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Thin Film Deposition: Trends, Key Issues, Market Analysis. Product Image

Thin Film Deposition: Trends, Key Issues, Market Analysis.

  • ID: 2690927
  • December 2014
  • The Information Network

Thin film deposition processes play a critical role in the production of high-density, high-performance microelectronic products. Considerable progress has been achieved in the development of deposition processes -- and in the development of the reactor systems in which they are carried out.

This report discusses the technology trends, products, applications, and suppliers of materials and equipment.

It also gives insights to suppliers for future user needs and should assist them in long range planning, new product development and product improvement.

This report compares some of the issues impacting users of different deposition tools, including: APCVD (SACVD), LPCVD, PECVD, HDPCVD, ALCVD, PVD, ALD.

Note: Product cover images may vary from those shown

Chapter 1: Introduction

Chapter 2: Executive Summary

Chapter 3: Physical Vapor Deposition

3.1 Introduction
3.2 Sputtering Technology
3.3 Plasma Technology
3.4 Reactor Designs
3.4.1 Long-Throw Deposition
3.4.2 Collimated Sputter Deposition
3.4.3 Showerhead Deposition
3.4.4 Ionized PVD
3.5 Semiconductor Processing
3.5.1 Feature Patterning
3.5.2 Gap Fill
3.6 Targets

Chapter 4: Chemical Vapor Deposition

4.1 Introduction
4.2 Chemical Vapor Deposition (CVD) Techniques
4.2.1 APCVD
4.2.2 LPCVD
4.2.3 PECVD
4.2.4 HDPCVD
4.2.5 ALD

Chapter 5: Electrochemical Deposition

5.1 Introduction
5.2 Reactor Design
5.3 Challenges
5.4 Additives
5.5 Processing
5.5.1 Superfilling
5.5.2 Aspect Ratios
5.6 Copper Cathodes

Chapter 6: Film Deposition And Film Properties

6.1 Introduction
6.2 Dielectric Deposition
6.2.1 Silicon Dioxide
6.2.1.1 Thermal CVD
6.2.1.2 PECVD
6.2.1.3 HDPCVD
6.2.2 Silicon Nitride
6.2.2.1 Thermal CVD
6.2.2.2 PECVD
6.2.2.3 HDPCVD
6.2.3 Other Oxides
6.2.4 Low-K Dielectrics
6.3 Metal Deposition
6.3.1 Aluminum
6.3.2 Tungsten/Tungsten Silicide
6.3.3 Titanium Nitride

Chapter 7: Vendor Issues

7.1 Introduction
7.2 300mm Processing
7.3 Integrated Processing
7.4 Copper
7.5 Metrology
7.6 ESD
7.7 Parametric Test

Chapter 8: Market Forecast

8.1 Introduction
8.2 Key Issues
8.3 Market Forecast Assumptions
8.4 Market Forecast
8.4.1 Chemical Vapor Deposition
8.4.2 Physical Vapor Deposition
8.4.3 Copper Electroplating Market
8.4.4 Atomic Layer Deposition Market

Note: Product cover images may vary from those shown
Note: Product cover images may vary from those shown

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