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Search for: "3-D TSV Interconnects - Devices & Systems 2008 Report"

Three-Dimensional Integrated Circuit (3D Ic/Chip) & Through-Silicon Via (Tsv) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology, Products and Applications

3D IC/Chip & TSV Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, LED, Sensor,...

Published:  April 2012
Price:  From

Handbook of 3D Integration, Volume 3. 3D Process Technology

Edited by key figures in 3D integration and written by top authors from high–tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As...

Published:  June 2014
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