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STMicroelectronics LPS331AP - Reverse Costing Analysis - Product Image

STMicroelectronics LPS331AP - Reverse Costing Analysis

  • Published: June 2013
  • Region: Global
  • 115 Pages
  • System Plus Consulting

- A barometric sensor made from a very tiny MEMS die using VENSENS Process.
- Targeting altitude and weather forecasting applications in portable devices, this MEMS sensor positions ST for the upcoming double digit growth pressure sensor market.

Barometric pressure sensors are equipping more and more portable devices. These components sense the pressure of the atmosphere and help consumer products detect altitude variations indoor or improve the accuracy of altitude measurement in complement of GPS. They can also be used to refine local weather forecasting when used as a barometer.

ST's LPS331AP pressure-sensing device is manufactured using a proprietary MEMS technology, called “VENSENS”, that allows the pressure sensor to be fabricated on a monolithic silicon chip. This process eliminates wafer-towafer bonding. The sensing element in the LPS331AP is based on a flexible silicon membrane formed above an air cavity with a controlled gap and defined internal pressure. The membrane is very small compared to traditional silicon micro-machined membranes. The sensor and ASIC are packaged in a 3x3x1mm HCLGA.

This report provides a complete teardown of READ MORE >

Glossary

Overview/Introduction

STMicroelectronics Company Profile

Physical Analysis

- Physical Analysis Methodology
- Package
-- Package Characteristics & Markings
-- Package Opening
-- Package Composition
-- Package Cross-Section
- ASIC
-- ASIC Dimensions & Markings
-- ASIC Process and metal layers
-- ASIC Cross-Section
-- ASIC Process Characteristics
- MEMS
-- Pressure Sensor Markings
-- Pressure Sensor Details
-- Pressure Sensor Dimensions
-- Pressure Sensor Structure
--Pressure Sensor Cross-Section
-- Pressure Sensor process characteristics

Manufacturing Process Flow
- ASIC Process Flow
- Pressure Sensor Process Flow
- Package Process Flow
- Description of the Wafer Fabrication Units

Cost Analysis

- Main Steps of Economic Analysis
- Supply Chain Analysis
- ASIC Wafer Cost
- ASIC Probe & Dicing cost
- ASIC Die Cost
- Pressure Sensor Wafer Cost
- Pressure Sensor Wafer : Equipment Cost per Family
- Pressure Sensor Wafer : Material Cost per Family
- Pressure Sensor Probe & Dicing Cost
- Pressure Sensor Die cost
- LPS331AP Packaging Process Flow
- LPS331AP Packaging Cost Details
- LPS331AP Final Test Cost
- LPS331AP Component Manufacturing Cost
- Yield Synthesis
- LPS331AP Cost Analysis Evolution

Estimated Price Analysis

Note: Product cover images may vary from those shown

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