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Search for: "3-D TSV Interconnects - Devices & Systems 2008 Report"

Three-Dimensional Integrated Circuit (3D Ic/Chip) & Through-Silicon Via (Tsv) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology, Products and Applications

3D IC/Chip & TSV Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, LED, Sensor,...

Published:  April 2012
Price:  From

Handbook of 3D Integration. Volume 3 - 3D Process Technology

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such,...

Published:  June 2014
Price: 
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