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FOWLP & Embedded Die Packages 2012 Product Image

FOWLP & Embedded Die Packages 2012

  • ID: 2367125
  • November 2012
  • Region: Global
  • 287 Pages
  • Yole Développement

FEATURED COMPANIES

  • 3D-Plus
  • CIRETEC
  • Fraunhofer-IZM
  • LG Electronic
  • Qualcomm
  • Taiyo Yuden
  • MORE

Embedded wafer-level-package activity is expected to pick-up by 2015 above $200M overall driven by major wireless chip players worldwide

FOWLP TECHNOLOGY IS LOOKING FOR NEW DRIVING FORCES BEYOND INTEL MOBILE’S PUSH

After growing fast since Infineon’s strong push for eWLB technology commercialization, the FOWLP market activity reached the $100M market valuation last year. This young industry will need to wait for the 2015 – 2016 time frame to reach $200M market as the demand will shift from IDMs to leading fab-less wireless IC players (such as Qualcomm, Broadcom, Mediatek, etc…) and will be supported by the solid infrastructure of ‘top 4’ major assembly houses.

Additionally, to bend the rules, we also decided to propose in this report an alternative scenario for FOWLP market evolution. Indeed, regarding the numerous rumors linked to this space, several feedbacks pushed us to propose an optimistic forecast model, making the market starting growing fast as soon as 2013. This enthusiastic scenario would be linked to the following players’ activity: Spreadtrum (CN), Maxim (US), ADL (TW), Mediatek (TW).

However, low reliability READ MORE >

FEATURED COMPANIES

  • 3D-Plus
  • CIRETEC
  • Fraunhofer-IZM
  • LG Electronic
  • Qualcomm
  • Taiyo Yuden
  • MORE

1. Scope of the Report & Definitions

2. Executive Summary

3. Embedded Die in Substrates of Active ICs & Passive Components
- Motivations and Drivers
- Application focus for Embedded die package commercialization
- - cell-phone & consumer, automotive, medical applications
- 2010-2020 market forecasts for Embedded packages
- - in package shipments (M units)
- - in packaging revenues ($M)
- Supply chain emerging for embedded dies
- - Players and position in the electronic value chain
- - Who is the most aggressive in commercialization?
- - Who is doing what: partnerships identified
- Equipment & Material Toolbox for Embedded die
- - Technology flavors for embedded package. Chip first versus chip last?
- - Single die embedding versus SiP module? Challenges related to yield & supply chain
- Cost structure for Embedded package manufacturing
- Conclusion on “sweets spots” for the introduction of Embedded die technology in the short / medium / long term

4. FOWLP Technology Development
- Motivations and market drivers
- - Form factor, Cost, electrical and thermal performance
- Supply chain emerging for FOWLP
- - Players and position in the electronic value chain. Who is the most aggressive in commercialization? Who is doing what: partnerships identified
- 2010-2020 market forecasts for FOWLP type of packages
- - In Package shipments (M units)
- - In epoxy wafer production (wspy eq.)
- - In Packaging revenues ($M)
- FOWLP technologies & challenges
- - 1st generation versus 2nd generation FOWLP. “Passive integration with FOWLP technologies
- Equipment & Materials for FOWLP
- - Challenges in new material selection and missing equipment
- - Technology roadmap for FOWLP development
- 2.5D integration trends based on FOWLP and silicon / glass interposer mix
- FOWLP patent activity summary
- Cost structure for FOWLP
- Evolution to Panel-scale-packaging

5. Conclusion & Perspectives

6. Appendix
- Yole Développement company presentation & services

- 3D-Plus
- ADL Engineering
- ADTEC Engineering
- Amkor
- ams
- Analog Devices
- AT&S
- Aptos
- Asahi Glass
- ASE
- ASM
- Atotech
- Broadcom
- Bosch
- Camtek
- Casio Micronics
- CIRETEC
- CMK
- Compass Technology
- CSR
- Datacon
- Daeduck
- Denso
- Dialog Semiconductor
- Dow Corning
- DuPont Electronics
- Dyconex
- Epic
- Epcos TDK
- EVGroup
- Fico Molding
- Flip-chip International
- Fraunhofer-IZM
- Freescale
- Fujitsu
- HD Microsystems
- HEICO
- SK Hynix
- Ibiden
- Imbera
- IME
- IMEC
- Infineon
- Invensas
- IPDiA
- ITRI
- King Dragon International
- KYEC
- Leti
- Lintec
- LG Electronic
- Micron
- MicroChem
- Mitsui
- Murata
- Nagase ChemteX
- NANIUM
- NEC Electronics
- Nitto Denko
- Nokia
- NSC
- NXP
- OptoPac Oki Electric
- ORC
- Panasonic
- Qualcomm
- Renesas
- Rohm & Hass
- Rudolph technologies
- Samsung
- SEMCO
- Shinko Electric
- SPIL
- STATS ChipPAC
- ST-Ericsson
- STMicroelectronics
- SPTS
- SMIC
- Shin-Etsu
- SÜSS Microtec
- Taiyo Yuden
- TDK
- Tessera
- Texas Instruments
- tok
- Tong Hsing
- Toray chemical
- Toray Engineering
- Toshiba
- Towa
- Triquint
- UMTC
- Unimicron
- Unovis
- UTAC
- Vertical Circuits
- Wolfson Microelectronics
- Yamada and more

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