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STMicroelectronics L3G4IS Dual-Core 3-Axis MEMS Gyroscope Reverse Costing Analysis - Product Image

STMicroelectronics L3G4IS Dual-Core 3-Axis MEMS Gyroscope Reverse Costing Analysis

  • Published: April 2013
  • Region: Global
  • 138 Pages
  • System Plus Consulting

The first dual-core MEMS gyroscope enabling both user interface (UI) and optical image stabilization (OIS) applications simultaneously.
Using a new THELMA Process - Extracted from the Nokia Lumia 920.

While Digital Still Cameras commonly use MEMS based optical image stabilization, it was not included in smartphones. The Nokia Lumia 920 is the first smartphone featuring an OIS function.

Instead of using two dedicated sensors, Nokia chose to integrate a single gyroscope for both gesture recognition and camera image stabilization, allowing cost and board space savings.

The L3G4IS is the first two-in-one gyroscope able to sense motion with low noise and high sensitivity for OIS applications and to sense coarse movements with low sensitivity for UI applications. Assembled in the mainstream LGA 4x4mm package, the L3G4IS integrated in the Nokia Lumia 920 includes a MEMS die manufactured with the standard ST's THELMA and glass-frit wafer bonding processes. We also had access to a version of the component including a smaller MEMS die featuring a Gold-Gold thermocompression wafer bonding process and a modified THELMA process manufactured with new materials for the buried READ MORE >

Glossary

Overview/Introduction

STMicroelectronics Company Profile

Nokia Lumia 920 Teardown

Physical Analysis
- Physical Analysis Methodology
- Package
-- Package Characteristics & Markings
-- Package Opening – Main Parts
-- Package Opening – PCB Layout
--Package Cross-Section
- ASIC
-- ASIC Dimensions & Markings
-- ASIC Pinout
-- ASIC Cross-Section
-- ASIC Process Characteristics
- MEMS
-- MEMS Dimensions & Markings
-- MEMS bonding pads
-- MEMS Cap & Sensing Area
-- MEMS Cross-section
- MEMS Gold-Gold Bonding Version
-- Shrinked MEMS die
-- Modified THELMA Process

Manufacturing Process Flow
- ASIC Process Flow
- Description of the ASIC Wafer Fabrication Unit
- MEMS Process Overview
- MEMS Sensor Process Flow
- MEMS Cap Process Flow
- MEMS Wafer Bonding Process Flow
- Description of the MEMS Wafer Fabrication Unit
- Packaging Process Flow

Cost Analysis

- Main Steps of Economic Analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
- ASIC Die Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Die Cost (Front End + Back End 0)
- Back-End : Packaging Cost
- Back-End : Final test & Calibration Cost
- L3G4IS Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

Note: Product cover images may vary from those shown

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