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iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm - Reverse Costing Analysis Product Image

iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm - Reverse Costing Analysis

  • ID: 2673993
  • October 2013
  • Region: Global
  • System Plus Consulting
How STMicroelectronics reduces the gyroscope package size by nearly 50% in the new iPhones 5S?

STMicroelectronics 4x4mm MEMS gyro was integrated in the previous iPhones (iPhone 4, 4S & 5). For the new iPhone 5S, Apple has chosen the latest 3x3mm MEMS gyro from ST, thus achieving a 45% footprint reduction.

The new 3-Axis MEMS gyroscope is assembled with a true CSP process (Chip Scale Packaging) allowing a package efficiency of 75% (silicon area/package area). This packaging size reduction combined with dies shrinking allowed ST to reduce by 20% the production cost of their latest gyro.

This report provides a complete teardown of the MEMS gyro with:

- Detailed photos
- Material analysis
- Comparison with iPhone 4/4S/5 gyro
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Supply chain evaluation
- Selling price estimation

How STMicroelectronics reduces the gyroscope package size by nearly 50% in the new iPhones 5S?

Glossary
Overview/Introduction

STMicroelectronics Company Profile

Physical Analysis
Physical Analysis Methodology
Package
Package Characteristics & Markings
Package Opening
Wire bonding process
Package Cross-Section
ASIC
ASIC Dimensions & Markings
ASIC Delayering
ASIC Cross-Section
ASIC Process Characteristics
MEMS
MEMS Dimensions & Markings
MEMS bonding pads
MEMS Cap Opening
MEMS Cap
MEMS Sensing Area
MEMS Cross-section

Comparison with iPhone 4/4S/5 Gyroscope

Manufacturing Process Flow
ASIC Process Flow
Description of the ASIC Wafer Fabrication Unit
MEMS Sensor Process Flow
MEMS Cap Process Flow
MEMS Wafer Bonding Process Flow
Description of the MEMS Wafer Fabrication Unit
Packaging Process Flow

Cost Analysis
Main Steps of Economic Analysis
Yields Hypotheses
ASIC Front-End Cost
ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
ASIC Die Cost
MEMS Front-End Cost
MEMS Front-End Cost per Process Steps
MEMS Front-End : Equipment Cost per Family
MEMS Front-End : Material Cost per Family
MEMS Back-End 0 : Probe Test & Dicing
MEMS Die Cost (Front End + Back End 0)
Back-End : Packaging Cost
Back-End : Final test & Calibration Cost
Component Cost (FE + BE 0 + BE 1)
Comparison with iPhone 4/4S/5 Gyro Component Cost

Estimated Price Analysis

Note: Product cover images may vary from those shown

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