- Language: English
- 207 Pages
- Published: August 2013
- Region: Global
Global Wafer-level Packaging Equipment Market 2014-2018
- Published: January 2014
- Region: Global
- 55 pages
The analysts forecast the Global Wafer-level Packaging Equipment market to grow at a CAGR of (2.9) percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing adoption of mobile devices. The Global Wafer-level Packaging Equipment market has also been witnessing the increasing number of innovations by customers. However, the cyclical nature of the industry could pose a challenge to the growth of this market.
The report, the Global Wafer-level Packaging Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, the Americas, and the EMEA region; it also covers the Global Wafer-level Packaging Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors dominating this space are Applied Materials Inc., Disco Corp., EV Group, Tokyo Electron Ltd., and Tokyo Seimitsu Co. Ltd.
Other vendors mentioned in the report are Rudolph Technologies Inc., SEMES Co. Ltd., Suss Microtec AG, Ultratech Inc., and ULVAC.
Key questions answered in this report:
- What will the market size be in 2018 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?
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01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
06. Market Landscape
06.1 Market Overview
06.2 Market Structure
06.3 Market Size and Forecast
06.4 Five Forces Analysis
07. Geographical Segmentation
07.1 Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2013-2018
08. Key Leading Countries
08.2 South Korea
09. Buying Criteria
10. Market Growth Drivers
11. Drivers and their Impact
12. Market Challenges
13. Impact of Drivers and Challenges
14. Market Trends
15. Trends and their Impact
16. Vendor Landscape
16.1 Competitive Scenario
16.2 Market Share Analysis 2013
16.3 Other Prominent Vendors
17. Key Vendor Analysis
17.1 Applied Materials Inc.
17.1.1 Business Overview
17.1.2 Business Segmentation
17.1.3 Key Information
17.1.4 SWOT Analysis
17.2 Disco Corp.
17.2.1 Business Overview
17.2.2 Business Segmentation
17.2.3 Key Information
17.2.4 SWOT Analysis
17.3 EV Group
17.3.1 Business Overview
17.3.2 Business Segmentation
17.3.3 Key Information
17.3.4 SWOT Analysis
17.4 Tokyo Electron Ltd.
17.4.1 Business Overview
17.4.2 Business Segmentation
17.4.3 Key Information
17.4.4 SWOT Analysis
17.5 Tokyo Seimitsu Co. Ltd.
17.5.1 Business Overview
17.5.2 Business Segmentation
17.5.3 Key Information
17.5.4 SWOT Analysis
18. Other Reports in this Series
List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Semiconductor Industry Value Chain
Exhibit 3: Semiconductor Production
Exhibit 4: Global Wafer-level Packaging Equipment Market 2008-2012 (US$ million)
Exhibit 5: Global Wafer-level Packaging Equipment Market 2013-2014 (US$ million)
Exhibit 6: Global Wafer-level Packaging Equipment Market by Geographical Segmentation 2013-2018
Exhibit 7: Global Wafer-level Packaging Equipment Market by Vendor Segmentation 2013
Exhibit 8: Tokyo Seimitsu Co. Ltd. Business Segmentation 2013
Exhibit 9: Disco Corp. Business Segmentation 2013
Exhibit 10: EV Group Business Segmentation 2013
Exhibit 11: Tokyo Electron Ltd. Business Segmentation 2013
Exhibit 12: Tokyo Seimitsu Co. Ltd. Business Segmentation 2013
Commenting on the report, an analyst from the team said: “To sustain the competition in the market, semiconductor manufacturers are continuously introducing innovative products, reducing manufacturing costs, and improving product efficiency. For instance, they have introduced chips that are available in smaller sizes; the sizes of these chips have reduced from 45 nanometers to 22 nanometers. They have also introduced chips with high dielectric constant materials and fin-fet or tri-gate transistors. In addition, DRAM memory manufacturers are currently employing 3x node production technology and 2x node production technology for the production of DRAMs. As these innovations require highly complicated wafer-level packaging equipment, the increase in the number of innovations by semiconductor manufacturers is likely to foster their demand in the market. ”
According to the report, the most important driver is the increasing adoption of mobile devices. Over the past decade there has been an unprecedented growth in the adoption of mobile devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs. This has led to a consequential rise in the demand for wafer-level packaging equipment, as it is vital for the functioning of mobile devices.
Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry, which leads to fluctuations in the demand for wafer-level packaging equipment. Moreover, in some cases, the production of such equipment tends to exceed their demand, leading to a large demand-supply gap.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
- Applied Materials Inc.
- Disco Corp.
- EV Group
- Tokyo Electron Ltd.
- and Tokyo Seimitsu Co. Ltd.