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Thin-Film Integrated Passive Devices (IPDs) 2012 Product Image

Thin-Film Integrated Passive Devices (IPDs) 2012

  • ID: 2367117
  • November 2012
  • Region: Global
  • 289 Pages
  • Yole Développement

FEATURED COMPANIES

  • Aiconn
  • Cree
  • Icera / nVidia
  • Microsemi
  • Renesas
  • STMicroelectronics
  • MORE

Thin-film integrated passive & active devices are rapidly growing within ESD/EMI protection, LED, RF, digital & mixed signal applications

A 2X GROWTH IS EXPECTED IN THE NEXT 5 YEARS WITHIN THE ELECTRONICS INDUSTRY

From a commodity technology initially developed to replace bulky discrete passive components, thin-film Integrated Passive Devices (IPDs) are now a growing industry trend driven by RF, High Brightness LEDs, ESD and EMI protection, and Digital and Mixed Signal applications. This new research study on thin-film Integrated Passive and Active Devices estimates the total IPD market to grow from more than $610M this year to over $1.2B by 2017 with a CAGR of 12%.

ESD and EMI protection IPD revenues are stabilizing, primarily due to the recent decline of NOKIA in the mobile space. NOKIA has been the main driving OEM for the integration of IPDs in volume, with many handsets having from 10 to 15 ESD and EMI protection IPDs per system. It remains to be seen which OEMs will take over NOKIA's leadership in the integration of IPDs? If Sony-Ericsson and Motorola have adopted the technology to limited volume, Apple recently started to adopt more and more IPD components READ MORE >

FEATURED COMPANIES

  • Aiconn
  • Cree
  • Icera / nVidia
  • Microsemi
  • Renesas
  • STMicroelectronics
  • MORE

1. Objectives of the Study

2. Introduction, Definitions & Scope of the Report
- Overview of discrete versus integrated passive solutions
- Integrated active and passive structure definitions (inductor, capacitor, resistors, diodes, combinations…)
- Comparison between thin-film / thick film IPD technologies (including ceramic LTCC)
- Executive summary

3. Thin-Film IPD Applications and Market Drivers
- ESD/EMI protection
- LED Lighting protections
- RF IPD
- Digital & Mixed Signal IPD
- For each category, you will find the analysis of
- - IPD current and future applications
- - IPD benefits and market driver descriptions for each IPD function and application
- - IPD functionalities by category

4. Thin-Film IPD Market Status & 2011-2017 Forecasts
- IPD market forecasts are provided both in $M, Munits and in wafer eq. with attached CAGR
- - Volume shipments for IPD by application (cell-phone, mp3 players, medical, automotive…)
- - IPD shipments by category (ESD/EMI protection, LED silicon submount, RF IPDs, Digital & Mixed signal IPDs)
- - Specific applicative breakdown and forecast evolution for each category
- - IPD shipments by substrate type (Silicon, Glass,…) and wafer size (6” / 8” / 12”)
- - IPD shipments by integration choice (discrete, Above IC, Sipackage…)
- - IPD shipments by packaging platform (WLP, Wire bond, Flip-chip, Embedded, Silicon submount, 3D TSV interposer, Fan-Out plastic laminate…)

5. Thin-Film IPD Supply Chain & Players
- Geographical mapping of different players
- IPD player market shares and revenues
- - “To” IPD players' 2008 revenues
- - Market share breakdown for ESD/EMI protection and RF IPD applications
- Business model analysis for IPD
- Summary of IPD player capabilities

6. Thin -Film IPD Technologies
- Overall IPD Technology roadmap
- IPD technology requirements & options
- - Performance and integration capabilities
- - Inductors (multilayer planar inductors, 3D inductors…)
- - Capacitors (planar versus trench geometries, SiO2 versus SiN versus BST versus PZT capacitors…)
- IPD Manufacturing challenges and related equipment & material tool-box
- - Substrate choice technology comparisons:
- - Dielectric layer options (low k / high k)
- - Trend for ferroelectric IPDs
- - Available photoresists, oxide and other layer solutions, impact of layer thickness
- - Metallic layer formation (Al, Copper, Gold…)
- - Process options (line width, multiple layer IPDs, lithographic versus non lithographic patterning, advanced depositions…)
- IPD Design, Simulation and predictability through system level co-design

7. Thin-Film IPD Architecture, Assembly & Packaging
- Integration, packaging and assembly platforms options for IPDs
- Through-Silicon-Via manufacturing: a necessary steto reach the 3rd dimension
- Fan-Out Wafer level packaging and embedded die technologies

8. Conclusions & Perspectives

- Aiconn
- AMD
- Amkor
- Analog Devices
- Apple
- apm
- ASE
- Avago
- AVX
- AzureWave
- Broadcom
- Bourns
- Bridgelux
- CMD
- Cree
- CSR / Samsung
- Energy Micro
- Epcos – TDK
- Kyocera
- Fairchild Semi
- Flip-Chip International
- Fraunhofer-IZM institute
- Freescale
- Fujikura
- Fujitsu
- Gemtek
- Icera / nVidia
- Ibiden
- IBM
- IMEC
- Infineon
- IPDiA
- Ibiden
- IME
- IMEC
- Intel
- ITRI
- Qualcomm - Atheros
- Leti
- Littlefuse
- LG Innotek
- Lumileds
- Maxim IC
- Microsemi
- Murata / SyChip
- Nichia
- NEPES
- Nokia
- Nordic Semiconductor
- NXP
- OnChip Devices
- ON Semiconductor
- Panasonic
- Panjit Semiconductor
- Paratek
- ProTek Devices
- Renesas
- RFMD
- RIM
- Samsung
- Sequans Communications
- Shinko
- Silex Microsystems
- SiGe Semiconductor
- Skyworks
- Semtech
- StatsChipPAC
- STEricsson
- STMicroelectronics
- Sony
- SPIL
- Transfer Jet
- Telephus / SEMCO
- Taiyo Yuden
- Texas Instruments
- Touch Microsystems Technology
- TSMC
- Toshiba
- Triquint
- Tyndall
- USI
- Viking Tech
- Vishay
- Wavenics
- Wi2wi
- Wispry
- Zarlink and more

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