- Language: English
- Published: February 2014
- Region: Global
Global Semiconductor Dry Etching Market 2014-2018
- ID: 2734550
- December 2013
- Region: Global
- 50 Pages
The analysts forecast the Global Semiconductor Dry Etching Equipment market to grow at a CAGR of 2.27 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing demand for smart electronic devices. The Global Semiconductor Dry Etching Equipment market has also been witnessing the growing need for miniaturization of electronic circuits. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market.
The report, the Global Semiconductor Dry Etching Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC and EMEA regions, and the Americas; it also covers the Global Semiconductor Dry Etching Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors dominating this space are APPLIED materials Inc., Hitachi High-Technology Corp., Lam Research Corp., and Tokyo Electron Ltd.
Other vendors mentioned in the report are Jusung Engineering Co. Ltd, Mattson Technology Inc., ULVAC Technologies Inc., and Semes Co. Ltd.
Key questions answered in this report:
-What will the market size be in 2018 and what will the growth rate be?
-What are the key market trends?
-What is driving this market?
-What are the challenges to market growth?
-Who are the key vendors in this market space?
-What are the market opportunities and threats faced by the key vendors?
-What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
06. Market Landscape
06.1 Market Size and Forecast
06.2 Five Forces Analysis
07. Geographical Segmentation
07.1 Global Semiconductor Dry Etching Equipment Market by Geographical Segmentation
08. Key Leading Countries
09. Buying Criteria
10. Market Growth Drivers
11. Drivers and their Impact
12. Market Challenges
13. Impact of Drivers and Challenges
14. Market Trends
15. Trends and their Impact
16. Vendor Landscape
16.1 Competitive Scenario
16.2 Applied Materials Inc.
16.2.1 Business Strategy
16.3 Hitachi High-Tech Corp.
16.3.1 Business Strategy
16.4 Lam Research Corp.
16.4.2 Business Strategy
16.5 Tokyo Electron Ltd.
16.5.1 Mergers and Acquisitions
16.5.2 Business Strategy
16.6 Market Share Analysis 2013
16.7 Other Prominent Vendors
17. Key Vendor Analysis
17.1 Applied Materials Inc.
17.1.1 Business Overview
17.1.2 Business Segmentation
17.1.3 Key Information
17.1.4 SWOT Analysis
17.2 Hitachi High-Technologies Corp.
17.2.1 Business Segmentation
17.2.2 Key Information
17.2.3 SWOT Analysis
17.3 Lam Research Corp.:
17.3.1 Business Segmentation
17.3.2 Key Information
17.3.3 SWOT Analysis
17.4 Tokyo Electron Ltd.
17.4.1 Business Segmentation
17.4.2 Key Information
17.4.3 SWOT Analysis
18. Other Reports in this Series
List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Semiconductor Value Chain
Exhibit 3: Global Semiconductor Dry Etching Equipment Market 2013-2018 (US$ million)
Exhibit 4: Global Semiconductor Dry Etching Equipment Market segmentation by application 2013
Exhibit 5: Global Semiconductor Dry Etching Equipment Market by Geographical Segmentation 2013-2018
Exhibit 6: Global Semiconductor Dry Etching Equipment Market by Vendor Segmentation 2013
Commenting on the report, an analyst from the team said: “The increasing demand for high performance and low power consumption in smaller electronic devices requires the miniaturization of semiconductor circuits. The miniaturization of semiconductor circuits involves a wafer fabrication process through dry etching. Circuit miniaturization requires more thorough dry etching and the number of each etch step increases as capacity additions are incorporated. Currently, electronic devices use semiconductors with circuit line widths in the 20nm range. However, it is expected that ultra-miniature circuits, with line widths in the 10nm range could be introduced during the forecast period. Thus, this growing need for the miniaturization of semiconductor circuits is expected to fuel the demand for semiconductor dry etching equipment.”
According to the report, one of the major drivers in this market is the increasing demand for smart electronic devices. There has been unprecedented growth in the adoption of smart electronic devices such as mobile phones, smartphones, notebooks, PCs, tablets, ultrabooks, and PDAs in the past few years. These devices employ numerous semiconductor components such as microchips that increase the demand for dry etching equipment, as semiconductor components require microfabrication.
Further, the report states that one of the major challenges in this market is the cyclic nature of the Semiconductor industry. The revenue generated in the Semiconductor industry is cyclical in nature because the demand for etching is dependent on the economic climate, due to which production tends often to exceed demand.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
- APPLIED materials Inc.
- Hitachi High-Technology Corp.
- Jusung Engineering Co. Ltd
- Lam Research Corp.
- Mattson Technology Inc.
- Semes Co. Ltd.
- Tokyo Electron Ltd.
- ULVAC Technologies Inc.