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Global Semiconductor Assembly and Test Services Market 2012-2016 Product Image

Global Semiconductor Assembly and Test Services Market 2012-2016

  • ID: 2617709
  • July 2013
  • Region: Global
  • 52 pages
  • TechNavio

FEATURED COMPANIES

  • Amkor Technology Inc.
  • Atmel Corp.
  • Broadcom Corp.
  • ChipMOS Technologies Ltd.
  • J-Devices Corp.
  • Powertech Technology Inc.
  • MORE

The analysts forecast the Global Semiconductor Assembly and Test Services market to grow at a CAGR of 6.5 percent over the period 2012-2016. One of the key factors contributing to this market growth is the increasing development of new products. The Global Semiconductor Assembly and Test Services market has also been witnessing an increase in the number of collaborations/alliances among providers and manufacturers. However, the cyclic nature of the Semiconductor industry could pose a challenge to the growth of this market.

The report, the Global Semiconductor Assembly and Test Services Market 2012-2016, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market in North America, the APAC region, Europe, and the ROW; it also covers the Global Semiconductor Assembly and Test Services market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.

The key vendors dominating this space include Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Siliconware Precision Industries Co. Ltd., and STATS ChipPAC Ltd.

The READ MORE >

Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Amkor Technology Inc.
  • Atmel Corp.
  • Broadcom Corp.
  • ChipMOS Technologies Ltd.
  • J-Devices Corp.
  • Powertech Technology Inc.
  • MORE

01. Executive Summary
02. List of Abbreviations
03. Introduction
04. Market Research Methodology
Market Research Process
Research Design
Research Methodology
05. Scope of the Report
Market Overview
Service Offerings
06. Market Landscape
06.1 Market Size and Forecast by Revenue
06.2 End-User Segmentation
06.3 Five Forces Analysis
07. Geographical Segmentation
08. Vendor Landscape
09. Buying Criteria
10. Market Growth Drivers
11. Drivers and their Impact
12. Market Challenges
13. Impact of Drivers and Challenges
14. Market Trends
15. Key Vendor Analysis
15.1 Advanced Semiconductor Engineering Inc.
Business Overview
SWOT Analysis
15.2 Amkor Technology Inc.
Business Overview
SWOT Analysis
15.3 Siliconware Precision Industries Co. Ltd.
Business Overview
SWOT Analysis
15.4 STATS ChipPAC Ltd.
Business Overview
SWOT Analysis

List of Exhibits
Exhibit 1: Market Research Methodology
Exhibit 2: Global SATS Market 2012-2016 (US$ in billion)
Exhibit 3: Global SATS Market by End-User Segmentation
Exhibit 4: Global SATS Market by Geographic Segmentation 2012
Exhibit 5: Global SATS Market by Vendor Segmentation-2012
Exhibit 6: Global SATS Market Split by Assembly and Test Services 2012
Exhibit 7: Top Four Global SATS Providers Split 2012
Exhibit 8: Advanced Semiconductor Engineering Inc. Business Segments
Exhibit 9: ASE Inc. End-User Applications 2012
Exhibit 10: Geographic segmentation for ASE Inc. 2012
Exhibit 11: Revenue Split by Customers for ASE Inc. 2012
Exhibit 12: Amkor Technology Inc. Business segments 2012
Exhibit 13: Geographic Segmentation for Amkor Technology Inc. 2012
Exhibit 14: Revenue Split by Customers for Amkor Technology Inc. 2012
Exhibit 15: Siliconware Precision Industries Co. Ltd Geographic Segmentation 2012
Exhibit 16: Siliconware Precision Industries Co. Ltd Revenue Split by Customer
Exhibit 17: STATS ChipPAC Ltd. Business Segments
Exhibit 18: STATS ChipPAC Ltd. Geographic Segmentation 2012
Exhibit 19: STATS ChipPAC Ltd. End-User Segmentation 201

Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Amkor Technology Inc.
  • Atmel Corp.
  • Broadcom Corp.
  • ChipMOS Technologies Ltd.
  • J-Devices Corp.
  • Powertech Technology Inc.
  • MORE

Commenting on the report, an analyst from the team said: “One of the main trends witnessed in the Global Semiconductor Assembly and Test Services market is the increase in production capacity. As a result of the increasing demand for semiconductor devices worldwide, Semiconductor Assembly and Test Services providers are willing to increase their production capacity to provide services for large orders. Semiconductor Assembly and Test Services providers should be capable of catering to large orders, so that semiconductor manufacturers can outsource their assembly and test services to one Semiconductor Assembly and Test Services provider rather than many. Hence, many Semiconductor Assembly and Test Services providers are enhancing their capacity and the required skilled labor to meet the demand.”

According to the report, one of the main factors driving the market is the increasing number of fabless companies. Fabless companies outsource almost all processes to foundries, which in turn would outsource the assembly and testing requirements to Semiconductor Assembly and Test Services vendors.

Further, the report states that one of the main challenges is the dependency on suppliers. Raw material suppliers in the Global Semiconductor Assembly and Test Services market are under constant pressure to provide their resources on time, mainly because of time-to-market pressure and the cyclical nature of the Semiconductor industry.

The report also includes a discussion of the other vendors operating in this market. The other vendors in the market are Atmel Corp., Broadcom Corp., Cambridge Silicon Radio Ltd., ChipMOS Technologies Ltd., Freescale Semiconductor Inc., JCET-ChangJiang Elec. Tech., J-Devices Corp., Powertech Technology Inc., Qualcomm Inc., and United Test and Assembly Center Ltd. (UTAC).

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Note: Product cover images may vary from those shown

- Advanced Semiconductor Engineering Inc.
- Amkor Technology Inc.
- Siliconware Precision Industries Co. Ltd.
- STATS ChipPAC Ltd.
- Atmel Corp.
- Broadcom Corp.
- Cambridge Silicon Radio Ltd.
- ChipMOS Technologies Ltd.
- Freescale Semiconductor Inc.
- JCET-ChangJiang Elec. Tech.
- J-Devices Corp.
- Powertech Technology Inc.
- Qualcomm Inc.
- and United Test and Assembly Center Ltd. (UTAC).

Note: Product cover images may vary from those shown
Note: Product cover images may vary from those shown

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