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Thin Film PZT for Semiconductor Application Trends & Technology Update Report - Product Image

Thin Film PZT for Semiconductor Application Trends & Technology Update Report

  • ID: 2716213
  • December 2013
  • Region: Global
  • Yole Développement
From FeRAM to Integrated Passive Devices (IPDs): Will MEMS applications be the driver for future growth of thin film PZT?

FEATURED COMPANIES

  • aixACCT
  • EPSON
  • Infineon
  • Murata
  • Pulse
  • SUSS MicroTec
  • MORE

The Most Promising Effect Of Thin Film PZT For Future Applications Would Certainly Be Its Piezoelectric Effect

In September 2013, EPSON has announced its 2nd generation inkjet technology, PrecisionCore 2nd version (to be released in 2014), introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology for office desktop printers. This announcement has been highly publicized: First, thin film PZT MEMS applications are on the market, proving the reliability and maturity of this technology! Second, more inkjet head players will soon follow.

Thin film piezoelectric materials are gaining increasingly more importance within the MEMS industry. Although semiconductor manufacturing companies are historically reluctant to introduce such exotic materials into their production lines, every major MEMS foundry nowadays is working on the implementation and qualification of piezoelectric thin film in their MEMS manufacturing processes.

Lead zirconium titanate or PZT (Pb[ZrxTi1-x]O3 with 0=x=1)) is a very interesting ferroelectric material. Depending on its composition, it has the advantage of combining 3 different material properties: high dielectric READ MORE >

From FeRAM to Integrated Passive Devices (IPDs): Will MEMS applications be the driver for future growth of thin film PZT?

FEATURED COMPANIES

  • aixACCT
  • EPSON
  • Infineon
  • Murata
  • Pulse
  • SUSS MicroTec
  • MORE

1. Glossary

2. Motivations and objectives of the report

3. Who should be interested in this report?

4. Companies cited in this report

5. Definitions, limitations and methodology
- Executive summary
-- Key facts & trends
-- 2012-2018 market forecast in wafers (6’’ eq)
-- 2012-2018 market forecast by deposition techniques in wafers (6’’ eq)
-- Key thin film PZT market players
-- Main R&D labs active in thin film PZT

6. Focus on ferroelectric definitions and effect
- Ferroelectric definition
- Piezoelectric and ferroelectric materials definition
- Piezoelectric effect definition
- PZT characteristics
-- Lattice properties
-- Piezoelectric and dielectric properties
-- Figures of merit, coefficients
- Piezoelectric technologies: thin film, bulk or gauge
- PZT applications domains
- Conclusions

7. Thin film PZT applications
- FeRAM
-- Technology and market description
-- Players
-- Research
- Integrated Passives Devices (IPDs)
- Introduction to IPDs
-- Comparison between thin film/thick film IPD technology
-- Trends for thin film ferroelectric IPDs
-- Conclusions
- MEMS
-- Thin film PZT MEMS applications
-- MEMS Ferroelectric and Piezoelectric Thin film market players
-- Inkjet heads
-- Inertial MEMS (acceleros, gyros)
-- Uncooled IR detectors
-- Autofocus
-- RF-MEMS switches & filters
-- Transducers for Ultrasound Medical Imaging
-- Energy harvesting – energy scavengers
-- Microphones
-- Micromirrors

8. Market analysis for thin film PZT applications
- Thin film PZT applications
- Thin film Ferroelectric functions & materials
- Players roadmap – expected year for market entry
- 2012-2018 market forecast in wafers (6’’ eq)
- 2012-2018 market forecast in units
- 2012-2018 market forecast in US$
- 2012-2018 market forecast by deposition techniques in wafers (6’’ eq)

9. Thin film PZT market players
- Key industrial market players per application
- Thin film PZT thickness per application
- Key industrial market players positioning
- MEMS foundries positioning
- Who is working with whom?
10. Thin film piezoelectric deposition techniques & materials
- Processes
- Equipment manufacturers examples
- CSD techniques
- Focus on Sol-Gel process
- Thin film PZT deposition techniques comparison
- Thin film ferroelectric functions & materials
11. Thin film PZT manufacturing challenges
- Which technology for which application?
- Material challenges
- RoHS Regulations related to Lead
12. Other Piezoelectric materials

13. R&D European projects on thin film PZT
- piezoVolume
- Lab4MEMS
- EPAMO
14. Other piezoelectric materials

15. General conclusions

From FeRAM to Integrated Passive Devices (IPDs): Will MEMS applications be the driver for future growth of thin film PZT?

- aixACCT
- American Elements
- Applied Materials
- Argonne Lab
- Avago Technologies
- AVX
- BAE
- Brother
- CEA Le Ripault
- Chirp Microsystems
- Cranfield University
- Delphi
- DIAS Infrared GmbH
- DRS
- EPCOS – A Member of TDK-EPC Corporation
- EPFL
- Epichem
- Epiphotonics
- EPSON
- Excelitas Technologies
- FLIR
- Frauhofer IMT
- Fraunhofer ISIT
- Fraunhofer IPMS
- Fujifilm Dimatix
- Fujitsu
- GLOBALFOUNDRIES
- Hammamatsu
- Heimann
- HiperScan
- Holst Centre
- Hynix
- IBM
- Imagine Optics
- IMEC
- Infra Tec
- Infineon
- Inostek
- Ipdia
- Irisys
- Kojundo lab
- Korean Institute of Technology
- KTH
- L3Com
- LAAS
- Lemoptix
- LG
- Matsushita
- Maxim
- Melexis
- Microsystem lab
- Microvision
- Mitsubishi Chemical
- Murata
- Nippon Ceramic
- NovioMEMS
- NXP
- Oce
- Oerlikon
- OKI
- Olympus
- OMRON
- ON Semiconductor
- OnChip
- Panasonic
- Paratek
- Penn State University
- Philips
- Philips Research
- poLight
- Pulse
- Pyreos
- Ramtron
- Ricoh
- Rohm
- Samco
- Samsung
- Semtech
- Siemens Medical
- Silex Microsystems
- Silicon Sensing Systems Japan
- Singapore Univ
- Sintef
- SolMateS
- Sonitor
- Sound Design Technology
- SPTS
- STMicroelectronics
- SUSS MicroTec
- Symetrix Corporation
- Tango
- Technolas Perfect Vision
- Tegal
- Texas Instrument
- Tezzaron
- Thales
- Tronics Microsystems
- Toshiba
- Tyndall
- ULIS
- ULVAC
- US Army lab
- Vermont
- VTT
- Wavelens
- Western Digital
- WiSpry
- Xaar
- X-FAB

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