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3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019 Product Image

3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019

  • ID: 2759312
  • January 2014
  • Region: Global
  • 83 Pages
  • Transparency Market Research

FEATURED COMPANIES

  • MonolithIC 3D Inc.
  • STATS ChipPAC Ltd.
  • The 3M Company
  • XILINX, Inc.
  • Ziptronix, Inc.
  • MORE

'3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019'

This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019.

The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred.

This report is thereby produced to give a detailed overview of the ongoing trends in READ MORE >

FEATURED COMPANIES

  • MonolithIC 3D Inc.
  • STATS ChipPAC Ltd.
  • The 3M Company
  • XILINX, Inc.
  • Ziptronix, Inc.
  • MORE

Chapter 1 Preface
1.1 Report description and scope
1.1.1 Market segmentation
1.2 Research methodology

Chapter 2 Executive Summary
2.1 Global 3D ICs market snapshot, 2012 & 2019
2.2 Global 3D ICs market, 2011 – 2019 (USD million)

Chapter 3 3D ICs Market Overview
3.1 Introduction
3.2 Market dynamics
3.2.1 Drivers
3.2.1.1 Growing demand for efficient solutions
3.2.1.2 Rise in number of portable devices
3.2.2 Restraints
3.2.2.1 High cost, thermal and testing issues
3.2.3 Opportunities
3.2.3.1 Big Data and predictive analytics
3.3 Trends and future outlook
3.3.1 Multi-chip packaging
3.3.2 IntSim
3.4 Value chain analysis
3.4.1 Inbound logistics
3.4.2 Operations
3.4.3 Out-bound logistics
3.4.4 Marketing, sales and services
3.5 Porter’s five forces analysis
3.5.1 Bargaining power of suppliers
3.5.2 Bargaining power of buyers
3.5.3 Threat of substitutes
3.5.4 Threat of new entrants
3.5.5 Degree of competition
3.6 Technology overview
3.6.1 Shift to 3D IC from 2.5D IC technology
3.6.2 3D IC fabrication processes
3.6.3 Standards issues at different levels of 3D IC production
3.6.4 Patent filings
3.7 Market attractiveness analysis
3.8 Competitive analysis
3.8.1 Market share of key players, 2012 (%)

Chapter 4 Global 3D ICs Market, by End-Use Industry
4.1 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
4.2 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
4.3 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
4.4 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
4.5 Military 3D ICs market, 2011 – 2019 (USD million)
4.6 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)

Chapter 5 Global 3D ICs Market, by Substrate Type
5.1 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
5.2 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
5.3 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)

Chapter 6 Global 3D ICs Market, by Fabrication Process
6.1 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
6.2 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
6.3 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
6.4 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
6.5 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)

Chapter 7 Global 3D ICs Market, by Product
7.1 Global 3D ICs market overview, by product, 2012 & 2019 (%)
7.2 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
7.3 RF SiP 3D ICs market, 2011 – 2019 (USD million)
7.4 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
7.5 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
7.6 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
7.7 HB LED 3D ICs market, 2011 – 2019 (USD million)

Chapter 8 Global 3D ICs Market, by Geography
8.1 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
8.2 North America 3D ICs market, 2011 – 2019 (USD million)
8.3 Europe 3D ICs market, 2011 – 2019 (USD million)
8.4 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
8.5 RoW 3D ICs market, 2011 – 2019 (USD million)

Chapter 9 Company Profiles
9.1 Taiwan Semiconductor Manufacturing Company, Ltd.
9.1.1 Company overview
9.1.2 Financial overview
9.1.3 Business strategies
9.1.4 Recent developments
9.2 XILINX, Inc.
9.2.1 Company overview
9.2.2 Financial overview
9.2.3 Business strategies
9.2.4 Recent developments
9.3 The 3M Company
9.3.1 Company overview
9.3.2 Financial overview
9.3.3 Business strategies
9.3.4 Recent developments
9.4 STATS ChipPAC Ltd.
9.4.1 Company overview
9.4.2 Financial overview
9.4.3 Business strategies
9.4.4 Recent developments
9.5 Tezzaron Semiconductor Corporation
9.5.1 Company overview
9.5.2 Financial overview
9.5.3 Business strategies
9.5.4 Recent developments
9.6 United Microelectronics Corporation
9.6.1 Company overview
9.6.2 Financial overview
9.6.3 Business strategies
9.6.4 Recent developments
9.7 Ziptronix, Inc.
9.7.1 Company overview
9.7.2 Financial overview
9.7.3 Business strategies
9.7.4 Recent developments
9.8 Elpida Memory, Inc. (Micron Technology, Inc.)
9.8.1 Company overview
9.8.2 Financial overview
9.8.3 Business strategies
9.8.4 Recent developments
9.9 MonolithIC 3D Inc.
9.9.1 Company overview
9.9.2 Financial overview
9.9.3 Business strategies
9.9.4 Recent developments

List of Figures

FIG. 1 Global 3D ICs market, 2011 – 2019 (USD million) and Y-o-Y growth (%)
FIG. 2 Global smartphone and tablet shipment forecast, 2010 – 2015 (million units)
FIG. 3 Value chain analysis
FIG. 4 Porter’s five forces analysis
FIG. 5 Market attractiveness analysis, by end-use sectors, 2012
FIG. 6 Market share of key players, 2012 (%)
FIG. 7 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
FIG. 8 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
FIG. 9 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
FIG. 10 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
FIG. 11 Military 3D ICs market, 2011 – 2019 (USD million)
FIG. 12 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)
FIG. 13 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
FIG. 14 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
FIG. 15 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)
FIG. 16 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
FIG. 17 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
FIG. 18 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
FIG. 19 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
FIG. 20 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)
FIG. 21 Global 3D ICs market overview, by product, 2012 & 2019 (%)
FIG. 22 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
FIG. 23 RF SiP 3D ICs market, 2011 – 2019 (USD million)
FIG. 24 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
FIG. 25 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
FIG. 26 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
FIG. 27 HB LED 3D ICs market, 2011 – 2019 (USD million)
FIG. 28 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
FIG. 29 North America 3D ICs market, 2011 – 2019 (USD million)
FIG. 30 Europe 3D ICs market, 2011 – 2019 (USD million)
FIG. 31 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
FIG. 32 RoW 3D ICs market, 2011 – 2019 (USD million)
FIG. 33 Taiwan Semiconductor Manufacturing Company, Ltd. annual revenues, 2010 – 2012 (USD billion)
FIG. 34 Xilinx, Inc., annual revenues, 2010 – 2012 (USD billion)
FIG. 35 3M Company annual revenues, 2010 – 2012 (USD billion)
FIG. 36 STATS ChipPAC Ltd., annual revenues, 2010 – 2012 (USD million)
FIG. 37 United Microelectronics Corporation annual revenues, 2010 – 2012 (USD billion)
FIG. 38 Micron Technology, Inc., annual revenues, 2010 – 2011 (USD billion)

List of Tables

TABLE 1 3D ICs market segmentation
TABLE 2 Global 3D ICs market snapshot, 2012 & 2019
TABLE 3 Impact analysis of drivers
TABLE 4 Comparison for 2D and 3D designs for low density parity check (LDPC) code decoder
TABLE 5 Impact analysis of restraint
TABLE 6 Overview of different 3D IC fabrication processes
TABLE 7 Issues at different levels of 3D IC
TABLE 8 Patents by companies
TABLE 9 Geographical distribution of patents

FEATURED COMPANIES

  • MonolithIC 3D Inc.
  • STATS ChipPAC Ltd.
  • The 3M Company
  • XILINX, Inc.
  • Ziptronix, Inc.
  • MORE

The global 3D ICs market, valued at USD 2,408.2 million in 2012, is expected to see strong growth with 18.1% CAGR during 2013 to 2019. Global semiconductor industry is witnessing shift to 3D IC technology as it provides greater opportunity for developing a broader set of electronic systems and products with exceptional speed, reduction in the chip size, and low power consumption. Rising demand for solutions with improved performance and reduced response time, and growing number of portable devices such as smart-phones and tablets are some of the major factors to drive adoption of 3D ICs. However, high manufacturing and testing cost, lack of foundries and assembly houses to support this technology, thermal and testing issues, are some of the key challenges currently limiting the 3D ICs market growth worldwide.

3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.

Penetration of 3D IC technology in various applications is dependent on the need of interconnect density and cost related with particular process. Several industry products such as MEMS and sensors, RF SiP, memories, optoelectronics and imaging, logic (3D SiP/SoC) and HB LED are expected to adopt 3D IC integration. Among these products, ‘MEMS and sensors’ and memories are expected to emerge as leading segments. The increasing popularity of memory enhanced applications is expected to drive demand for the memory (3D stacks) segment in the near future. Geographically, Asia Pacific is expected to become largest market for 3D IC technology, with growth primarily supported by its emerging ICT and consumer electronics sector. Asia Pacific is expected to hold largest market share followed by North America throughout the forecast period.

Eyeing the growth potential with potential breakthrough for mass production, large number of semiconductor and packaging industry players have started to venture into 3D ICs market. Some of the key participants in this market include: Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Micron Technology Inc. (Elpida Memory Inc.), Intel Corporation, Micron Technology Inc., TEZZARON Semiconductor, STATS ChipPAC Ltd., United Microelectronics Corporation (UMC), Samsung Electronics Co. Ltd., and MonolithIC 3D IC Inc., among others. Among these, players such as Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Samsung Electronics Co., Xilinx Inc. Ltd., are considered to have dominant position in the market.

- Elpida Memory, Inc. (Micron Technology, Inc.)
- MonolithIC 3D Inc.
- STATS ChipPAC Ltd.
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tezzaron Semiconductor Corporation
- The 3M Company
- United Microelectronics Corporation
- XILINX, Inc.
- Ziptronix, Inc.

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