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Bosch Sensortec BMX055 9-Axis MEMS IMU - Reverse Costing Analysis - Product Image

Bosch Sensortec BMX055 9-Axis MEMS IMU - Reverse Costing Analysis

  • Published: December 2013
  • Region: Global
  • 220 Pages
  • System Plus Consulting

The first 9-Axis MEMS IMU from Bosch for Consumer Applications
Combines 3-Axis Gyroscope, 3-Axis Accelerometer and 3-Axis Magnetometer

In the race of motion integration, Bosch Sensortec has released its first 9-Axis IMU for consumer applications. The BMX055 combines a 12-bit 3-Axis accelerometer, a 16bit 3-Axis gyroscope and a wide-range 3-Axis geomagnetic sensor in a 4.5x3.0mm LGA package (the smallest footprint at its introduction).

It is the first 9-Axis MEMS IMU where all the functionalities are developed and manufactured by the same player. The BMX055 integrates the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.

This report provides a complete teardown of the MEMS IMU with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Selling price estimation

Introduction, Bosch Company Profile

Physical Analysis
- Package
-- Package Views, Dimensions & Pin Out
-- Package Opening
-- Wire bonding process
-- Package Cross-Section
- ASIC Gyro & Accelero Dies
-- View, Dimensions & Marking
-- Delayering
-- Main Blocks Identification
-- Cross-Section
- MEMS Gyro & Accelero Dies
-- View, Dimensions & Marking
-- Bond Pad Opening & Bond Pad
-- Cap Removed & Cap Details
-- Sensing Area Details
-- Cross-Section (Sensor, Cap & Bonding)
-- Process Characteristics
- Magnetometer Die
-- View, Dimensions & Marking
-- Hall sensor and fluxgate sensors
-- Delayering
-- Main Blocks Identification
-- Cross-Section (CMOS & Sensor)

Manufacturing Process Flow
- ASIC Gyro & Accelero Front-End Process
- MEMS Gyro & Accelero Process Flow
- Magnetometer Process Flow
- Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit

Cost Analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASIC Gyro & Accelero Front-End Cost
- ASIC Gyro & Accelero Back-End 0 : Probe Test & Dicing
- ASIC Gyro & Accelero Wafer & Die Cost
- MEMS Gyro & Accelero Front-End Cost
- MEMS Gyro & Accelero Back-End 0 : Probe Test & Dicing
- MEMS Gyro & Accelero Wafer & Die Cost
- Magnetometer CMOS Front-End Cost
- Magnetometer Sensor Cost
- Magnetometer Back-End 0 : Probe Test & Dicing
- Magnetometer Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Final Test & Calibration Cost
- BMX055 Component Cost

Estimated Price Analysis

Note: Product cover images may vary from those shown

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