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Embedded Die in Package Patent Investigation Report 2013

  • ID: 2610578
  • August 2013
  • Region: Global
  • 207 Pages
  • Yole Développement

FEATURED COMPANIES

  • Amkor
  • Daeduck
  • Hermes
  • Murata
  • Qualcomm
  • STATS ChipPAC
  • MORE

Embedded IC in package technology is a young and promising advanced packaging technique: understanding the status of the patent situation is key to understanding the business environment and anticipating the related strategic evolutions!

A very young patent landscape dominated by a very small number of companies...

For this patent analysis 721 relevant and related patents have been selected and classified to further analyze embedded IC IP situation.

Among the 1547 patent documents constituting the 596 relevant patent families, 84% are active (pending or granted) and 16% are inactive (revoked, expired or lapsed).

In addition, even if first patents for embedded IC are quite old, this technology is very young with regard to the number of patents pending!

About 180 assignees are involved in embedded die technologies while the top 10 assignees represent 53% of patents filed in the Embedded die domain.
Main business model involved in this area is substrate & PCB makers (which have been strongly involved in the PCB and back-end industries for a while) but we found a significant number of IDMs and OSATs which are looking closer and closer to this packaging READ MORE >

Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Amkor
  • Daeduck
  • Hermes
  • Murata
  • Qualcomm
  • STATS ChipPAC
  • MORE

1. Context and objectives

2. Introduction to embedded IC market and technology

3. Methodology for patent screening and analysis

4. IP landscape overview

5. Global patent ranking and patent potential analysis

6. Key player patent portfolio analysis
- Focus on SEMCO
- Focus on Samsung
- Focus on Intel
- Focus on Shinko
- Focus on LG Innotek
- Focus on ASE
- Focus on Unimicron
- Focus on Imbera
- Focus on Murata
- Focus on Daeduck

7. Link with existing product and commercialized solutions

8. Conclusions and perspectives

9. Introduction & presentation of Yole Développement activity

Note: Product cover images may vary from those shown

- Amkor
- Analog Devices
- ASE
- AT&S
- Casio
- Ciretec
- CMK
- Continental
- CSR
- Daeduck
- Denso
- Dialog Semi
- Dyconnex
- Epcos
- Fairchild
- Flip Chip International
- Fraunhofer IZM
- Fujitsu
- Hermes
- Ibiden
- Imbera
- IMEC
- Intel
- Ipdia
- LG
- Maxim
- Microchip
- Murata
- National Semiconductor
- NEC
- Nepes
- nVidia
- NXP
- OKI
- On Semi
- Panasonic
- Qualcomm
- Rambus
- Renesas
- Samsung
- SEMCO
- Schweizer
- Shinko
- Sony
- SPIL
- STATS ChipPAC
- STEricsson
- STMicroelectronics
- TDK
- Taiyo Yuden
- Texas Instruments
- Toshiba
- Unimicron
- UTAC
- VTI (Murata)

Note: Product cover images may vary from those shown
Note: Product cover images may vary from those shown

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  • Ametek, Inc.
  • Intel Corporation
  • Micronas Group
  • Analog Devices, Inc.
  • Applied Materials, Inc.
  • Fairchild Semiconductor, Inc.