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OSRAM Oslon Square LED Reverse Costing Analysis - Product Image

OSRAM Oslon Square LED Reverse Costing Analysis

  • Published: February 2013
  • Region: Global
  • System Plus Consulting

- OSRAM promotes 2mm sq. LED for projection or MR16 lamp replacement
- The efficiency is higher compared to similar Oslon 1mm sq. LED
- Find out how more than twice the light is obtained with the 2mm sq. chip

Osram Opto Semiconductor has recently released the Oslon Square family with the first 2mm² LED family from Osram, which generates 2 times more light that the Oslon SSL 1mm² chip. The new design of cathode and anode increases the light extraction of the LED. Moreover, the efficacy of the chip is enhanced by the new package design improving reflection. The blue Oslon Square produces 270lm for 700mA, i.e. 123lm/W.

Manufactured in the new Osram UX:3 technology, the 2 components integrate a thin GaN LED bonded on a germanium substrate and a silicon protective diode in a tiny ceramic package (3mm x 3mm).

System Plus Consulting is publishing a reverse costing report comparing Oslon Square 2mm² with Oslon SSL 1mm², 2 blue LEDs from OSRAM.

This report provides a complete teardown of the 2 LEDs with:

- Detailed photos
- Material analysis
- Structure of packaging and dies
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Glossary 3

1. Overview / Introduction 4

– Executive Summary
– Comparison of the Analyzed LEDs
– Reverse Costing Methodology
– OSRAM Company Profil
– 1mm² - Oslon LED characteristics
– 2mm² - Oslon LED characteristics

2. Physical Analysis 10
– Physical Analysis Methodology
– 1mm² - Package Characteristics
– 1mm² - Package Opening
– 1mm² - Package Cross-Section
– 2mm² - Package Characteristics
– 2mm² - Package Opening
– 2mm² - Package Cross-Section
– Package Parameters
– 1mm² - LED Die
– 2mm² - LED Die
– GaN Layer
– Cathode Structure
– Anode Structure
– LED Synthesis

3. Manufacturing Process Flow 40
– LED Die Process Flow 1mm² and 2mm²
– Description of the Wafer Fabrication Units

4. Cost Analysis 57
– Synthesis of the Cost Analysis
– Yields Explanation
1mm² LED Cost 59
– Yield Hypotheses
– LED Front-End Cost
– Front-End : Epitaxy Hypotheses
– Front-End : Epitaxy Cost
– Front-End : Epitaxy Cost per Steps
– Front-End : Other Front-End Cost
– Front-End : Other Front-End Cost per Steps
– Front-End Cost per Equipment Family
– Front-End Cost per Consumable Family
– Dies per Wafer & Probe Test
– Back-End 0 : Probe Cost
– Back-End 0 : Dicing Cost
– LED Wafer & Die Cost (FE + BE 0)
– Back-End 1 : Packaging Hypothesis
– Back-End 1 : Packaging Process Flow
– Back-End 1 : Packaging Cost Details
– Back-End 1 : Final Test Cost
– Component Manufacturing Cost (FE+BE0+BE1)
– Cost Analysis Evolution
2mm² LED Cost 80

5. Estimated Manufacturer Price Analysis 101
– Price definitions
– Manufacturers financial ratios
– Binning Impact on Manufacturing Price
– 1mm² - Ideal manufacturer Price
– 1mm² - Manufacturing Price with Binning Yield
– 2mm² - Ideal manufacturer Price
– 2mm² - Manufacturing Price with Binning Yield

Contacts 111

Note: Product cover images may vary from those shown

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