+353-1-416-8900REST OF WORLD
1-800-526-8630U.S. (TOLL FREE)

Luxtera Silicon Photonic Die Active Optical Connector photonic die and laser source - Reverse Costing Analysis

  • ID: 2323462
  • Report
  • November 2012
  • Region: Global
  • System Plus Consulting
1 of 4
System Plus Consulting is proud to publish the reverse costing report on the latest generation 40Gbps photonic circuit from Luxtera.

The 1064101003 Quad Small Form-factor Pluggable Plus connector from Molex integrates this photonic circuit from Luxtera which manages 40Gbps data rate
on a single silicon die assembled directly in the connector case.

This new component is two times smaller than the first generation in 130nm. This technology is targeted for very high data rate on short and medium distances.

It integrates its laser source in a tiny original MEMS package.

This report provides complete teardown of the die with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation
Note: Product cover images may vary from those shown
2 of 4


3 of 4
1. Overview / Introduction 3
– Executive Summary
– Reverse Costing Methodology

2. Company Profile 5

3. Physical Analysis 11
– Synthesis of the Physical Analysis
– Physical Analysis methodology
– QSFP+ Connector Characteristics
– QSFP+ Connector Diassembly
– Optical Fiber Coupling
– Fiber to Chip Coupler
– Photonic Die Dimensions 24
– Photonic Die marking
– Photonic Die – Functional Bloc
– Grating coupler
– Mach-Zehnder Interferometer
– Germanium Photo-Diode
– Logic CMOS
– Waveguide Cross section
– Photonic Die Process Characteristics
– MEMS Laser Source Module 48
– Laser Source Dimension
– Laser – Ball Lens – Faraday Rotator
– Lid
– Sealing Lid and MEMS
– Substrates Bonding
– MEMS Laser Source Module Process Characteristics

4, Manufacturing Process Flow 60
– Global view
– Process Flow Silicon Photonic die
– Process Flow MEMS Laser Source Module
– Description of the Wafer Fabrication Unit

5. Cost Analysis 66
– Synthesis of the cost analysis
– Methodology
– Hypothesis
– Yield Synthesis
– Silicon Photonic Wafer Cost
– Silicon Photonic Die Cost Data
– Laser – Ball Lens – Faraday Rotator Costs
– MEMS Laser Source Module Wafer Cost
– MEMS Laser Source Module cost per Steps
– MEMS Laser Source Module Equipment cost
– MEMS Laser Source Module Material cost
– MEMS Laser Source Module Assembly Cost
– MEMS Laser Source Module Die Cost
– Cost Analysis Evolution over yield
6. Estimated Selling Price Analysis 89
– Supply Chain Analysis
– Estimated Selling Price
– Price Evolution according to the yield


Note: Product cover images may vary from those shown
4 of 4
Note: Product cover images may vary from those shown