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Global Wafer-level Packaging Equipment Market 2015-2019

  • ID: 2757631
  • January 2015
  • Region: Global
  • 85 pages
  • TechNavio

FEATURED COMPANIES

  • Applied Materials
  • Disco
  • EV Group
  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • MORE

About Wafer-level Packaging Equipment
ICs are very delicate in nature, therefore, prone to contamination that can cause malfunctioning. To eliminate such issues, silicon chips or ICs are protected by using packaging materials. Wafer level packaging is one such type of packaging, which involves the packaging of individual ICs using best fit packaging processes conducted at wafer level manufacturing in semiconductor production process.

The analysts forecast the Global Wafer-level Packaging Equipment market to grow at a CAGR of 0.1 percent over the period 2014-2019.

Covered in this Report
This report covers the present scenario and the growth prospects of the Global Wafer-level Packaging Equipment market for the period 2015-2019. This report considers 2014 as the base year and provides data for the trailing 12 months. To calculate the market size, the report considers revenue generated from the sales of wafer-level packaging equipment worldwide. However, the report does not take into consideration the following while calculating the market size:

- Support or maintenance services that are offered for/with wafer-level packaging equipment
- Components that READ MORE >

Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Applied Materials
  • Disco
  • EV Group
  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • MORE

01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
05. Introduction
06. Industry Overview
06.1 Semiconductor Industry Overview
06.1.1 Semiconductor Value Chain
06.2 Structure of Semiconductor Market
06.3 Global Semiconductor Market Overview
06.3.1 Geographical Segmentation of Semiconductor Market 2005-2012
07. Market Landscape
07.1 Market Size and Forecast
07.2 Five Forces Analysis
08. Geographical Segmentation
08.1 Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019
08.2 Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share and revenue split)
08.3 Wafer-level Packaging Equipment Market in APAC Region
08.3.1 Market Size and Forecast
08.4 Wafer-level Packaging Equipment Market in Americas
08.4.1 Market Size and Forecast
08.5 Wafer-level Packaging Equipment Market in EMEA Region
08.5.1 Market Size and Forecast
09. Key Leading Countries
09.1 Taiwan
09.2 South Korea
09.3 US
10. Buying Criteria
11. Market Growth Drivers
12. Drivers and their Impact
13. Market Challenges
14. Impact of Drivers and Challenges
15. Market Trends
16. Trends and their Impact
17. Vendor Landscape
17.1 Competitive Scenario
17.2 Market Share Analysis 2014
17.3 Other Prominent Vendors
18. Key Vendor Analysis
18.1 Applied Materials
18.1.1 Key Facts
18.1.2 Business Overview
18.1.3 Business Segmentation by Revenue 2013
18.1.4 Business Segmentation by Revenue 2011-2013
18.1.5 Geographical Segmentation by Revenue 2013
18.1.6 Business Strategy
18.1.7 Recent Developments
18.1.8 SWOT Analysis
18.2 DISCO
18.2.1 Key Facts
18.2.2 Business Overview
18.2.3 Product Segmentation by Revenue 2013
18.2.4 Product Segmentation by Revenue 2012 and 2013
18.2.5 Geographical Segmentation by Revenue 2013
18.2.6 Business Strategy
18.2.7 Recent Developments
18.2.8 SWOT Analysis
18.3 EV
18.3.1 Key Facts
18.3.2 Business Overview
18.3.3 Product Segmentation 2013
18.3.4 Recent Developments
18.3.5 SWOT Analysis
18.4 Tokyo Electron
18.4.1 Key Facts
18.4.2 Business Overview
18.4.3 Business Segmentation by Revenue 2013
18.4.4 Business Segmentation by Revenue 2011-2013
18.4.5 Geographical Segmentation by Revenue 2013
18.4.6 Business Strategy
18.4.7 Recent Developments
18.4.8 SWOT Analysis
18.5 Tokyo Seimitsu
18.5.1 Key Facts
18.5.2 Business Overview
18.5.3 Product Segmentation by Revenue 2013
18.5.4 Product Segmentation by Revenue 2012 and 2013
18.5.5 Geographical Segmentation by Revenue 2013
18.5.6 Business Strategy
18.5.7 Recent Developments
18.5.8 SWOT Analysis
19. Market Summary
19.1 Growth Propellers
19.1.1 Expansion Plans
19.1.2 Replacement of Old Equipment
19.2 Growth Inhibitor
19.2.1 Cyclic Nature of Semiconductor Industry
19.2.2 Rapid Advances in Technology
19.3 Ongoing Trends
19.3.1 Increasing Number of Innovations
19.3.2 Increasing Penetration of Clean Energy Devices
19.3.3 Increasing Focus on Improving Production Yield
19.3.4 Increasing Adoption of Semiconductors in Automotive Sector
19.4 Market Attractiveness
20. Other Reports in this Series

List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Semiconductor Value Chain
Exhibit 3: Front-end Process
Exhibit 4: Back-end Process
Exhibit 5: Structure of Semiconductor Market
Exhibit 6: Global Semiconductor Market 2014
Exhibit 7: Global Semiconductor Market by Geographical Segmentation 2005-2012
Exhibit 8: Global Wafer-level Packaging Equipment Market 2013-2018 (US$ million)
Exhibit 9: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014
Exhibit 10: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (percentage share)
Exhibit 11: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2014-2019 (US$ million)
Exhibit 12: Comparison of Geographies by CAGR 2014-2019
Exhibit 13: Wafer-level Packaging Equipment Market in Taiwan 2014-2019 (US$ million)
Exhibit 14: Wafer-level Packaging Equipment Market in South Korea 2014-2019 (US$ million)
Exhibit 15: Wafer-level Packaging Equipment Market in US 2014-2019 (US$ million)
Exhibit 16: CAGR Comparison between Key Leading Countries 2014-2019
Exhibit 17: Global Smartphone Market by Unit Shipments 2013-2019 (billion units)
Exhibit 18: Global Tablets Market by Unit Shipments 2013-2019 (million units)
Exhibit 19: Global Wafer-level Packaging Equipment Market by Vendor Ranking 2014
Exhibit 20: Applied Materials: Business Segmentation by Revenue 2013
Exhibit 21: Applied Materials: Business Segmentation by Revenue 2011-2013 (US$ million)
Exhibit 22: Applied Materials: Geographical Segmentation by Revenue 2013
Exhibit 23: DISCO: Product Segmentation by Revenue 2013
Exhibit 24: DISCO: Product Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 25: DISCO: Geographical Segmentation by Revenue 2013
Exhibit 26: EV: Product Segmentation 2013
Exhibit 27: Tokyo Electron: Business Segmentation by Revenue 2013
Exhibit 28: Tokyo Electron: Business Segmentation by Revenue 2011-2013 (US$ million)
Exhibit 29: Tokyo Electron: Geographical Segmentation by Revenue 2013
Exhibit 30: Tokyo Seimitsu: Business Segmentation by Revenue 2013
Exhibit 31: Tokyo Seimitsu: Business Segmentation by Revenue 2011-2013 (US$ million)
Exhibit 32: Tokyo Seimitsu: Geographical Segmentation by Revenue 2013

Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Applied Materials
  • Disco
  • EV Group
  • Rudolph Technologies
  • SEMES
  • Suss Microtec
  • MORE

The author Announces the Publication of its Research Report – Global Wafer-level Packaging Equipment Market 2015-2019

The author recognizes the following companies as the key players in the Global Wafer-level Packaging Equipment Market: Applied Materials Inc., Disco Corp., EV Group, Tokyo Electron Ltd. and Tokyo Seimitsu Co. Ltd.

Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, Suss Microtec, Ultratech and ULVAC.

Commenting on the report, an analyst from the team said: “The short replacement cycle of portable electronic devices is one of the major trends witnessed in the market. The launch of new versions of portable electronic devices such as smartphones, phablets, and tablets has led consumers to replace their old devices with new advanced models.”

According to the report, the increased demand for smartphones and tablets worldwide, particularly in the emerging markets, is one of the major drivers in the market. This has led to the increased demand for semiconductor wafers and ICs, driving the growth of the Global Wafer-level Packaging Equipment market.

Further, the report states that the rapid changes in technology are one of the major challenges in the market. The semiconductor industry is evolving at a significant rate, leading to design complexities in ICs. To accommodate these advanced IC designs, wafer-level packaging equipment manufacturers incur huge costs in the production of advanced equipment.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Note: Product cover images may vary from those shown

- Applied Materials
- Disco
- EV Group
- Tokyo Electron
- Tokyo Seimitsu
- Rudolph Technologies
- SEMES
- Suss Microtec
- Ultratech
- ULVAC

Note: Product cover images may vary from those shown
Note: Product cover images may vary from those shown

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Ametek, Inc. Intel Corporation Micronas Group Analog Devices, Inc. Applied Materials, Inc. Fairchild Semiconductor, Inc.