- Language: English
- 453 Pages
- Published: September 2014
Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market 2014-2018
- Published: December 2013
- Region: Global
- 53 Pages
The analysts forecast the Global Front End of the Line (FEOL) Semiconductor Separation Equipment market to grow at a CAGR of 4.13 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing adoption of mobile devices. The Global Front End of the Line (FEOL) Semiconductor Separation Equipment market has also been witnessing rapid technological advancement. However, the cyclical nature of the Semiconductor industry could pose a challenge to the growth of this market.
The report, the Global Front End of the Line (FEOL) Semiconductor Separation Equipment Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, and the EMEA and APAC regions; it also covers the Global Front End of the Line (FEOL) Semiconductor Separation Equipment market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.
The key vendors dominating this market space are ASML Holding N.V., Tokyo Electron Ltd., Applied Materials Inc. (AMAT), and Dainippon Screen Manufacturing Co. Ltd.
Other vendors mentioned in the report are Ebara Corp., Canon Inc., Lam Research Corp., Nikon Corp., and Hitachi High-Technologies.
Key questions answered in this report:
- What will the market size be in 2018 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?
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01. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
06. Market Landscape
06.1 Market Overview
06.2 Technology Landscape
06.3 Market Size and Forecast by Value
06.4 Five Forces Analysis
07. Market Segmentation by Type
07.1 Global Front End of the Line Semiconductor Separation Equipment Market by Application 2013-2018
08. Geographical Segmentation
08.1 Global Front End of the Line Semiconductor Separation Equipment Market by Geographical Segmentation 2013-2018
09. Key Leading Countries
09.2 South Korea
10. Buying Criteria
11. Market Growth Drivers
12. Drivers and their Impact
13. Market Challenges
14. Impact of Drivers and Challenges
15. Market Trends
16. Trends and their Impact
17. Vendor Landscape
17.1 Competitive Scenario
17.2 Market Share Analysis 2012
17.3 Other Prominent Vendors
18. Key Vendor Analysis
18.1 Applied Materials Inc.
18.1.1 Business Overview
18.1.2 Business Segmentation
18.1.3 Key Information
18.1.4 SWOT Analysis
18.2 ASML Holding N. V.
18.2.1 Business Overview
18.2.2 Business Segmentation
18.2.3 Key Information
18.2.4 SWOT Analysis
18.3 Dainippon Screen Manufacturing Co. Ltd.
18.3.1 Business Overview
18.3.2 Business Segmentation
18.3.3 Key Information
18.3.4 SWOT Analysis
18.4 Tokyo Electron Ltd.
18.4.1 Business Overview
18.4.2 Business Segmentation
18.4.3 Key Information
18.4.4 SWOT Analysis
19. Other Reports in this Series
List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Semiconductor Industry Value Chain
Exhibit 3: Global Semiconductor Production Equipment Market 2010-2012 (US$ million)
Exhibit 4: Revenue Share of Various Steps in Semiconductor Production 2013
Exhibit 5: Global Front End of the Line Semiconductor Separation Equipment Market 2013-2018 (US$ billion)
Exhibit 6: Global Front End of the Line Semiconductor Separation Equipment Market by type 2013-2018
Exhibit 7: Global Front End of the Line Semiconductor Separation Equipment Market by Geographical Segmentation 2013-2018
Exhibit 8: Global FEOL Semiconductor Separation Equipment Market by Vendor Segmentation 2013
Exhibit 9: Applied Materials Business Segmentation 2013
Exhibit 10: ASML Holding N.V. Business Segmentation 2013
Exhibit 11: Dainippon Screen Manufacturing Co. Ltd. Business Segmentation 2013
Exhibit 12: Tokyo Electron Ltd. Business Segmentation 2013
Commenting on the report, an analyst from the team said: “The Semiconductor industry has always been highly volatile in terms of demand fluctuations. As a result, semiconductor manufacturers are forced to improve the performance and reliability of their offerings. Further, the regular introduction of electronic devices by OEMs in the end-user market is expected to create a demand for semiconductor-based components to enhance the functionalities of their offerings. Driven by factors like these, the Global Semiconductor market is expected to witness rapid technological advancements in the next few years, which in turn is expected to compel FEOL semiconductor separation equipment manufacturers to upgrade their products such that they meet the expectations of their technologically advanced customers.”
According to the report, one of the main drivers in this market is the increasing adoption of mobile devices. Over the past few years, there has been an unprecedented growth in the usage of mobile devices. The market for devices such as cell phones, smartphones, notebook PCs, tablets, ultrabooks, and PDAs is increasing among consumers. This increased demand for mobile devices is leading to a consequential rise in the demand for FEOL semiconductor separation equipment, as it is vital for the functioning of mobile devices.
Further, the report states that one of the key challenges in this market is the cyclical nature of the Semiconductor industry that leads to fluctuations in the demand for FEOL semiconductor separation equipment. Moreover, in some cases the production of such equipment tends to exceed its demand.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
- Applied Materials Inc. (AMAT)
- ASML Holding N.V.
- Canon Inc.
- Dainippon Screen Manufacturing Co. Ltd.
- Ebara Corp.
- Hitachi High-Technologies.
- Lam Research Corp.
- Nikon Corp.
- Tokyo Electron Ltd.