- Language: English
- Published: March 2013
- Region: Global
Global Thick Film Devices Market 2012-2016
- Published: August 2013
- Region: Global
- 53 Pages
The analysts forecast the Global Thick Film Devices market to grow at a CAGR of 13.76 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increased adoption of thick film technology in mobile devices. The Global Thick Film Devices market has also been witnessing the increasing adoption of thick film devices in various industries. However, global economic fluctuations could pose a challenge to the growth of this market.
The report, the Global Thick Film Devices Market 2012-2016, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market in the Americas, and the EMEA and APAC regions; it also covers the Global Thick Film Devices market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.
The key vendors dominating this space include GE Sensing and Inspection Technologies Pty Ltd., Panasonic Corp., Samsung Electro-Mechanics Co. Ltd., and Sharp Corp.
The other vendors mentioned in this report are AVX Corp., C-MAC Microtechnology, FDK Corp., Guangdong Fenghua Advanced Technology Holding Co. Ltd., KEMET Corp., KOA International, KYOCERA Corp., Murata Manufacturing Co. Ltd., Nippon Chemi-Con Corp., ROHM Co. Ltd., SolarWorld AG, TAIYO YUDEN Co. Ltd., TDK Corp., TOKO Inc., TT Electronics PLC, Tyco Electronics Corp., Vishay Intertechnology Inc., Walsin Technology Corp., and YAGEO Corp.
Key questions answered in this report:
- What will the market size be in 2016 and what will be the growth rate?
- What are key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by key vendors?
- What are the strengths and weaknesses of each of these key vendors?
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01. Executive Summary
02. List of Abbreviations
04. Market Research Methodology
Market Research Process
05. Scope of the Report
06. Market Landscape
06.1 Technology Description
06.2 Market Size and Forecast
07. Application Segmentation
07.1 Application Segmentation
Segmentation by Application 2012
Segmentation by Application 2012-2016
07.2 Market Size and Forecast of Energy Devices
07.3 Market Size and Forecast of Electronic Devices
07.4 Market Size and Forecast of Display Devices
07.5 Market Size and Forecast of Mechanical and Chemical Devices
07.6 Five Forces Analysis
08. Geographical Segmentation
09. Vendor Landscape
10. Buying Criteria
11. Market Growth Drivers
12. Drivers and their Impact
13. Market Challenges
14. Impact of Drivers and Challenges
15. Market Trends
16. Key Vendor Analysis
16.1 GE Sensing and Inspection Technologies Pty Ltd.
16.2 Panasonic Corp.
Revenue Generation by region
16.3 Samsung Electro-Mechanics Co. Ltd.
Product Application Segmentation
16.4 Sharp Corp.
17. Other Reports in this Series
List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Application Segments
Exhibit 3: Types of Films
Exhibit 4: Description and Application of Various Types of Films
Exhibit 5: Global Thick Film Devices Market 2012-2016 (US$ billion)
Exhibit 6: Thick Film Application Segmentation
Exhibit 7: Global Thick Film Devices Market by Application Segmentation 2012 (percent)
Exhibit 8: Global Thick Film Devices Market by Application Segmentation 2012-2016 (percent)
Exhibit 9: Global Energy Devices Market 2012-2016 (US$ billion)
Exhibit 10: Global Electronic Devices Market 2012-2016 (US$ billion)
Exhibit 11: Global Display Devices Market 2012-2016 (US$ billion)
Exhibit 12: Global Mechanical and Chemical Devices Market 2012-2016 (US$ billion)
Exhibit 13: Global Thick Film Devices Market by Geographical Segmentation 2012
Exhibit 14: Global Mobile Handset Unit Shipments 2011-2015 (billion)
Exhibit 15: Industry Solutions of GE Sensing and Inspection Technologies Pty Ltd.
Exhibit 16: Product Solutions of GE Sensing and Inspection Technologies Pty Ltd.
Exhibit 17: Revenue Generation by Business Segments of Panasonic Corp. 2012
Exhibit 18: Revenue Generation of Panasonic Corp. by Region 2012 (percent)
Exhibit 19: Business Divisions of Samsung Electro-Mechanics Co. Ltd.
Exhibit 20: Application Segmentation of Products offered by Samsung Electro-Mechanics Co. Ltd.
Exhibit 21: Product Segmentation of Sharp Corp.
Commenting on the report, an analyst from the team said: “One of the main trends witnessed in the Global Thick Film Devices market is the increasing focus on energy management. The governments in various countries have introduced stringent regulations on power consumption, forcing manufacturers to reduce energy consumption. The need to reduce power consumption has driven many organizations to adopt industrial microcontrollers. The emphasis on energy management was imposed by governments to ensure environmental protection, energy efficiency, and sustainable resource management. Microcontrollers are extensively used in power management applications since they are capable of reducing the power usage of various types of equipment used in the Industrial sector. These factors are likely to enhance the demand for microcontrollers, in which thick film technology is used.”
According to the report, one of the main factors driving the market is the technological advancements in semiconductor space. The main reason for such technological advancements is the increasing demand for digitization of consumer electronics.
Further, the report states that one of the main challenges is the seasonality in demand. Any demand fluctuation in the supply side, due to the bull-whip effect, would cause fluctuations in the supply chain side, which will lead to high inventory levels.
The report also includes a discussion of the other vendors operating in this market. The other vendors in the market are AVX Corp., C-MAC Microtechnology, FDK Corp., Guangdong Fenghua Advanced Technology Holding Co. Ltd., KEMET Corp., KOA International, KYOCERA Corp., Murata Manufacturing Co. Ltd., Nippon Chemi-Con Corp., ROHM Co. Ltd., SolarWorld AG, TAIYO YUDEN Co. Ltd., TDK Corp., TOKO Inc., TT Electronics PLC, Tyco Electronics Corp., Vishay Intertechnology Inc., Walsin Technology Corp., and YAGEO Corp.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
- AVX Corp.
- C-MAC Microtechnology
- FDK Corp.
- GE Sensing
- Guangdong Fenghua Advanced Technology Holding Co. Ltd.
- Inspection Technologies Pty Ltd.
- KEMET Corp.
- KOA International
- KYOCERA Corp.
- Murata Manufacturing Co. Ltd.
- Nippon Chemi-Con Corp.
- Panasonic Corp.
- ROHM Co. Ltd.
- Samsung Electro-Mechanics Co. Ltd.
- Sharp Corp.
- SolarWorld AG
- TAIYO YUDEN Co. Ltd.
- TDK Corp.
- TOKO Inc.
- TT Electronics PLC
- Tyco Electronics Corp.
- Vishay Intertechnology Inc.
- Walsin Technology Corp.
- YAGEO Corp.