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MEMS Packaging 2012 Product Image

MEMS Packaging 2012

  • ID: 2148708
  • April 2012
  • Region: Global
  • Yole Développement

FEATURED COMPANIES

  • AAC Acoustic Technologies
  • DelfMEMS
  • HP
  • MEMJET
  • Rohm
  • STMicroelectronics
  • MORE

The MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry

MEMS PACKAGING MARKET IS GROWING FASTER THAN IC PACKAGING MARKET

In package unit shipments, the MEMS packaging market is growing 2x faster (~ 20% CAGR) than what is predicted for the overall IC package market. WLP / TSV platform is set to grow the fastest while leadframe and organic laminate based packages are poised to grow a comfortable 16% CAGR over the next 5 years to come.

There are plenty of MEMS and sensors to be found in recent smartphone designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters & duplexers, RF switches and MEMS oscillators: there is no doubt that MEMS content is growing faster than standard IC content.

CHANGING THE PARADIGM

In terms of how the packaging is involved, it’s all about orchestrating the assembly of MEMS sensor and their related ASIC inside a module. But this is costly: packaging, assembly, test and calibration steps account for nearly 35% to 60% of a total MEMS READ MORE >

FEATURED COMPANIES

  • AAC Acoustic Technologies
  • DelfMEMS
  • HP
  • MEMJET
  • Rohm
  • STMicroelectronics
  • MORE

Introduction to MEMS industry
- Applications, players and market dynamics

Executive Summary

Global MEMS packaging 2010-2016 market forecast
- Overall MEMS package shipments forecast (in units)
- Breakdown by package type, applications, assembly trends, interconnect type, substrate type, etc…
- Global MEMS package, assembly & test value (in M$)
- Breakdown by package type, applications, assembly trends, interconnect type, substrate type, etc…

Supply & value chain for MEMS Packaging
- MEMS module packaging
- - Key manufacturing steps
- - Who is doing what?
- - Main key business models
- MEMS packaging supply chain
- - Example of supply chains for several case examples
- - Overall supply chain with links between major key players
- MEMS packaging industry value chain analysis
- ‘captive’ versus ‘outsourced’ strategy trends for MEMS packaging, assembly, test & calibration

Application focus for MEMS packaging
- Silicon microphones
- - Key players & market shares
- - Teardowns module analysis
- - Packaging, assembly & test specificities
- - Cost structure analysis (MEMS / ASIC, module assembly &Test)
- - Supply chain & infrastructure
- - Packaging roadmaps & perspectives
- Accelerometers
- Gyroscopes
- Magnetometers
- Motion sensor Combos & IMUs
- Pressure-sensors & TPMS
- Oscillators & resonators
- FBAR / BAW filters
- SAW filters
- Micro-mirrors
- Micro-bolometers
- Ink-jet MEMS modules
- Microfluidic packaging
- Emerging MEMS (switches, µdisplays)

MEMS testing & calibration trends
- Focus on MEMS wafer testing
- Focus on MEMS final test & calibration

Conclusions & Perspectives

Appendix

- Acronyms & Definitions
- Yole Developpement presentation

LIST OF FIGURES

2010-2016 MEMS market forecast shipments by applications (in Munits)
2010-2016 MEMS market value forecast evolution by industry (in M$)
2010-2016 MEMS market forecast by applications (in USM$ revenues)
MEMS market value 2011 versus 2017 breakdown by application (in M$)
2011 MEMS Ranking in $M – TOP 30 players
2011 MEMS Ranking in $M – TOP 30 to 70 players
TOP 30 MEMS players ranking by Business Model
2011 MEMS Foundries Ranking
MEMS Packages versus IC Packages Shipment forecast (in Munits)
MEMS Packaging versus IC Packaging Market forecast (in BUS$, including Final Test value)
2010 MEMS Packaging assembly trends (in Munit shipments)
2010 MEMS Packaging platform assembly trends (in Munit shipments)
2010 MEMS Packaging, Assembly, Final Test & Calibration market breakdown by applications
2010-2016 MEMS Packaging, Assembly, Final Test & Calibration value forecast breakdown by applications (in MUS$)
2010-2016 MEMS packaging & assembly value forecast breakdown by applications (in MUS$)
2010-2016 MEMS packaging Final Test & Calibration value forecast breakdown by applications (in MUS$)
2010 ASIC-to-MEMS integration trends Breakdown in Munits (SiP integration / SOC single die)
2010 MEMS first-Level Packaging Breakdown by technology (no 1st level /WLCapping / Thin-film packaging)
2010 MEMS interconnect assembly Trends breakdown (Wire-bond / flip-chip / WLCSP / 3D TSV)
2010 MEMS Substrates business (in MUS$) Breakdown per category (ceramic / leadframe / organic laminate / Glass&Silicon)
2010 Organic laminate substrate for MEMS applications - Value Breakdown
2010 Leadframe substrates for MEMS applications - Value Breakdown
2010 Ceramic substrate market for MEMS applications - Value Breakdown
2010 Glass/Silicon 2.5D interposer substrates for MEMS applications - Value Breakdown
2010 MEMS Encapsulation/Sealing/Protection - Trends Breakdown in Munits
2010 MEMS packaging, assembly, test & calibration trends- ‘captive’ versus ‘outsourced’ strategy
2010 – 2016 MEMS packaging, assembly, test & calibration activity ‘captive’ versus ‘outsourced’ strategy trends
2010 MEMS packaging value chain Representative view of business model’s intersections

- AAC Acoustic Technologies
- Aichi MI
- AKM
- Akustica
- Amkor
- Analog Devices
- ASE
- Avago Technologies
- bTendo
- Bosch
- Carsem
- Canon
- China WLCSP
- Colibrys
- DALSA / Teledyne
- DelfMEMS
- Denso
- Discera
- DRS
- Epcos – TDK
- EPWorks
- FLIR Systems
- Freescale
- Fujifilm Dimatix
- Fujikura
- GE Sensing
- Goodrich-AIS
- Hana Microelectronics
- Honeywell
- Hosiden
- HP
- Infineon
- Invensense
- Ion Torrent
- JCAP
- J-Devices
- Kionix
- Knowles Electronics
- KYEC
- Kyocera
- Lemoptix
- Lexmark
- Lingsen
- MEM Hitech
- Melexis
- MEMJET
- MEMSiC
- Microvision
- Miradin
- Murata
- NEC / Schott
- Oak-Mitsui
- NXP Semiconductor
- Olympus
- Omron
- Panasonic
- PlanOptik
- PoLight
- Pyreos
- Qualcomm MEMS Technologies
- Raytheon
- Rohm
- Rood Microtec
- Sand9
- Sencio
- Seiko-Epson
- Sensata
- Sensonor
- Sensor Dynamics
- Shinko
- SiTime
- Silex Microsystems
- Silicon Sensing Systems
- Sony
- SPIL
- StatsChipPAC
- STMicroelectronics
- Systron Donner Inertial
- Taiyo-Yuden
- Tecnisco
- Teramikros
- Texas Instruments
- Tong Hsing Electronics
- Triquint Semiconductor
- Tronics Microsytems
- TSMC
- ULIS
- Unimicron
- Unisem
- UTAC
- VTI Technologies
- WiSOL
- Wispry
- X-Fab
- Xintec
- Yamaha

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