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InvenSense MPU-9150 Motion Processing Unit Reverse Costing Analysis - Product Image

InvenSense MPU-9150 Motion Processing Unit Reverse Costing Analysis

  • Published: November 2012
  • Region: Global
  • System Plus Consulting

System Plus Consulting is proud to publish the reverse costing report on the MPU-9150 MEMS from InvenSense.

The MPU-9150 is a motion tracking MEMS that combines a 3D accelerometer, a 3D gyroscope from Invensense and a 3D digital compass from AKM in the same package, a 4x4x1mm LGA package.

The MPU-9150 is targeted for mobile phones, tablets, gaming devices, Portable Navigation Devices and remote controllers.

This report provides complete teardown of the inertial MEMS with:

- Detailed photos
- Material analysis
- Cost of Manufacturing
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

1. Overview / Introduction 3
– Executive Summary
– Reverse Costing Methodology

2. Company Profile 5

3. Physical Analysis 13
– Synthesis of the Physical Analysis
– Physical Analysis methodology
– Package characteristics & markings
– Package opening
– Package Opening: Dies Bonding
– Package Cross Section
– Invensense ASIC Marking
– Invensense ASIC Dimensions
– Invensense ASIC minimal dimensions
– Invensense ASIC Cross section
– Invensense ASIC Process Characteristics
– Invensense MEMS marking
– Invensense MEMS Opening
– Invensense MEMS Sensing Area
– Invensense MEMS Cap
– Invensense MEMS Process Characteristics
– Magnetometer marking
– Magnetometer Dimensions
– Magnetometer Cross Section
– Magnetometer Process Characteristics

4. Manufacturing Process Flow 82
– Global view
– Process Flow Accelerometer ASIC
– Process Flow MEMS Accelerometer
– Process Flow Magnetometer
– Process Flow Packaging
– Description of the Wafer Fabrication Unit

5. Cost Analysis 100
– Synthesis of the cost analysis
– Methodology
– Hypothesis
– Yield Synthesis
– Invensense ASIC Wafer Cost
– Invensense ASIC Die Cost Data
– MEMS Accelerometer Wafer Cost
– MEMS Accelerometer cost per Steps
– MEMS Accelerometer Equipment cost
– MEMS Accelerometer Material cost
– MEMS Accelerometer Die Cost
– Magnetometer Wafer Cost
– Magnetometer cost per Steps
– Magnetometer Material cost
– Magnetometer Die Cost
– Back-End : Package Cost
– Back-End : Package Cost Per Steps
– Back-End : Package Material cost
– Back-End : Final Test
– MPU9150 Manufacturing Cost
– Cost Analysis Evolution over yield

6. Estimated Selling Price Analysis 146
– Supply Chain Analysis
– Estimated Selling Price
– Price Evolution according to the yield

Glossary

Contacts

Note: Product cover images may vary from those shown

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