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Toshiba - TL1F1-LW1 Full Reverse Costing Report - Product Image

Toshiba - TL1F1-LW1 Full Reverse Costing Report

  • Published: December 2013
  • Region: Global
  • 87 Pages
  • System Plus Consulting

The First GaN On Silicon Led By Toshiba On The Market
New In This Led: Silicon Substrate, Bonding Without Gold, Mesa Structure, Thinned Epitaxial Structure

Toshiba has recently released its first GaN on Silicon LED in a 6450 standard package with several new features.

The TL1F1 LED are produced on a cheap 8" silicon substrate in a standard power silicon facility from Toshiba. The integration in a standard facility has been facilitated by a smart bonding
process without gold.

Moreover, a significant work has been done to thin the epitaxial layer in GaN. The thickness of the GaN layer is close to thicknesses measured on Sapphire LED.

A low current density per sq cm is obtained, estimated at 20A/cm², lower than sapphire LED. But the second generation GaN on Si LED produces 30% more lumen.

This report provides a complete teardown of the LED die and the package with:

- Detailed photos
- Material analysis
- Detailed structure of dies and package
- Manufacturing process flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Glossary

1. Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

2. Companies Profile
- Toshiba Profile

3. TH1L1-LW1 Characteristics
- TH1L1-LW1 Characteristics

4. Physical Analysis
- Physical Analysis Methodology- Package Views & Dimension- Package Opening
- Package X-Ray
- Package Cross-Section
- Phosphor
- Protective diode
- LED Views & Dimensions
- Cathode
- Anode
- Epitaxy
- LED Thickness
- LED Characteristics

5. Manufacturing Process Flow
- Global Overview
- LED Fabrication Unit
- LED Process Flow
- Package Fabrication Unit
- Package Process Flow

6. Cost Analysis
- Synthesis of the cost analysis
- Main steps of economic analysis
- Yields Hypotheses
- Epitaxy Step
- LED Epitaxy Cost
- LED Front-End Cost
- LED Wafer Cost
- LED Cost per process steps
- LED Equipment Cost per Family
- LED Material Cost per Family
- Back-End : Probe and cleaving Cost
- Packaging Cost
- Packaging Cost
- Final Assembly Cost
- Component Cost

7. Price estimation
Contact

Note: Product cover images may vary from those shown

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