Yamaha YAS532B 3-Axis Geomagnetic Compass Reverse Costing

  • ID: 2729094
  • November 2013
  • Region: Global
  • 93 Pages
  • System Plus Consulting
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More than 6 years after the release of its first electronic Compass for consumer applications, Yamaha has released its third 3-Axis geomagnetic sensor.

In a market largely dominated by AKM, Yamaha has launched its new very small eCompass, 1.46mm x 1.46mm, based on a GMR principle, in order to gain market shares. The manufacturing process combines GMR deposition and surface micromachining , allowing to measure the 3-axis with one die. The YAS532B has the same performances that the new AKM device with an area 17% smaller.

Manufactured in a old foundry amortized, the YAS532B is very cheap.

The YAS532B integrates an ingenious magnetic concentrator.

This report provides a complete teardown of the 3-axis Geomagnetic Compass with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Selling price estimation

Note: Product cover images may vary from those shown
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1. Overview / Introduction

- Executive Summary
- Reverse Costing Methodology

2. Company Profile

- Yamaha
- YAS532B Characteristics

3. Physical Analysis

- Synthesis of the Physical Analysis
- Physical Analysis Methodology
- Package
- Package Views & Dimensions
- Package Pin Out
- Package Opening
- Package Cross-Section
- Protection Layer
- Sensor
- View & Dimensions
- Marking
- Sensing Area
- X-axis GMR Elements
- GMR Principle
- Y and Z-axis Elements
- Sensor Bond Pad Cross-Section
- Sensor Layers Cross-Section
- Process Characteristics
- ASIC Die
- View & Dimensions
- Marking
- Delayering
- Cross-Section
- Process Characteristics

4. Manufacturing Process Flow

- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit

5. Cost Analysis

- Synthesis of the cost analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per process steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Front-End: Material Cost per Family
- Probe Test Cost
- Wafer Level Packaging Wafer Cost
- Final Test & Calibration Cost
- Component Die Cost

6. Estimated Price Analysis

- Definition of Prices
- Manufacturer Financial Ratios
- Estimated Manufacturer Price
- Estimated Selling Price


Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown


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