report Scope
- What’s new?
- Report technology scope
- Report objectives
- Companies cited in the report

Executive summary
- General conclusions
- Flip-Chip market in 2012
- Flip-Chip market in 2018

Recent key press headlines

Flip-Chip market forecast
- Methodology
- Flip-Chip Activity – Wafer forecast
- - By metallurgy type
- - By area and end products
- Flip-Chip Activity – Unit forecast

Flip-Chip installed capacities
- Methodology
- 2012 installed capacities
- Recent activity and investments for FC
- Focus on PTI’s recent investment
- Matching 2012 top down and bottom up
- Summary

Flip-Chip market value
- Flip-Chip Market Value Forecast
- 2012 total Flip-Chip Market Value by COO segment
- 2012 total Flip-Chip Market Value by end use type
- 2012 Flip-Chip in package Market Value by COO segment
- 2018 total Flip-Chip Market Value by COO segment (forecast)

Infrastructure & supply chain
- Transforming golbal IC Packaging Supply Chain*
- Flip-Chip Supply Chain
- Typical Flip Chip Flow-Chart
- Flip Chip Supply Chain Ecosystem
- Business Model in Flip Chip Space
- Flip Chip Players
- Business cases and supply chain examples

Bumping technologies
- Overview of bumping technologies
- Focus on Cu pillar bumping
- µ-bumping for 2.5D/3DIC
- C2 & TCB – applications and trends

Assembly technologies
- Substrates
- Flip-Chip bonders
- TIM
- Underfills

Flip-Chip applications & market
- Memories
- Imaging
- 2D Logic SoC
- HB-LED
- Small logic, RF, Power, Analog and mixed signals ICs
- µ-bumping for 2.5D & 3D SiP/SoC

Conclusions & Perspectives

Presentation of Yole’s Activity

- 3M
- AdvanPack Solutions
- AEM Tec
- Ajinomoto
- Akita
- Altera
- AMD
- Amkor
- Apple
- Applied Materials
- ASE
- Asymtek
- Bergquist
- Carsem
- Casio Micronics
- Chipbond
- Chipmos
- Chomerics
- Cookson
- Dalsa
- Datacon
- Dek
- Denka
- Dow Chemical
- Dow Corning
- Elpida
- EM Microelectronic
- Epcos
- eSilicon
- FCI
- Fraunhofer IZM
- Fuji Polymer
- Fujitsu
- GLOBALFOUNDRIES
- Global Unichip
- Henkel
- Hitachi Chemical
- Honeywell
- Ibiden
- IBM
- IC interconnect
- IMI
- Indium Corporation
- Infineon
- Intel
- Ipdia
- JCAP
- J-devices
- Kinsus
- Kyocera
- LB Semicon
- Lord Corporation
- Lumileds
- Micrel
- Minami
- Murata
- Namics
- Nanium
- Nan Ya
- Nepes
- Nexx
- Nichia
- Nokia
- Nordson
- Nvidia
- NXP
- OKI
- Omnivision
- Optopac
- OSE
- Pactech
- Panasonic
- Polymatech
- PowerTech (PTI)
- Premier Semiconductor Services
- Qualcomm
- Renesas
- Samsung
- Samsung Electromechanics (SEMCO)
- Shibuya
- Shin Etsu
- Shinko Electric
- Silex Microsystems
- Siltech
- Sony Chemical
- SPIL
- STATS ChipPAC
- SK-Hynix
- STMicroelectronics
- Sumitomo
- TDK
- Tessera
- Texas Instruments
- Tong Hsing
- Toray
- Toshiba
- Triquint
- TSMC
- UMC
- Unimicron
- Unisem
- UTAC
- Xilinx
- Zymet

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