Market Research Reports - Research and Markets

Welcome - Register - Login - Help/FAQ - 0 items

Search
Enter keywords, a title or
a report id number below.


	Select a currency for use throughout the site

Search Results

Your Search for 'Computational Materials Engineering. An Introduction to Microstructure Evolution' returned 3 results - Page 1 of 1

Electromigration in Thin Films and Electronic Devices: Materials and Reliability
Woodhead Publishing Ltd, Aug 2011, Pages: 352 - Introduction - Copper microstructure evolution during electromigration - Plasticity and materials degradation mechanisms in copper interconnects - Implications for the reliability of advanced Cu interconnect

Wheel/rail interface handbook
Woodhead Publishing Ltd, Sep 2009, Pages: 856 infrastructure costs related to the wheel-rail interface E Andersson, Royal Institute of Technology (KTH) and J Oberg, Banverket, Sweden Introduction. Track deterioration model. Computational tools and input data

Continuum Damage Mechanics of Materials and Structures
Elsevier Science and Technology, Aug 2002, Pages: 396 . Damage micromechanics modelling of discontinuous reinforced composites. Continuum damage mechanics applied to quasi-brittle materials. An anisotropic damage theory and unilateral effects: applications to

Results:

First -

Prev -

1 -

Next -

Last

For enquiries please call us on:

+353-1-415-1241 (GMT Office Hours)

1-800-526-8630 (US/Canada Toll Free)

1-917-300-0470 (EST Office Hours)